Abstract: The present invention provides an exposure apparatus which exposes a substrate to light, the apparatus comprising a substrate stage, a position measurement unit configured to measure a position of the substrate stage, a structure configured to support the position measurement unit, a force measurement unit configured to measure a force that acts on the structure, a correction unit configured to correct a command for controlling the position of the substrate stage, based on the measurement value obtained by the force measurement unit, and a correction coefficient, and a calculation unit configured to calculate the correction coefficient based on position deviation information between adjacent shot regions in an evaluation substrate including a plurality of shot regions exposed without correction by the correction unit, and the measurement value obtained by the force measurement unit in exposing each shot region.

Abstract: The present invention provides an exposure apparatus which exposes a substrate to light, the apparatus comprising a substrate stage, a position measurement unit configured to measure a position of the substrate stage, a structure configured to support the position measurement unit, a force measurement unit configured to measure a force that acts on the structure, a correction unit configured to correct a command for controlling the position of the substrate stage, based on the measurement value obtained by the force measurement unit, and a correction coefficient, and a calculation unit configured to calculate the correction coefficient based on position deviation information between adjacent shot regions in an evaluation substrate including a plurality of shot regions exposed without correction by the correction unit, and the measurement value obtained by the force measurement unit in exposing each shot region.

Abstract: An associated development-support apparatus for a semiconductor device enables highly accurate debugging and verification of operations. An emulator stub acquires event information by using a communication control unit, where the event is generated in a debugger, the event information is generated by a debugger stub according to an event, and transmitted by the debugger stub through a communication network. An emulator control unit analyzes the acquired event information, and controls an emulator according to the analyzed event so as to perform emulation processing which virtually emulates operations of the semiconductor device corresponding to the event based on hardware design information. The emulator stub acquires results of the event which is generated in association with the operations of the semiconductor device virtually emulated by the emulator, and notifies the debugger of the results of the event through the communication network and the debugger stub.

Abstract: A verification apparatus that efficiently performs hardware verification and software verification in the development of a system LSI with great accuracy. At the hardware verification, an equivalence verification section compares the result of the simulation of an HDL model by a logic simulator and an expected value generated from an expected value calculation model and verifies whether there is equivalence between them. At the software verification, the expected value calculation model is used via an interface section and a firmware is verified by a software debugger. The expected value calculation model is used as an expected value generation model at hardware verification time and is used as a C model of hardware at software verification time. By using the expected value calculation model both for the hardware verification and for the software verification in this way, verification can efficiently be performed with great accuracy.

Abstract: A verification apparatus that efficiently performs hardware verification and software verification in the development of a system LSI with great accuracy. At the hardware verification, an equivalence verification section compares the result of the simulation of an HDL model by a logic simulator and an expected value generated from an expected value calculation model and verifies whether there is equivalence between them. At the software verification, the expected value calculation model is used via an interface section and a firmware is verified by a software debugger. The expected value calculation model is used as an expected value generation model at hardware verification time and is used as a C model of hardware at software verification time. By using the expected value calculation model both for the hardware verification and for the software verification in this way, verification can efficiently be performed with great accuracy.

Abstract: An associated development-support apparatus for a semiconductor device enables highly accurate debugging and verification of operations. An emulator stub acquires event information by using a communication control unit, where the event is generated in a debugger, the event information is generated by a debugger stub according to an event, and transmitted by the debugger stub through a communication network. An emulator control unit analyzes the acquired event information, and controls an emulator according to the analyzed event so as to perform emulation processing which virtually emulates operations of the semiconductor device corresponding to the event based on hardware design information. The emulator stub acquires results of the event which is generated in association with the operations of the semiconductor device virtually emulated by the emulator, and notifies the debugger of the results of the event through the communication network and the debugger stub.

Abstract: In the horizontal continuous casting of metal, an upper contact part and a lower contact part of the metal body are horizontally displaced with the inner wall of the tubular chilled mold relative to one another, so that the lower contact part is psoitioned downstream relative to the upper contact part.

Abstract: In the horizontal continuous casting of metal, an upper contact part and a lower contact part of the metal body are horizontally displaced with the inner wall of the tubular chilled mold relative to one another, so that the lower contact part is positioned downstream relative to the upper contact part. Gas pressure is used to displace the contact point.