Patents by Inventor Yugang Sun
Yugang Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8754396Abstract: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: GrantFiled: April 6, 2012Date of Patent: June 17, 2014Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Dahl-Young Khang, Yugang Sun, Etienne Menard
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Patent number: 8729524Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: GrantFiled: April 6, 2012Date of Patent: May 20, 2014Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang, Ralph G. Nuzzo, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang
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Publication number: 20140077121Abstract: A generic route for synthesis of asymmetric nanostructures. This approach utilizes submicron magnetic particles (Fe3O4—SiO2) as recyclable solid substrates for the assembly of asymmetric nanostructures and purification of the final product. Importantly, an additional SiO2 layer is employed as a mediation layer to allow for selective modification of target nanoparticles. The partially patched nanoparticles are used as building blocks for different kinds of complex asymmetric nanostructures that cannot be fabricated by conventional approaches. The potential applications such as ultra-sensitive substrates for surface enhanced Raman scattering (SERS) have been included.Type: ApplicationFiled: September 18, 2012Publication date: March 20, 2014Applicant: UChicago Argonne, LLCInventors: Yugang Sun, Yongxing Hu
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Patent number: 8664699Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: GrantFiled: March 13, 2013Date of Patent: March 4, 2014Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
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Patent number: 8440546Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: GrantFiled: May 23, 2011Date of Patent: May 14, 2013Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
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Publication number: 20130100618Abstract: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: ApplicationFiled: April 6, 2012Publication date: April 25, 2013Applicant: The Board of Trustees of the University of IllinoiInventors: John A. ROGERS, Dahi-Young Khang, Yugang Sun, Etienne Menard
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Patent number: 8394706Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: GrantFiled: October 11, 2011Date of Patent: March 12, 2013Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack
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Publication number: 20120327608Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: ApplicationFiled: April 6, 2012Publication date: December 27, 2012Inventors: John A. ROGERS, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanging Jiang, Yonggang Huang, Ralph G. Nuzzo, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang
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Patent number: 8247325Abstract: Metal nanoplates are grown on n-type and p-type semiconductor wafer substrates through galvanic reactions between substantially pure aqueous metal solutions and the substrates. The morphology of the resulting metal nanoplates that protrude from the substrate can be tuned by controlling the concentration of the metal solution and the reaction time of the solution with the semiconductor wafer. Nanoplate size gradually increases with prolonged growth time and the nanoplate thicknesses increases in a unique stepwise fashion due to polymerization and fusion of adjacent nanoplates. Further, the roughness of the nanoplates can also be controlled. In a particular embodiment, Ag nanoplates are grown on a GaAs substrate through reaction with a solution of AgNO3 with the substrate.Type: GrantFiled: October 6, 2009Date of Patent: August 21, 2012Assignee: Uchicago Argonne, LLCInventor: Yugang Sun
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Patent number: 8217381Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: GrantFiled: September 6, 2007Date of Patent: July 10, 2012Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang, Ralph G. Nuzzo, Keon Jae Lee, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang, Seong Jun Kang, Jong Hyun Ahn, Hoon-sik Kim
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Patent number: 8198621Abstract: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: GrantFiled: March 17, 2009Date of Patent: June 12, 2012Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Dahl-Young Khang, Yugang Sun, Etienne Menard
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Publication number: 20120125156Abstract: Methods for producing silver nanostructures with improved dimensional control, yield, purity, monodispersity, and scale of synthesis.Type: ApplicationFiled: February 6, 2012Publication date: May 24, 2012Applicant: THE UNIVERSITY OF WASHINGTONInventors: Younan Xia, Sang-Hyuk Im, Yun Tack Lee, Yugang Sun, Benjamin Wiley
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Publication number: 20120083099Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: ApplicationFiled: October 11, 2011Publication date: April 5, 2012Applicant: The Board of Trustees of the University of IllinoisInventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU, Heung Cho KO, Shawn MACK
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Patent number: 8039847Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: GrantFiled: July 27, 2010Date of Patent: October 18, 2011Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack
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Publication number: 20110220890Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: ApplicationFiled: May 23, 2011Publication date: September 15, 2011Applicant: The Board of Trustees of the University of IllinoisInventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
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Patent number: 7982296Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: GrantFiled: September 22, 2009Date of Patent: July 19, 2011Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
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Patent number: 7943491Abstract: The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.Type: GrantFiled: June 9, 2006Date of Patent: May 17, 2011Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
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Publication number: 20100289124Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: ApplicationFiled: July 27, 2010Publication date: November 18, 2010Applicant: The Board of Trustees of the University of IllinoisInventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU, Heung Cho KO, Shawn MACK
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Patent number: 7818993Abstract: Single-walled carbon nanotubes (SWNTs) are decorated with metal nanoparticles to form high-performance flexible hydrogen sensors. The special process to form the high-performance flexible hydrogen sensors can combine a dry transfer printing technique and modification of SWNTs with palladium (Pd) nanoparticles to provide high-performance hydrogen sensors with excellent mechanical flexibility on plastic substrates. Two approaches can be used to decorate the SWNTs. One is physical deposition, such as electron beam evaporation (EBE) and the other is electrochemical deposition which can selectively grow palladium nanoparticles on the surface of the SWNTs, resulting in significantly decreasing the use of palladium. Preferably, the Pd nanoparticles are deposed on the SWNTs in a discontinuous arrangement so that the Pd nanoparticles are spaced away from each other to form individual discontinuous Pd nanoparticles rather a continuous Pd film.Type: GrantFiled: September 27, 2007Date of Patent: October 26, 2010Assignee: UChicago Argonne, LLCInventors: Yugang Sun, Hsien-Hau Wang
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Patent number: 7799699Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: GrantFiled: June 1, 2006Date of Patent: September 21, 2010Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack