Patents by Inventor Yuhki Ito

Yuhki Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130070481
    Abstract: The present invention provides a linear light source apparatus in which warpage is suppressed. The linear light source apparatus includes an elongated rectangular wiring substrate; a plurality of light-emitting devices which are aligned on an imaginary straight line on the wiring substrate; reflectors provided on the wiring substrate such that each reflector corresponds to one light-emitting device; a sealing resin portion which seals each of the light-emitting devices; and a fluorescent material sheet provided on the reflectors. Since the fluorescent material sheet is provided so as to cover the reflectors, stress applied to the wiring substrate, which is caused by thermal shrinkage of the sealing resin portion, can be relaxed, warpage of the linear light source apparatus can be prevented, and color unevenness can be suppressed in light emitted from the linear light source apparatus.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 21, 2013
    Applicant: Toyoda Gosei Co., Ltd.
    Inventor: Yuhki ITO
  • Publication number: 20130070479
    Abstract: A linear light source device comprises a wiring substrate in a rectangular shape and a wiring pattern formed thereon, a plurality of light emitting elements arranged on the wiring substrate in a longitudinal direction of the wiring substrate and connected with the wiring pattern on the wiring substrate, reflectors, each of which includes two parts having slope surfaces on one side and the other side facing each other in the longitudinal direction of each light emitting element, and which are separated from each other on the wiring substrate corresponding to the light emitting elements, respectively; and a sealing resin sealing the light emitting elements by burying a recession portion defined by a surface of the wiring substrate where the light emitting elements are arranged and the two slope surfaces, wherein the two parts of each of reflectors have convex portions on their upper surfaces, respectively.
    Type: Application
    Filed: July 16, 2012
    Publication date: March 21, 2013
    Applicant: Toyoda Gosei Co., Ltd.
    Inventor: Yuhki ITO
  • Patent number: 8174043
    Abstract: In a light-emitting apparatus using a silicone resin as a sealant of its light-emitting element, it is intended to prevent discoloration of its lead frame. A light-emitting element fixed to a lead frame is sealed with a sealed portion formed by a silicone resin. An average spin-spin relaxation time of the silicone resin is equal to or smaller than 100 microseconds at 25° C. at a resonance frequency of 25 MHz.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: May 8, 2012
    Assignee: Toyoda Gosei Co., Ltd.
    Inventor: Yuhki Ito
  • Patent number: 8138661
    Abstract: In a side surface light emitting type light emitting device mounted on the surface of a wiring board, the light emitting device comprises: a base body part having a reflecting case and a terminal holding part formed integrally with the reflecting case in the rear part of the reflecting case; and lead members inserted into the base body part, having a pair of connecting parts including base parts of the connecting parts drawn out from the lower surface of the base body part and bent along the lower surface and side bending parts provided in the base parts of the connecting parts and bent along the side surfaces of the terminal holding part and connected to a pattern of the wiring board; and is characterized in that the base parts of the connecting parts are provided with protruding parts protruding toward the center of the lower surface of the terminal holding part and cut-out parts are provided for accommodating the protruding parts in the lower surface of the terminal holding part.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: March 20, 2012
    Assignees: Toyoda Gosei Co., Ltd., Panasonic Corporation
    Inventors: Hideki Kokubu, Toshimasa Hayashi, Yuhki Ito, Michio Miyawaki
  • Publication number: 20090309121
    Abstract: In a light-emitting apparatus using a silicone resin as a sealant of its light-emitting element, it is intended to prevent discoloration of its lead frame. A light-emitting element fixed to a lead frame is sealed with a sealed portion formed by a silicone resin. An average spin-spin relaxation time of the silicone resin is equal to or smaller than 100 microseconds at 25° C. at a resonance frequency of 25 MHz.
    Type: Application
    Filed: August 21, 2009
    Publication date: December 17, 2009
    Applicant: TOYODA GOSEI CO., LTD
    Inventor: Yuhki Ito
  • Publication number: 20090167142
    Abstract: In a side surface light emitting type light emitting device mounted on the surface of a wiring board, the light emitting device comprises: a base body part having a reflecting case and a terminal holding part formed integrally with the reflecting case in the rear part of the reflecting case; and lead members inserted into the base body part, having a pair of connecting parts including base parts of the connecting parts drawn out from the lower surface of the base body part and bent along the lower surface and side bending parts provided in the base parts of the connecting parts and bent along the side surfaces of the terminal holding part and connected to a pattern of the wiring board; and is characterized in that the base parts of the connecting parts are provided with protruding parts protruding toward the center of the lower surface of the terminal holding part and cut-out parts are provided for accommodating the protruding parts in the lower surface of the terminal holding part.
    Type: Application
    Filed: December 24, 2008
    Publication date: July 2, 2009
    Applicants: TOYODA GOSEI CO., LTD., Panasonic Corporation
    Inventors: Hideki Kokubu, Toshimasa Hayashi, Yuhki Ito, Michio Miyawaki