Patents by Inventor Yuhsuke Matsumoto

Yuhsuke Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6628380
    Abstract: A jig for inspecting the appearance of small parts with an optical microscope, the jig is equipped with a base, having an upper flat surface which becomes a mounting stage of the optical microscope, and is also provided with a member for moving the upper flat surface at least in a direction approximately parallel to a direction of an optical axis of an objective lens of the optical microscope in order to focus the optical microscope on an inspection portion of the small parts mounted on the upper flat surface. The jig is also equipped with an inspection-object supporting portion, provided with a member for supporting the small parts at the predetermined portion on the base. Furthermore, the jig is equipped with reflecting mirrors which have a mirrorlike surface with an inclined angle of approximately 45 degrees to the upper flat surface of the base.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: September 30, 2003
    Assignee: International Business Machines Corporation
    Inventors: Masashi Fujimori, Kenji Itoh, Toru Koike, Yuhsuke Matsumoto, Seiji Nakagawa, Tatsumi Tsuchiya, Tatsushi Yoshida
  • Publication number: 20030070834
    Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
    Type: Application
    Filed: September 26, 2002
    Publication date: April 17, 2003
    Applicant: International Business Machines Corporation
    Inventors: Tatsumi Tsuchiya, Yuhsuke Matsumoto, Takaaki Murokawa, Naoki Fujii, Takuya Satoh, Yasuhiro Mita, Hiroyasu Tsuchida, Yoshio Uematsu