Abstract: A method of manufacturing a light-emitting device includes providing a case including a recessed portion and mounting a light-emitting element on a bottom of the recessed portion, putting a first sealing material including a first phosphor particle into the recessed portion, putting a second sealing material including a second phosphor particle on the first sealing material in the recessed portion, and precipitating the second phosphor particle before the second sealing material cures. The second phosphor particle is located above the first phosphor particle after the first and second sealing materials cure.

Abstract: A method of manufacturing a light-emitting device includes providing a resin sheet that includes a lattice-patterned reflective material-containing portion and film-shaped phosphor-containing portions covering lattice openings of the reflective material-containing portion, placing the resin sheet on a substrate mounting a plurality of light-emitting elements such that each of the plurality of light-emitting elements is surrounded by the reflective material-containing portion and is covered on the top with the phosphor-containing portion, after placing the resin sheet on the substrate, softening the resin sheet by heating such that the phosphor-containing portions are adhered to the respective upper surfaces of the plurality of light-emitting elements and the reflective material-containing portion or the phosphor-containing portions is/are adhered to the side surfaces of the plurality of light-emitting elements, and curing the resin sheet and then cutting the substrate and the resin sheet to singulate individu

Abstract: A method of manufacturing a light emitting device, includes: temporarily connecting light emitting elements to a wiring layer through connection members, the wiring layer being formed on a mounting board provided with reflectors; contacting a pressing surface of a press-bonding jig with upper surfaces of the light emitting elements and pressing the light emitting elements toward the mounting board while being heated at the same time to deform the connection members and to contact the pressing surface with tops of the reflectors; and connecting the light emitting elements to the wiring layer in a flip chip manner, wherein when the light emitting elements are temporarily connected to the wiring layer, a sum of height of a light emitting element of the light emitting elements and a connection member of the connection members is set to be larger than a height of a reflector of the reflectors.

Abstract: A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Abstract: A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Abstract: A emitting device includes: an LED chip mounted on a substrate; and a sealing layer that encloses the LED chip, wherein: the sealing layer is a single layer having a thickness of from 0.1 mm to 1.0 mm and a maximum width of from 6.0 mm to 20 mm; and the sealing layer is composed of a methylsilicone composition and the mole percentage (mol %) X of Si—CH3 in the methylsilicone composition is more than 90 and less than 100.

Abstract: A method of manufacturing a light emitting device, includes: temporarily connecting light emitting elements to a wiring layer through connection members, the wiring layer being formed on a mounting board provided with reflectors; contacting a pressing surface of a press-bonding jig with upper surfaces of the light emitting elements and pressing the light emitting elements toward the mounting board while being heated at the same time to deform the connection members and to contact the pressing surface with tops of the reflectors; and connecting the light emitting elements to the wiring layer in a flip chip manner, wherein when the light emitting elements are temporarily connected to the wiring layer, a sum of height of a light emitting element of the light emitting elements and a connection member of the connection members is set to be larger than a height of a reflector of the reflectors.

Abstract: A light-emitting device includes a light-emitting element, a sealing material for sealing the light-emitting element, a phosphor particle having an average particle size of not more than 20 nm and dispersed in the sealing material, a dispersed particle dispersed in the sealing material and forming a three-dimensional network structure in the sealing material, and a light-scattering particle dispersed in the sealing material, having an average particle size greater than that of the phosphor particle and that of the dispersed particle, and having a refractive index greater than that of the sealing material. A concentration gradient of the phosphor particle in a height direction is formed such that a concentration thereof increases according as a position thereof decreases. An average position of the phosphor particle is lower than that of the light-scattering particle.

Abstract: A method of manufacturing a light-emitting device includes providing a resin sheet that includes a lattice-patterned reflective material-containing portion and film-shaped phosphor-containing portions covering lattice openings of the reflective material-containing portion, placing the resin sheet on a substrate mounting a plurality of light-emitting elements such that each of the plurality of light-emitting elements is surrounded by the reflective material-containing portion and is covered on the top with the phosphor-containing portion, after placing the resin sheet on the substrate, softening the resin sheet by heating such that the phosphor-containing portions are adhered to the respective upper surfaces of the plurality of light-emitting elements and the reflective material-containing portion or the phosphor-containing portions is/are adhered to the side surfaces of the plurality of light-emitting elements, and curing the resin sheet and then cutting the substrate and the resin sheet to singulate individu

Abstract: A emitting device includes: an LED chip mounted on a substrate; and a sealing layer that encloses the LED chip, wherein: the sealing layer is a single layer having a thickness of from 0.1 mm to 1.0 mm and a maximum width of from 6.0 mm to 20 mm; and the sealing layer is composed of a methylsilicone composition and the mole percentage (mol %) X of Si—CH3 in the methylsilicone composition is more than 90 and less than 100.

Abstract: A method of manufacturing a light-emitting device includes providing a case including a recessed portion and mounting a light-emitting element on a bottom of the recessed portion, putting a first sealing material including a first phosphor particle into the recessed portion, putting a second sealing material including a second phosphor particle on the first sealing material in the recessed portion, and precipitating the second phosphor particle before the second sealing material cures. The second phosphor particle is located above the first phosphor particle after the first and second sealing materials cure.

Abstract: A light-emitting device includes a light-emitting element, a sealing material for sealing the light-emitting element, a phosphor particle having an average particle size of not more than 20 nm and dispersed in the sealing material, a dispersed particle dispersed in the sealing material and forming a three-dimensional network structure in the sealing material, and a light-scattering particle dispersed in the sealing material, having an average particle size greater than that of the phosphor particle and that of the dispersed particle, and having a refractive index greater than that of the sealing material. A concentration gradient of the phosphor particle in a height direction is formed such that a concentration thereof increases according as a position thereof decreases. An average position of the phosphor particle is lower than that of the light-scattering particle.

Abstract: A linear light source device comprises a wiring substrate in a rectangular shape and having a wiring pattern formed thereon, a plurality of light emitting elements arranged on the wiring substrate in a longitudinal direction of the wiring substrate and connected with the wiring pattern on the wiring substrate, and a sealing resin that seals the light emitting elements, wherein the linear light source device is to be arranged on a side surface of a light guiding plate to form a planar light source device, and an external connection terminal is arranged on a surface of the wiring substrate that is opposite to a surface of the wiring substrate where the light emitting element are arranged and in a central portion in the longitudinal direction of the wiring substrate, and connected with the wiring pattern.

Abstract: A light-emitting device includes a substrate, and a plurality of light-emitting elements that are mounted on the substrate and each include an LED chip and a phosphor layer on a surface thereof. A maximum deviation in a value of a chromaticity coordinate x of light emitted from the plurality of light-emitting elements is not less than 0.0125.

Abstract: A light-emitting device includes a case including a recessed portion, a lead frame that is integrally molded with the case so as to be exposed on a bottom of the recessed portion and that includes separated first and second regions, a conductive paste film formed on the bottom of the recessed portion in a region between the first and second regions, a first flip-chip light-emitting element including first and second electrodes that are electrically connected to the first region and the conductive paste film, respectively, and a second flip-chip light-emitting element including third and fourth electrodes that are electrically connected to the second region and the conductive paste film, respectively.

Abstract: A linear light source includes a plurality of LED chips that are linearly arranged along a first direction, and a reflector including a first tapered sidewall sandwiching the LED chips in the first direction and a second tapered sidewall sandwiching the LED chips in a second direction intersecting with the first direction. The LED chips are surrounded by first tapered sidewall and second tapered sidewall, and the second tapered sidewall is lower than the first tapered sidewall.

Abstract: A linear light source device comprises a wiring substrate in a rectangular shape and a wiring pattern formed thereon, a plurality of light emitting elements arranged on the wiring substrate in a longitudinal direction of the wiring substrate and connected with the wiring pattern on the wiring substrate, reflectors, each of which includes two parts having slope surfaces on one side and the other side facing each other in the longitudinal direction of each light emitting element, and which are separated from each other on the wiring substrate corresponding to the light emitting elements, respectively; and a sealing resin sealing the light emitting elements by burying a recession portion defined by a surface of the wiring substrate where the light emitting elements are arranged and the two slope surfaces, wherein the two parts of each of reflectors have convex portions on their upper surfaces, respectively.

Abstract: A linear light source includes a plurality of LED chips that are linearly arranged along a first direction, and a reflector including a first tapered sidewall sandwiching the LED chips in the first direction and a second tapered sidewall sandwiching the LED chips in a second direction intersecting with the first direction. The LED chips are surrounded by first tapered sidewall and second tapered sidewall, and the second tapered sidewall is lower than the first tapered sidewall.

Abstract: A linear light source device comprises a wiring substrate in a rectangular shape and having a wiring pattern formed thereon, a plurality of light emitting elements arranged on the wiring substrate in a longitudinal direction of the wiring substrate and connected with the wiring pattern on the wiring substrate, and a sealing resin that seals the light emitting elements, wherein the linear light source device is to be arranged on a side surface of a light guiding plate to form a planar light source device, and an external connection terminal is arranged on a surface of the wiring substrate that is opposite to a surface of the wiring substrate where the light emitting element are arranged and in a central portion in the longitudinal direction of the wiring substrate, and connected with the wiring pattern.