Patents by Inventor Yu-Hua Lee
Yu-Hua Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990381Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.Type: GrantFiled: November 14, 2022Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Po-Yuan Teng, Chen-Hua Yu
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Patent number: 11985904Abstract: A method of manufacturing a semiconductor device includes: providing a substrate, the substrate defining a logic region and a memory region; depositing a bottom electrode layer across the logic region and the memory region; depositing a magnetic tunnel junction (MTJ) layer over the bottom electrode layer; depositing a first conductive layer over the MTJ layer; depositing a sacrificial layer over the first conductive layer; etching the sacrificial layer in the memory region to expose the first conductive layer in the memory region while keeping the first conductive layer in the logic region covered; depositing a second conductive layer in the memory region and the logic region; patterning the second conductive layer to expose the MTJ layer in the memory region; and etching the patterned second conductive layer and the MTJ layer to form a top electrode and an MTJ, respectively, in the memory region.Type: GrantFiled: February 5, 2021Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Jen Chien, Jung-Tang Wu, Szu-Hua Wu, Chin-Szu Lee, Meng-Yu Wu
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Publication number: 20240111790Abstract: Techniques are provided for optimizing storage of database records in segments using sub-segments. A base segment is a container used for storing records that belong to a database object. A database management system receives a request to load, into the database object, a first set of records that are in a first state. In response to receiving the request, the system generates a new sub-segment, which is a container that is separate from the base segment. The system stores the first set of records, in their first state, within the sub-segment. The system then monitors one or more characteristics of the database system. In response to the one or more characteristics satisfying criteria, the system performs a migration of one or more records of the first set of records from the sub-segment to the base segment. During the migration, the system converts the one or more records from the first state to a second state and stores the one or more records, in their second state, in the base segment.Type: ApplicationFiled: September 26, 2023Publication date: April 4, 2024Inventors: Teck Hua Lee, Hariharan Lakshmanan, Sujatha Muthulingam, Andrew Witkowski, Shasank Kisan Chavan, You Jung Kim, Sooyeon Jo, Yu Chieh Fu, Vicente Hernandez Jimenez, Tirthankar Lahiri
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Patent number: 11950491Abstract: A semiconductor mixed material comprises an electron donor, a first electron acceptor and a second electron acceptor. The first electron donor is a conjugated polymer. The energy gap of the first electron acceptor is less than 1.4 eV. At least one of the molecular stackability, ?-?*stackability, and crystallinity of the second electron acceptor is smaller than the first electron acceptor. The electron donor system is configured to be a matrix to blend the first electron acceptor and the second electron acceptor. The present invention also provides an organic electronic device including the semiconductor mixed material.Type: GrantFiled: November 17, 2020Date of Patent: April 2, 2024Assignee: RAYNERGY TEK INCORPORATIONInventors: Yi-Ming Chang, Chuang-Yi Liao, Wei-Long Li, Yu-Tang Hsiao, Chun-Chieh Lee, Chia-Hua Li, Huei-Shuan Tan
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Publication number: 20110288116Abstract: The present invention describes compounds of the following formula: processes for their preparation, pharmaceutical compositions containing them, and their use in therapy. The compounds of the present invention inhibit IAPs (inhibitors of apoptosis proteins) and thus are useful in the treatment of cancer, autoimmune diseases and other disorders where a defect in apoptosis is implicated.Type: ApplicationFiled: January 15, 2009Publication date: November 24, 2011Applicant: TETRALOGIC PHARMACEUITCAL CORPORATIONInventors: Stephen M. Condon, Matthew G. Laporte, Yijun Deng, Susan Rippin, Yu-Hua Lee, Thomas Haimowitz
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Patent number: 7482278Abstract: A new method of depositing PE-oxide or PE-TEOS. An HDP-oxide is provided over a pattern of polysilicon. An etch back is performed to the deposited HDP-oxide, a layer of plasma-enhanced SiN is deposited. This PE-SiN is etched back leaving SiN spacers on the sidewalls of the poly pattern, further leaving a deposition of HDP-oxide on the top surface of the poly pattern. The profile of the holes within the poly pattern in such that the final layer of PE-oxide or PE-TEOS is deposited without resulting in the formation of keyholes in this latter layer.Type: GrantFiled: February 11, 1999Date of Patent: January 27, 2009Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tze-Liang Ying, James (Cheng-Ming) Wu, Yu-Hua Lee, Wen-Chuan Chiang
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Patent number: 7160811Abstract: A method for fabricating a microelectronic fabrication employs an undoped silicate glass layer as an etch stop layer when etching a doped silicate glass layer with an anhydrous hydrofluoric acid etchant. The method is particularly useful for forming a patterned salicide blocking dielectric layer when fabricating a complementary metal oxide semiconductor device.Type: GrantFiled: October 22, 2002Date of Patent: January 9, 2007Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yen-Ming Chen, Huan-Chi Tseng, Yu-Hua Lee, Dian-Hau Chen, Chia-Hung Lai, Kang-Min Kuo
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Publication number: 20060194426Abstract: A method for manufacturing a dual damascene structure, which forms a trench first, is described. The manufacturing method has following steps. First, a substrate with a plurality of semiconductor devices is provided. A first metal layer, a first etching stop layer, a dielectric layer, and a second etching stop layer are subsequently formed thereon. A trench is formed in the dielectric layer at a predetermined depth thereafter, and a sacrificial layer is filled therein and is next planarized. Then a photoresist layer is formed thereon for etching a via. Afterward the photoresist layer and the sacrificial layer are both removed. Following that, the first etching stop layer is etched through to expose the first metal layer. Finally, the via and the trench are filled with a second metal layer.Type: ApplicationFiled: April 11, 2006Publication date: August 31, 2006Inventors: Chin-Tien Yang, Juan-Jann Jou, Yu-Hua Lee, Chia-Hung Lai
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Patent number: 7056821Abstract: A method for manufacturing a dual damascene structure, which forms a trench first, is described. The manufacturing method has following steps. First, a substrate with a plurality of semiconductor devices is provided. A first metal layer, a first etching stop layer, a dielectric layer, and a second etching stop layer are subsequently formed thereon. A trench is formed in the dielectric layer at a predetermined depth thereafter, and a sacrificial layer is filled therein and is next planarized. Then a photoresist layer is formed thereon for etching a via. Afterward the photoresist layer and the sacrificial layer are both removed. Following that, the first etching stop layer is etched through to expose the first metal layer. Finally, the via and the trench are filled with a second metal layer.Type: GrantFiled: August 17, 2004Date of Patent: June 6, 2006Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chin-Tien Yang, Juan-Jann Jou, Yu-Hua Lee, Chia-Hung Lai
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Patent number: 7015129Abstract: A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subsequent wire bonding processes or flip-chip packaging processes.Type: GrantFiled: November 29, 2004Date of Patent: March 21, 2006Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hung Lai, Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Huan-Chi Tseng, Yu-Hua Lee, Chin-Tien Yang
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Publication number: 20060040498Abstract: A method for manufacturing a dual damascene structure, which forms a trench first, is described. The manufacturing method has following steps. First, a substrate with a plurality of semiconductor devices is provided. A first metal layer, a first etching stop layer, a dielectric layer, and a second etching stop layer are subsequently formed thereon. A trench is formed in the dielectric layer at a predetermined depth thereafter, and a sacrificial layer is filled therein and is next planarized. Then a photoresist layer is formed thereon for etching a via. Afterward the photoresist layer and the sacrificial layer are both removed. Following that, the first etching stop layer is etched through to expose the first metal layer. Finally, the via and the trench are filled with a second metal layer.Type: ApplicationFiled: August 17, 2004Publication date: February 23, 2006Inventors: Chin-Tien Yang, Juan-Jann Jou, Yu-Hua Lee, Chia-Hung Lai
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Patent number: 6956254Abstract: A dual bit ROM multilayered structure with improved write and erase functions and a method of manufacturing is disclosed. The structure includes a pair of floating gates at the middle or nitride layer to better define the two locations of electrons representing the dual data bits collected in the middle layer.Type: GrantFiled: December 1, 2003Date of Patent: October 18, 2005Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chin-Tien Yang, Mu-Yi Lin, Yu-Wei Tseng, Min Ca, Yu-Hua Lee
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Publication number: 20050173799Abstract: A method of fabricating an interconnect structure, including providing a semiconductor substrate having a first conductive layer thereon, and forming a dielectric layer overlying the semiconductor substrate and the first conductive layer. An opening is formed in the dielectric layer extending to the first conductive layer. A portion of the first conductive layer is removed through the opening to form a recess having a substantially curvilinear profile. The opening and the recess are filled with a second conductive layer.Type: ApplicationFiled: February 5, 2004Publication date: August 11, 2005Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Juan-Jann Jou, Yu-Hua Lee, Chin-Tien Yang, Chia-Hung Lai, Connie Hsu, Mu-Yi Lin, Min Cao, Chia-Yu Ku, Yuh-Da Fan
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Publication number: 20050116281Abstract: A dual bit ROM multilayered structure with improved write and erase functions and a method of manufacturing is disclosed. The structure includes a pair of floating gates at the middle or nitride layer to better define the two locations of electrons representing the dual data bits collected in the middle layer.Type: ApplicationFiled: December 1, 2003Publication date: June 2, 2005Inventors: Chin-Tien Yang, Mu-Yi Lin, Yu-Wei Tseng, Min Cao, Yu-Hua Lee
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Publication number: 20050095836Abstract: A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subsequent wire bonding processes or flip-chip packaging processes.Type: ApplicationFiled: November 29, 2004Publication date: May 5, 2005Inventors: Chia-Hung Lai, Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Huan-Chi Tseng, Yu-Hua Lee, Chin-Tien Yang
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Patent number: 6844626Abstract: A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subsequent wire bonding processes or flip-chip packaging processes.Type: GrantFiled: May 23, 2003Date of Patent: January 18, 2005Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hung Lai, Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Huan-Chi Tseng, Yu-Hua Lee, Chin-Tien Yang
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Publication number: 20040235223Abstract: A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subsequent wire bonding processes or flip-chip packaging processes.Type: ApplicationFiled: May 23, 2003Publication date: November 25, 2004Inventors: Chia-Hung Lai, Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Huan-Chi Tseng, Yu-Hua Lee, Chin-Tien Yang
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Publication number: 20040074872Abstract: A method for fabricating a microelectronic fabrication employs an undoped silicate glass layer as an etch stop layer when etching a doped silicate glass layer with an anhydrous hydrofluoric acid etchant. The method is particularly useful for forming a patterned salicide blocking dielectric layer when fabricating a complementary metal oxide semiconductor device.Type: ApplicationFiled: October 22, 2002Publication date: April 22, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yen-Ming Chen, Huan-Chi Tseng, Yu-Hua Lee, Dian-Hau Chen, Chia-Hung Lai, Kang-Min Kuo
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Patent number: 6600228Abstract: A planarized surface of a photoresist layer is formed above a layer formed over a hole in a blanket, conformal, silicon nitride layer which in turn is formed above a keyhole in metallization with SOG layers therebetween on the surface of a semiconductor device. A blanket, first photoresist layer was formed above the blanket silicon nitride to fill the damage to the surface caused by the hole. Then the first photoresist layer was stripped leaving a residual portion of the first photoresist layer filling the hole. Next, a blanket, second photoresist layer was formed above the blanket layer. The hole has a neck with a width from about 200 Å to about 500 Å and the hole has a deep, pocket-like gap with a cross-section with a width from about 500 Å to about 1200 Å below the narrow neck.Type: GrantFiled: August 15, 2001Date of Patent: July 29, 2003Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Yu-Hua Lee, Min-Hsiung Chiang, Jenn Ming Huang
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Patent number: 6586162Abstract: A method of using resist planarization to prepare for silicidation while protecting silicon nitride spacers in the fabrication of integrated circuits is described. Field oxide areas are formed on a semiconductor substrate surrounding and electrically isolating a logic device area and a memory device area. Polysilicon gate electrodes having silicon nitride sidewall spacers and associated source/drain regions are formed in the device areas. A silicon oxide layer is deposited overlying the gate electrodes and source/drain regions. The silicon oxide layer is covered with a photoresist layer. The photoresist layer is developed until the silicon oxide layer overlying the gate electrodes is exposed and the photoresist layer is below the tops of the gate electrodes. The exposed silicon oxide layer is etched away whereby the tops of the gate electrodes are exposed and wherein the silicon nitride spacers are undamaged by the etching. All of the silicon oxide layer in the logic device area is etched away.Type: GrantFiled: December 1, 2000Date of Patent: July 1, 2003Assignee: Taiwan Semiconductor Manufacturing CompanyInventor: Yu-Hua Lee