Patents by Inventor Yuichi Nagai
Yuichi Nagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240109474Abstract: A light distribution control device, if a first upper limit number N1?the number of near-distance targets T1, controls a lamp to irradiate the near-distance targets with light having illuminance according to attributes of the near-distance targets; if a remaining number M?the number of long-distance targets T2, controls the lamp to irradiate the long-distance targets with light having illuminance according to attributes of the long-distance targets; if N1<T1, controls the lamp to form a light distribution pattern that does not depend on the near-distance targets and the long-distance targets; and, if M<T2, controls the lamp to form a light distribution pattern that does not depend on the long-distance targets.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Applicant: KOITO MANUFACTURING CO., LTD.Inventors: Hirohiko OSHIO, Yuichi WATANO, Takashi TERAYAMA, Hikaru NAGAI
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Patent number: 11643188Abstract: An aircraft includes a plurality of control targets, avionics devices and a control switch unit. The control targets each includes a power line communication unit configured to perform communication via a power line. The avionics devices are respectively connected with the control targets via exclusive-use signal lines. The avionics devices are configured to control the control targets via the signal lines. The avionics devices each includes a PLC unit configured to perform communication via the power line. The control switch unit is configured to, when an abnormality occurs in any of the avionics devices, cause another one of the avionics devices to control the control target which has been controlled by the any of the avionics devices, via the power line.Type: GrantFiled: January 7, 2019Date of Patent: May 9, 2023Assignee: SUBARU CORPORATIONInventors: Kei Suzuki, Iwao Murata, Yuichi Nagai
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Publication number: 20230095767Abstract: Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.Type: ApplicationFiled: September 7, 2022Publication date: March 30, 2023Applicant: TDK CorporationInventors: Yuichi NAGAI, Natsumi KATO, Akitoshi YOSHII, Ken MORITA, Takehisa TAMURA, Atsushi TAKEDA
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Patent number: 11409282Abstract: A control system for a movable body is mountable on the movable body. The control system includes controllers and a detector. The controllers are configured to control functional systems of the movable body. The detector is configured to detect a movement situation of the movable body. Priorities corresponding to movement situations of the movable body are in advance assigned to each of the plurality of functional systems. When at least one of the plurality of controllers malfunctions, control resources of normal controllers, among the plurality of controllers, which do not malfunction are preferentially distributed to one or more of the functional systems having a high priority according to the movement situation of the movable body at that time.Type: GrantFiled: January 7, 2019Date of Patent: August 9, 2022Assignee: SUBARU CORPORATIONInventors: Kei Suzuki, Masahito Hayakawa, Masato Ogura, Yuichi Nagai
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Patent number: 11335505Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.Type: GrantFiled: December 23, 2019Date of Patent: May 17, 2022Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
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Patent number: 11328866Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (?m) and a minimum thickness of the second region is T2 (?m), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1?0.26.Type: GrantFiled: March 16, 2020Date of Patent: May 10, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
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Patent number: 11289271Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.Type: GrantFiled: August 6, 2020Date of Patent: March 29, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
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Patent number: 11264171Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.Type: GrantFiled: August 6, 2020Date of Patent: March 1, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
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Patent number: 11217391Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.Type: GrantFiled: March 16, 2020Date of Patent: January 4, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
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Patent number: 11152154Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m), a maximum thickness of the second region is T2 (?m), and a minimum thickness of the third region is T3 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1?0.11.Type: GrantFiled: March 16, 2020Date of Patent: October 19, 2021Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
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Patent number: 10964479Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.Type: GrantFiled: December 23, 2019Date of Patent: March 30, 2021Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
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Patent number: 10921701Abstract: An image projection apparatus includes: a projector; a projection control apparatus; and a color tone sensor. The projector projects an image. The projection control apparatus causes the projector to perform a projection on a surface of a target serving as a projection target. The color tone sensor detects a color tone of the surface of the target on which an image is projected. The projection control apparatus adjusts a color tone of an image to be projected on a basis of a detection result of the color tone sensor such that the color tone detected by the color tone sensor has a predetermined value.Type: GrantFiled: December 3, 2018Date of Patent: February 16, 2021Assignee: SUBARU CORPORATIONInventors: Kei Suzuki, Iwao Murata, Yuichi Nagai, Yasunori Shibao, Marosuke Kikuchi
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Publication number: 20210043385Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.Type: ApplicationFiled: August 6, 2020Publication date: February 11, 2021Applicant: TDK CORPORATIONInventors: Yuichi NAGAI, Takehisa TAMURA, Shinya ONODERA, Ken MORITA, Atsushi TAKEDA
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Publication number: 20210043378Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1>0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.Type: ApplicationFiled: August 6, 2020Publication date: February 11, 2021Applicant: TDK CORPORATIONInventors: Yuichi NAGAI, Takehisa TAMURA, Shinya ONODERA, Ken MORITA, Atsushi TAKEDA
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Patent number: 10812763Abstract: An image projection apparatus includes: a projector; and a projection control apparatus. The projector projects an image. The projection control apparatus causes the projector to project a processing information regarding a processing or an assembly information regarding an assembly performed for a target to be manufactured on a surface of the target.Type: GrantFiled: December 3, 2018Date of Patent: October 20, 2020Assignee: SUBARU CORPORATIONInventors: Kei Suzuki, Iwao Murata, Yuichi Nagai, Yasunori Shibao, Marosuke Kikuchi
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Publication number: 20200312550Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (?m) and a minimum thickness of the second region is T2 (?m), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1?0.26.Type: ApplicationFiled: March 16, 2020Publication date: October 1, 2020Applicant: TDK CORPORATIONInventors: Yuichi NAGAI, Atsushi TAKEDA, Takehisa TAMURA, Shinya ONODERA
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Publication number: 20200312563Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m), a maximum thickness of the second region is T2 (?m), and a minimum thickness of the third region is T3 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1?0.11.Type: ApplicationFiled: March 16, 2020Publication date: October 1, 2020Applicant: TDK CORPORATIONInventors: Yuichi NAGAI, Atsushi TAKEDA, Takehisa TAMURA, Shinya ONODERA
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Publication number: 20200312551Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.Type: ApplicationFiled: March 16, 2020Publication date: October 1, 2020Applicant: TDK CORPORATIONInventors: Yuichi NAGAI, Atsushi TAKEDA, Takehisa TAMURA, Shinya ONODERA
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Patent number: 10732915Abstract: A manufacturing assistance apparatus includes a display, an imaging device, a completion determining unit, and a display controller. The display is configured to display operation information that is related to any of operation processes of a workpiece. The imaging device is configured to perform imaging of the workpiece, and output image data obtained by the imaging. The completion determining unit is configured to determine whether current one of the operation processes is completed, on a basis of the image data outputted from the imaging device. The display controller is configured to cause, when the current one of the operation processes is determined by the completion determining unit as being completed, the display to display the operation information that is related to subsequent one of the operation processes.Type: GrantFiled: October 30, 2018Date of Patent: August 4, 2020Assignee: SUBARU CORPORATIONInventors: Yasunori Shibao, Yuichi Nagai, Iwao Murata, Marosuke Kikuchi, Kei Suzuki
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Publication number: 20200211774Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.Type: ApplicationFiled: December 23, 2019Publication date: July 2, 2020Applicant: TDK CORPORATIONInventors: Shinya ONODERA, Takehisa TAMURA, Atsushi TAKEDA, Yuichi NAGAI