Abstract: Within area where of four heads installed on a wafer stage, heads included in the first head group and the second head group to which three heads each belong that include one head different from each other face the corresponding areas on a scale plate, the wafer stage is driven based on positional information which is obtained using the first head group, as well as obtain the displacement (displacement of position, rotation, and scaling) between the first and second reference coordinate systems corresponding to the first and second head groups using the positional information obtained using the first and second head groups. By using the results and correcting measurement results obtained using the second head group, the displacement between the first and second reference coordinate systems is calibrated, which allows the measurement errors that come with the displacement between areas on scale plates where each of the four heads face.

Abstract: An exposure apparatus exposes a substrate with illumination light via a projection optical system, and includes a stage disposed below the projection optical system and holds the substrate; an encoder system in which one of a grating section and a head is provided at the stage and the other of the grating section and the head is provided at a frame member disposed above the stage, on a lower end side of the projection optical system, and which irradiates the grating section with a measurement beam via the head and measures positional information of the stage with a plurality of the heads that face the grating section; and a controller coupled to the encoder system, that controls a drive system based on positional information measured with the encoder system while compensating for measurement error of the encoder system related to measurement direction of the positional information by the heads.

Abstract: A drive unit drives a wafer stage in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer stage in the Y-axis direction and based on information on the flatness of a scale that is measured by the encoder. In this case, the drive unit can drive the wafer stage in a predetermined direction based on a measurement value after correction in which a measurement error caused by the flatness of the scale included in the measurement value of the encoder is corrected based on the information on the flatness of the scale. Accordingly, the wafer stage can be driven with high accuracy in a predetermined direction using the encoder, without being affected by the unevenness of the scale.

Abstract: A controller of an exposure apparatus is coupled to an alignment system, an aerial image measurement device and an encoder system, to control a drive system based on correction information and measurement information of the encoder system, the correction information compensating a measurement error of the encoder system that occurs due to a plurality of scale members. In an exposure operation of a substrate, a detection operation of a mark of the substrate and a fiducial mark, and a detection operation of an aerial image, the positional information of the stage is measured with the encoder system. In the exposure operation, the substrate is placed facing a lower surface of a nozzle member by a stage, and alignment between a pattern image and the substrate is performed based on detection information of the alignment system and the aerial image measurement device.

Abstract: An exposure apparatus is equipped with: an irradiation device that irradiates a target with an electron beam; a stage that holds the target; a stage driving system that includes an electromagnetic motor to drive the stage; and a control system that controls the stage driving system on the basis of an irradiation state of the electron beam on the target. The control system changes the control content with respect to the stage driving system between the irradiation time and the non-irradiation time of the electron beam on the target. Accordingly, it becomes possible to use the electromagnetic motor as a drive source of the stage and also to suppress the irradiation position displacement of the electron beam on the target at the time of driving of the stage.

Abstract: Within area where of four heads installed on a wafer stage, heads included in the first head group and the second head group to which three heads each belong that include one head different from each other face the corresponding areas on a scale plate, the wafer stage is driven based on positional information which is obtained using the first head group, as well as obtain the displacement (displacement of position, rotation, and scaling) between the first and second reference coordinate systems corresponding to the first and second head groups using the positional information obtained using the first and second head groups. By using the results and correcting measurement results obtained using the second head group, the displacement between the first and second reference coordinate systems is calibrated, which allows the measurement errors that come with the displacement between areas on scale plates where each of the four heads face.

Abstract: Within area where of four heads installed on a wafer stage, heads included in the first head group and the second head group to which three heads each belong that include one head different from each other face the corresponding areas on a scale plate, the wafer stage is driven based on positional information which is obtained using the first head group, as well as obtain the displacement (displacement of position, rotation, and scaling) between the first and second reference coordinate systems corresponding to the first and second head groups using the positional information obtained using the first and second head groups. By using the results and correcting measurement results obtained using the second head group, the displacement between the first and second reference coordinate systems is calibrated, which allows the measurement errors that come with the displacement between areas on scale plates where each of the four heads face.

Abstract: An exposure apparatus exposes a substrate with illumination light via a projection optical system, and includes a stage disposed below the projection optical system and holds the substrate; an encoder system in which one of a grating section and a head is provided at the stage and the other of the grating section and the head is provided at a frame member disposed above the stage, on a lower end side of the projection optical system, and which irradiates the grating section with a measurement beam via the head and measures positional information of the stage with a plurality of the heads that face the grating section; and a controller coupled to the encoder system, that controls a drive system based on positional information measured with the encoder system while compensating for measurement error of the encoder system related to measurement direction of the positional information by the heads.

Abstract: A liquid immersion exposure apparatus includes a liquid immersion member which forms a liquid immersion space under an emitting surface of a last optical member. The exposure light is projected to a substrate through liquid in the liquid immersion space to expose the substrate while the substrate is moved in a scanning direction. The liquid immersion member includes (i) a first member having a liquid supply port and an opening through which the exposure light is projected, and (ii) a second member having a liquid recovery port facing downwardly and that is movable with respect to the first member. The liquid recovery port has a plurality of openings disposed in a four-sided shaped having four corners to surround the opening of the first member.

Abstract: A controller of an exposure apparatus (1) controls a second drive system so that scanning exposure is performed via a projection optical system and liquid of a liquid immersion area, from an area located on one side in a first direction, of a plurality of areas of a substrate held by a second stage that is placed facing the projection optical system and (ii) controls the second drive system so that a third stage comes close to the second stage from the other side in the first direction, and the second and the third stages that have come close together move from the other side to the one side in the first direction in order to place the third stage to face the projection optical system instead of the second stage while substantially maintaining the liquid immersion area under the lens.

Abstract: When a transition from a first state where one stage is positioned at a first area directly below projection optical system to which liquid is supplied to a state where the other stage-is positioned at the first area, both stages are simultaneously driven while a state where both stages are close together in the X-axis direction is maintained. Therefore, it becomes possible to make a transition from the first state to the second state in a state where liquid is supplied in the space between the projection optical system and the specific stage directly under the projection optical system. Accordingly, the time from the completion of exposure operation on one stage side until the exposure operation begins on the other stage side can be reduced, which allows processing with high throughput. Further, because the liquid can constantly exist on the image plane side of the projection optical system, generation of water marks on optical members of the projection optical system on the image plane side is prevented.

Abstract: A stage device is equipped with a surface plate and a wafer stage which is mounted on the surface plate and has an exhausting port formed on a surface facing the surface plate. In a state where the wafer stage lands on the surface plate, an air chamber is formed in between the surface plate and the wafer stage. Pressurized gas blows out from the exhausting port provided at a stage main section into the air chamber, and self-weight of the wafer stage is cancelled by an inner pressure of the air chamber. This allows to the wafer stage which has stopped on the surface plate to be moved manually.

Abstract: An exposure apparatus exposes a substrate with illumination light via a projection optical system, and includes a frame member, a mark detection system that detects a mark of the substrate, a mask stage system having a first movable body to hold a mask, a first encoder system having first heads that each irradiate a first measurement beam to a first grating section, a substrate stage system having a second movable body to hold the substrate, a second encoder system having second heads that each irradiate a second measurement beam to a second grating section, and a controller that controls driving of the first movable body and of the second movable body, based on measurement information of the first and second encoder systems. In each of an exposure operation and a detection operation, the positional information of the second movable body is measured by the second encoder system.

Abstract: Position information of a movable body within an XY plane is measured with high accuracy by an encoder system whose measurement values have favorable short-term stability, without being affected by air fluctuations, and also position information of the movable body in a Z-axis direction orthogonal to the XY plane is measured with high accuracy by a surface position measuring system, without being affected by air fluctuations. In this case, since both of the encoder system and the surface position measuring system directly measure the upper surface of the movable body, simple and direct position control of the movable body can be performed.

Abstract: A supporting member on which a wafer table is mounted is substantially kinematically supported, via six rod members placed on a slider. Further, coupling members are placed facing in a non-contact manner via a predetermined gap, thin plate-shaped edges provided at both ends in the Y-axis direction of the supporting member. By this arrangement, vibration-damping is performed by the coupling members (squeeze dampers) facing the edges, on vibration of the supporting member mounted on the wafer table. Further, because the supporting member is kinematically supported via the plurality of rod members, it becomes possible to reduce deformation of the wafer table that accompanies deformation of the slider.

Abstract: An exposure apparatus performs scanning exposure of a substrate with an illumination light via a projection optical. A mask is supported on a first base member, with a slider provided inside a movable member. The first base member is arranged above the projection optical system and has a first opening through which the illumination light passes. The mask is supported in a second opening of the slider, through which the illumination light passes. The slider moves inside the movable member by a first drive system. A stage having a holder that holds the substrate is moved on a second base member by a second drive system. The first and the second drive systems move the mask and the substrate relative to the illumination light during scanning exposure. The movable member is moved by a reaction force generated by a movement of the slider by the first drive system.

Abstract: A drive unit drives a wafer stage in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer stage in the Y-axis direction and based on information on the flatness of a scale that is measured by the encoder. In this case, the drive unit can drive the wafer stage in a predetermined direction based on a measurement value after correction in which a measurement error caused by the flatness of the scale included in the measurement value of the encoder is corrected based on the information on the flatness of the scale. Accordingly, the wafer stage can be driven with high accuracy in a predetermined direction using the encoder, without being affected by the unevenness of the scale.

Abstract: Position information of a movable body within an XY plane is measured with high accuracy by an encoder system whose measurement values have favorable short-term stability, without being affected by air fluctuations, and also position information of the movable body in a Z-axis direction orthogonal to the XY plane is measured with high accuracy by a surface position measuring system, without being affected by air fluctuations. In this case, since both of the encoder system and the surface position measuring system directly measure the upper surface of the movable body, simple and direct position control of the movable body can be performed.

Abstract: A controller of an exposure apparatus is coupled to an alignment system, an aerial image measurement device and an encoder system, to control a drive system based on correction information and measurement information of the encoder system, the correction information compensating a measurement error of the encoder system that occurs due to a plurality of scale members. In an exposure operation of a substrate, a detection operation of a mark of the substrate and a fiducial mark, and a detection operation of an aerial image, the positional information of the stage is measured with the encoder system. In the exposure operation, the substrate is placed facing a lower surface of a nozzle member by a stage, and alignment between a pattern image and the substrate is performed based on detection information of the alignment system and the aerial image measurement device.

Abstract: An exposure apparatus exposes a substrate with illumination light via a projection optical system, and includes a stage disposed below the projection optical system and holds the substrate; an encoder system in which one of a grating section and a head is provided at the stage and the other of the grating section and the head is provided at a frame member to be disposed above the stage, on a lower end side of the projection optical system, and irradiates the grating section with a measurement beam via the head and measures positional information of the stage with a plurality of the heads that face the grating section; and a controller coupled to the encoder system, that controls a drive system based on positional information measured with the encoder system while compensating for measurement error of the encoder system related to measurement direction of the positional information by the heads.