Abstract: A hard disk drive head slider housing a read-write transducer includes a plurality of electrical connection pads, where each electrical pad includes an interconnection portion configured for electrically connecting to an interconnected component, such as a lead suspension, a probe contact portion configured for electrical testing the head slider, and at least one slit positioned between the interconnection portion and the probe contact portion, thereby physically distinguishing and separating the two portions of a multiple-portion pad to inhibit undesirable solder flow to the wider probe contact portion on the slider side of each pad. A more controlled solder joint is provided, while the probe contact portion can remain relatively wide for probe contact and the interconnection portion can remain relatively narrow to reduce solder bridges among the pads.

Abstract: A hard disk drive head slider housing a read-write transducer includes a plurality of electrical connection pads, where each electrical pad includes an interconnection portion configured for electrically connecting to an interconnected component, such as a lead suspension, a probe contact portion configured for electrical testing the head slider, and at least one slit positioned between the interconnection portion and the probe contact portion, thereby physically distinguishing and separating the two portions of a multiple-portion pad to inhibit undesirable solder flow to the wider probe contact portion on the slider side of each pad. A more controlled solder joint is provided, while the probe contact portion can remain relatively wide for probe contact and the interconnection portion can remain relatively narrow to reduce solder bridges among the pads.

Abstract: A hard disk drive suspension assembly includes a pad base layer, a pad-end fixing layer, and a plurality of electrical pads each comprising a conductive layer on the pad base layer, where the base layer extends to the fixing layer, to which a distal end of the base layer is fixed. This configuration inhibits the delamination or deformation of the end edge of each pad. An additional cover layer may be implemented to cover the distal end of the conductive layer(s), further inhibiting deformation of the pads. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.

Abstract: Approaches to pre-forming solder bumps, such as for use in electrically connecting a head slider and a suspension assembly for a hard disk drive, involves applying a height stabilizer plate over a shared solder paste applied over a substrate housing electrode pads, and reflowing the solder paste with the plate applied to create solder bumps electrically coupled to the pads. Use of such a plate functions to stabilize and contain the solder paste and create uniform solder bumps across the series of pads, where the plate may be composed of a heat-resistant and anti-solder-wetting material. The solder bump pre-forming techniques generally enable solder bonding of extremely small electrical interconnection pads.

Abstract: Disclosed herein is a magnetic storage device that comprises a suspension arm co-movably fixed to a carriage arm. The suspension arm comprises a slider attachment side and at least one first electrical contact pad on the slider attachment side. The suspension arm also comprises a slider co-movably fixed to the suspension arm. The slider comprises a suspension attachment side, a non-head side facing the suspension arm and intersecting the suspension attachment side at a first slider edge of the slider, a head side facing away from the suspension arm, and at least one electrical contact component on the suspension attachment side up to the first slider edge. At least one solder weldment is directly coupled to the at least one first electrical contact pad and the at least one electrical contact component. Additionally, a read-write head is coupled to the head side of the slider.

Abstract: Disclosed herein is a magnetic storage device that comprises a suspension arm co-movably fixed to a carriage arm. The suspension arm comprises a slider attachment side and at least one first electrical contact pad on the slider attachment side. The suspension arm also comprises a slider co-movably fixed to the suspension arm. The slider comprises a suspension attachment side, a non-head side facing the suspension arm and intersecting the suspension attachment side at a first slider edge of the slider, a head side facing away from the suspension arm, and at least one electrical contact component on the suspension attachment side up to the first slider edge. At least one solder weldment is directly coupled to the at least one first electrical contact pad and the at least one electrical contact component. Additionally, a read-write head is coupled to the head side of the slider.

Abstract: Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.

Abstract: Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.

Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

Abstract: A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

Abstract: A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

Abstract: Embodiments of the present invention provide a magnetic slider of which terminals have a sufficiently large process margin for the laser condition in the SBB process. According to one embodiment, a magnetic slider comprises: a read element and a write element; plural wiring lines which are connected to the read element and the write element; a protective film which covers the read element, the write element and the plural-wiring lines; plural slider pads formed on the protective film; and plural studs which respectively connect the slider pads and the wiring lines and are covered by the protective film, wherein each of the slider pads comprises a chromium film, a nickel iron film and a gold film, the nickel iron film is formed between the chromium film and the gold film, and the chromium film is formed between the nickel iron film and one of the studs and is in contact with the protective film.

Abstract: Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.

Abstract: A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.

Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.

Abstract: Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

Abstract: Embodiments of the present invention help to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. In an embodiment of the present invention, inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.

Abstract: Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.

Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2?4S.

Abstract: Embodiments of the present invention provide a magnetic slider of which terminals have a sufficiently large process margin for the laser condition in the SBB process. According to one embodiment, a magnetic slider comprises: a read element and a write element; plural wiring lines which are connected to the read element and the write element; a protective film which covers the read element, the write element and the plural-wiring lines; plural slider pads formed on the protective film; and plural studs which respectively connect the slider pads and the wiring lines and are covered by the protective film, wherein each of the slider pads comprises a chromium film, a nickel iron film and a gold film, the nickel iron film is formed between the chromium film and the gold film, and the chromium film is formed between the nickel iron film and one of the studs and is in contact with the protective film.