Abstract: The present disclosure provides a touch data processing method, a device and a storage medium.

Abstract: Methods for pre-cleaning substrates having metal and dielectric surfaces are described. A substrate comprising a surface structure with a metal bottom, dielectric sidewalls, and a field of dielectric is exposed to a dual plasma treatment in a processing chamber to remove chemical residual and/or impurities from the metal bottom, the dielectric sidewalls, and/or the field of the dielectric and/or repair surface defects in the dielectric sidewalls and/or the field of the dielectric. The dual plasma treatment comprises a direct plasma and a remote plasma.

Abstract: A method for capping a copper surface on a substrate. In embodiments, the methods include exposing a substrate including a copper surface and a dielectric surface to a cobalt precursor gas and a process gas including a reducing agent to selectively form a first cobalt capping layer over the copper surface while leaving exposed the dielectric surface during a vapor deposition process, wherein a flow rate ratio of process gas to cobalt precursor gas is at least 300:1.

Abstract: Embodiments of the disclosure relate to methods of depositing tungsten. Some embodiments of the disclosure provide methods for depositing tungsten which are performed at relatively low temperatures. Some embodiments of the disclosure provide methods in which the ratio between reactant gasses is controlled. Some embodiments of the disclosure provide selective deposition of tungsten. Some embodiments of the disclosure provide methods for depositing tungsten films at a low temperature with relatively low roughness, stress and impurity levels.

Abstract: Methods and apparatus for forming an interconnect structure, the method including selectively depositing two or more capping layers atop a top surface of a via within a low-k dielectric layer, wherein the two or more capping layers include a first layer of ruthenium and a second layer of cobalt.

Abstract: A display substrate, a display panel and a display apparatus are provided. The display substrate includes a plurality of sub pixel units, the plurality of sub pixel units is arranged in an array, each row or each column of sub pixels includes a first sub pixel and a second sub pixel, a line segment formed by the row of sub pixels has a midpoint in a row direction or a line segment formed by the column of sub pixels has a midpoint in a column direction, the first sub pixel and the second sub pixel are configured for displaying a same color, a distance from the first sub pixel to the midpoint is less than a distance from the second sub pixel to the midpoint and an aperture area of the first sub pixel is greater than that of the second sub pixel.

Abstract: Methods for forming a capping protection structure on a metal line layer formed in an insulating material in an interconnection structure are provided. In one embodiment, a method for forming capping protection on a metal line in an interconnection structure for semiconductor devices includes selectively forming a metal silicide layer on a metal line bounded by a dielectric bulk insulating layer in a back end interconnection structure formed on a substrate in a processing chamber; and forming a dielectric layer on the metal silicide layer.

Abstract: A display apparatus including a backlight module is disclosed. The backlight module includes a back plate and a rubber frame located at a periphery of the back plate. The back plate has a protrusion facing towards the rubber frame. The rubber frame has a snap slot facing towards the back plate. The back plate and the rubber frame are connected to each other through meshing between the protrusion and the snap slot.

Abstract: A display apparatus including a backlight module is disclosed. The backlight module includes a back plate and a rubber frame located at a periphery of the back plate. The back plate has a protrusion facing towards the rubber frame. The rubber frame has a snap slot facing towards the back plate. The back plate and the rubber frame are connected to each other through meshing between the protrusion and the snap slot.

Abstract: Embodiments of the present invention provide an LED lamp strip structure, a backlight module, a liquid crystal display device and a method of controlling the LED lamp strip structure. The LED lamp strip structure comprises: a circuit board; and at least a first LED sequence and a second LED sequence arranged in parallel on the circuit board, the first LED sequence having a plurality of predetermined intervals, and each LED in the second LED sequence corresponding to one of the plurality of predetermined intervals respectively.

Abstract: A display substrate, a display panel and a display apparatus are provided. The display substrate includes a plurality of sub pixel units, the plurality of sub pixel units is arranged in an array, each row or each column of sub pixels includes a first sub pixel and a second sub pixel, a line segment formed by the row of sub pixels has a midpoint in a row direction or a line segment formed by the column of sub pixels has a midpoint in a column direction, the first sub pixel and the second sub pixel are configured for displaying a same color, a distance from the first sub pixel to the midpoint is less than a distance from the second sub pixel to the midpoint and an aperture area of the first sub pixel is greater than that of the second sub pixel.

Abstract: Embodiments of the present invention provide an LED lamp strip structure, a backlight module, a liquid crystal display device and a method of controlling the LED lamp strip structure. The LED lamp strip structure comprises: a circuit board; and at least a first LED sequence and a second LED sequence arranged in parallel on the circuit board, the first LED sequence having a plurality of predetermined intervals, and each LED in the second LED sequence corresponding to one of the plurality of predetermined intervals respectively.