Abstract: A substrate is exposed with an illumination light via a projection optical system. A stage that holds the substrate moves below the projection optical system. A measurement system measures positional information of the stage with a plurality of heads that face a grating section. Movement of the stage is controlled based on the positional information measured with the measurement system, while compensating for a measurement error of the measurement system that occurs due to the heads.

Abstract: Position information of a movable body within an XY plane is measured with high accuracy by an encoder system whose measurement values have favorable short-term stability, without being affected by air fluctuations, and also position information of the movable body in a Z-axis direction orthogonal to the XY plane is measured with high accuracy by a surface position measuring system, without being affected by air fluctuations. In this case, since both of the encoder system and the surface position measuring system directly measure the upper surface of the movable body, simple and direct position control of the movable body can be performed.

Abstract: An exposure apparatus exposes a substrate with illumination light via an optical system. A stage disposed below the optical system has a holder to hold the substrate. A carrier system disposed above the stage has a first support member that supports the substrate in a noncontact manner from a surface side of the substrate, which is irradiated with the illumination light. A second support member different from the first support member supports the substrate in a contact manner from a rear surface side. A drive system coupled to the first and the second support members moves at least the second support member so that relative movement between the first and the second support members and relative movement between the second support member and the holder are performed at least in a vertical direction. The second support member carries the substrate from the first support member to the holder.

Abstract: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.

Abstract: Position information of a movable body within an XY plane is measured with high accuracy by an encoder system whose measurement values have favorable short-term stability, without being affected by air fluctuations, and also position information of the movable body in a Z-axis direction orthogonal to the XY plane is measured with high accuracy by a surface position measuring system, without being affected by air fluctuations. In this case, since both of the encoder system and the surface position measuring system directly measure the upper surface of the movable body, simple and direct position control of the movable body can be performed.

Abstract: Positional information of a movable body in a Y-axis direction is measured using an interferometer and an encoder whose short-term stability of measurement values excels when compared with the interferometer, and based on the measurement results, a predetermined calibration operation for obtaining correction information for correcting measurement values of the encoder is performed. Accordingly, by using measurement values of the interferometer, correction information for correcting the measurement values of the encoder whose short-term stability of the measurement values excels the interferometer is obtained. Then, based on the measurement values of the encoder and the correction information, the movable body is driven in the Y-axis direction with good precision.

Abstract: Positional information of a movable body in a Y-axis direction is measured using an interferometer and an encoder whose short-term stability of measurement values excels when compared with the interferometer, and based on the measurement results, a predetermined calibration operation for obtaining correction information for correcting measurement values of the encoder is performed. Accordingly, by using measurement values of the interferometer, correction information for correcting the measurement values of the encoder whose short-term stability of the measurement values excels the interferometer is obtained. Then, based on the measurement values of the encoder and the correction information, the movable body is driven in the Y-axis direction with good precision.

Abstract: A liquid immersion exposure apparatus includes a projection optical system via which exposure light is projected, a first stage that is movable below the projection optical system and having a holding portion that holds a substrate, a second stage that is movable below the projection optical system, and a nozzle member having an opening through which the exposure light is projected, a supply opening via which the liquid is supplied and a first recovery opening via which the liquid is collected. During exposure of the substrate, a portion of a surface of the substrate is covered by the liquid while performing liquid supply from the supply opening and liquid collection from the first recovery opening.

Abstract: A liquid immersion member forms a liquid immersion space on an object movable below an optical member so that a light path of exposure light emitted from an emission surface of the optical member is filled with liquid. The liquid immersion member includes a first member which is disposed in at least a portion of a periphery of the optical member, a second member which is movable relative to the first member and which includes a recovery port that recovers at least a portion of the liquid in the liquid immersion space, and a gas supply opening facing a gap between the first member and the second member, from which gas is supplied to the gap.

Abstract: A substrate is exposed with an illumination light via a projection optical system. A stage that holds the substrate moves below the projection optical system. A measurement system measures positional information of the stage with a plurality of heads that face a grating section. Movement of the stage is controlled based on the positional information measured with the measurement system, while compensating for a measurement error of the measurement system that occurs due to the heads.

Abstract: A shaping apparatus is equipped with: a beam shaping system having a beam irradiation section that includes a condensing optical system which emits a beam and a material processing section which supplies a shaping material irradiated by the beam from the beam irradiation section; and a controller which, on the basis of 3D data of a three-dimensional shaped object to be formed on a target surface, controls a workpiece movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material from the material processing section while moving the beam from the beam irradiation section and the target surface on a workpiece (or a table) relative to each other. Further the intensity distribution of the beam in the shaping plane facing the emitting surface of the condensing optical system can be modified.

Abstract: This shaping apparatus is equipped with: a movement system which moves a target surface; a measurement system for acquiring position information of the target surface in a state movable by the movement system, a beam shaping system that has a beam irradiation section and a material processing section which supplies a shaping material irradiated by a beam from beam irradiation section; and a controller. On the basis of 3D data of a three-dimensional shaped object to be formed on a target surface and position information of the target surface acquired using the measurement system, the controller controls the movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material while moving the target surface and the beam from beam irradiation section relative to each other.

Abstract: An exposure apparatus is equipped with an encoder system which measures positional information of a wafer stage by irradiating a measurement beam using four heads installed on the wafer stage on a scale plate which covers the movement range of the wafer stage except for the area right under a projection optical system. Placement distances of the heads here are each set to be larger than width of the opening of the scale plates, respectively. This allows the positional information of the wafer stage to be measured, by switching and using the three heads facing the scale plate out of the four heads according to the position of the wafer stage.

Abstract: A partial section of an aerial image measuring unit is arranged at a wafer stage and part of the remaining section is arranged at a measurement stage, and the aerial image measuring unit measures an aerial image of a mark formed by a projection optical system. Therefore, for example, when the aerial image measuring unit measures a best focus position of the projection optical system, the measurement can be performed using the position of the wafer stage, at which a partial section of the aerial image measuring unit is arranged, in a direction parallel to an optical axis of the projection optical system as a datum for the best focus position. Accordingly, when exposing an object with illumination light, the position of the wafer stage in the direction parallel to the optical axis is adjusted with high accuracy based on the measurement result of the best focus position.

Abstract: Within area where of four heads installed on a wafer stage, heads included in the first head group and the second head group to which three heads each belong that include one head different from each other face the corresponding areas on a scale plate, the wafer stage is driven based on positional information which is obtained using the first head group, as well as obtain the displacement (displacement of position, rotation, and scaling) between the first and second reference coordinate systems corresponding to the first and second head groups using the positional information obtained using the first and second head groups. By using the results and correcting measurement results obtained using the second head group, the displacement between the first and second reference coordinate systems is calibrated, which allows the measurement errors that come with the displacement between areas on scale plates where each of the four heads face.

Abstract: A controller measures positional information of a stage within an XY plane using three encoders which at least include one each of an X encoder and a Y encoder of an encoder system, and the stage is driven in the XY plane, based on measurement results of the positional information and positional information (p1, q1), (p2, q2), and (p3, q3) in a surface parallel to the XY plane of a head (an encoder) used for measurement of the positional information. Accordingly, it becomes possible to control the movement of the stage with good precision, while switching the head (the encoder) used for control during the movement of the stage using the encoder system which includes a plurality of heads.

Abstract: While a wafer stage moves linearly in a Y-axis direction, surface position information of a wafer surface at a plurality of detection points set at a predetermined interval in an X-axis direction is detected by a multipoint AF system, and by a plurality of alignment systems arranged in a line along the X-axis direction, marks at different positions on the wafer are each detected, and a part of a chipped shot of the wafer is exposed by a periphery edge exposure system. This allows throughput to be improved when compared with the case when detection operation of the marks, detection operation of the surface position information (focus information), and periphery edge exposure operation are performed independently.

Abstract: A substrate is exposed with an illumination light via a projection optical system. A stage that holds the substrate moves below the projection optical system. A measurement system measures positional information of the stage with a plurality of heads that face a grating section. Movement of the stage is controlled based on the positional information measured with the measurement system, while compensating for a measurement error of the measurement system that occurs due to the heads.

Abstract: In corner sections of first to fourth quadrants whose origin point is a center of an upper surface of a stage, three each of two-dimensional heads are provided. The three each of two-dimensional heads include one first head and two second heads. The stage is driven, while measuring a position of the stage using three first heads that face a two-dimensional grating of a scale plate provided above the stage from the four first heads, and during the driving, difference data of measurement values of the two second heads with respect to the first head in a measurement direction are taken in for head groups to which the three first heads belong, respectively, and using the difference data, grid errors are calibrated.

Abstract: A first drive system of a first stage and a second drive system of a second stage are controlled based on measurement information of a first encoder system and a second encoder system, respectively, and so that a mask and a substrate are moved relative to illumination light in scanning exposure of the substrate. To move the second stage in another second area, one head of the second encoder system, different from two heads, of three heads used in one second area is switched to another head so that drive control of the second stage by three heads, including the another head and the two heads, that are used in the another second area is performed, instead of drive control of the second stage by the three heads used in the one second area. The switching is performed while the second stage is in a first area.