Abstract: The present invention provides foam molding equipment which has an advantage in performing exchange of a molding dies within a short time period and in improving productivity thereof, and which is most suitable, in particular, to the case of using upsized molding dies. The equipment is provided with a fixed die base 21, movable die base 8, a die opening/closing mechanism to move the movable die base 8 together with a movable die 12, and a base frame 1. The fixed die base 21 is detachable from the base frame 1. Molding dies comprising a stationary die 11 and a movable die 12 is preliminarily attached to the fixed die base 21 to form a unit 20. The base frame 1 is provided with a loading surface 4 to load the unit 20 and a unit connector 27 to fix the unit loaded on the loading surface 4 to the base frame 1. The unit 20 is loaded on the loading surface 4 in a detachable manner.

Abstract: A surface position detecting method, wherein, while an object having a region with a pattern structure is scanned relative to a surface position detecting system in a scan direction, different from a surface position detecting direction of the surface position detecting system, the surface position detecting system performs surface position detection sequentially at a plurality of detection points, which are disposed within the region and along the scan direction.

Abstract: A projection exposure apparatus including a projection optical system for projecting a pattern of a reticle onto a substrate, an optical characteristic detecting device for detecting a change in optical characteristic of the projection optical system, which change may result from the projection of the reticle pattern onto the substrate through the projection optical system, and a light detecting device for detecting at least one of (i) an intensity distribution of light from the reticle pattern, at a position adjacent to the reticle or adjacent to an imaging plane on which the reticle is to be imaged, and (ii) an intensity distribution of the light from the reticle pattern, at a position adjacent to a pupil plane of the projection optical system, wherein the optical characteristic detecting device is arranged to detect the amount of change in optical characteristic in accordance with the intensity distribution detected by the light detecting device.

Abstract: A surface position detecting method for detecting a surface position of a surface to be examined, having surface height irregularity, while relatively scanning the surface, is disclosed. The method includes detecting characteristic data related to a surface state at plural measurement positions on the surface, while relatively scanning the surface, and processing the detected characteristic data related to the measurement positions to determine a measurement position for measurement of the surface position in a subsequent surface position detecting process.

Abstract: An Nb.sub.3 Al multi-filamentary superconducting wire capable of realizing both stabilization of a superconducting state and increase in capacity is provided. The Nb.sub.3 Al multi-filamentary superconducting wire includes a core formed of copper or copper alloy and located at the center of the wire; a multi-filamentary superconductor layer located around the core and having filaments containing Nb and Al as constituent elements embedded in a matrix formed of copper or copper alloy; and a high resistance layer located around the multi-filamentary superconductor layer, and is characterized in that a sectional area of the core is at least 15% of the total sectional area of the core and the matrix and that the core and the matrix are formed of copper or copper alloy of at least 99.9% purity.

Abstract: An exposure method and apparatus usable with a mask stage for holding a mask having an original pattern, a projection optical system for projecting at least a portion of the original pattern at a predetermined magnification and a substrate stage for holding a photosensitive substrate on an imaging plane of the projection optical system. The mask stage and the substrate stage are moved in a timed relation along a scan direction at a speed ratio corresponding to the magnification of the projection optical system by which a projected image of the original pattern can be scanningly printed on shots of the photosensitive layout. Scanning exposure is controlled on the basis of a shot layout of the photosensitive substrate which is determined per chip from information related to a chip structure and a chip size of the original pattern. The original pattern includes a plurality of original chip patterns.

Abstract: An exposure method for use with an exposure apparatus that includes a projection optical system for projecting a pattern of a first object onto a second object, a mark position detecting optical system having a detection zone at a predetermined position with respect to the projection optical system, for detecting a position of a mark of the second object, and a plurality of surface position detecting devices having different detection zones at different positions predetermined with respect to the projection optical system, for detecting a surface position of the second object. The mark is moved into the detection zone of the mark position detecting optical system, and the surface position of the second object is detected by using the surface position detecting devices. The surface position detecting devices respectively produce plural detection results.

Abstract: A circuit board that can be replaced or removed for repair from an information processing device, and which can be reinstalled without allowing backup-mode power to reach circuits on the circuit board during reinstallation. The circuit board for the information processing device includes a load that is mounted on the circuit board and that is supplied with normal or backup power. A switch is coupled to the load and has a first state that allows the backup power to be supplied to the load and a second state in which the backup power is inhibited from being applied to the load when either normal power is supplied to the load or no power is supplied to the circuit board.

Abstract: The method of preparing an NB.sub.3 Al superconducting wire comprises the steps of passing an Nb/Al composite wire consisting of an Nb metal or an Nb alloy and an Al metal or an Al alloy through a furnace for heating the same from the room temperature to a prescribed temperature, subsequently passing the same through the furnace for holding the same at the prescribed temperature, and subsequently passing the same through a cooling part for cooling the same from the prescribed temperature to the room temperature, and these steps are continuously carried out by continuously moving the wire. According to the present invention, it is possible to obtain an Nb.sub.3 Al superconducting wire having homogeneous characteristics along its overall width with a high critical current density.

Abstract: Disclosed herein is a wire for an Nb.sub.3 X superconducting wire, which is improved in workability and soundness of a diffusion barrier layer without increasing the diffusion barrier layer in thickness. This wire for an Nb.sub.3 X superconducting wire comprises a wire which is prepared by superposing and winding up a first sheet consisting of pure Nb or an Nb alloy and a second sheet consisting of metal atoms X, reacting with Nb for forming a compound exhibiting superconductivity, or an X alloy, a stabilizing material layer which is provided to enclose the wire, and a diffusion barrier layer which is provided between an outer surface of the wire and an inner surface of the stabilizing material layer for preventing the metal atoms X from being diffused in the stabilizing material layer, and the diffusion barrier layer is made of a metal material having larger tensile strength than that of the first sheet. It is possible to obtain a high-performance Nb.sub.

Abstract: A method of manufacturing an Nb.sub.3 Al superconducting wire includes a step of forming a wire by a jelly-roll process, a first thermal step of heating the obtained wire at a temperature of 500.degree. to 700.degree. C. for at least 10 hours for diffusing Al in Nb while suppressing formation of Nb.sub.3 Al, and a second thermal step of heating the wire, after the first thermal step, at a temperature of 800.degree. to 1050.degree. C. for about 0.01 to 10 hours, thereby forming Nb.sub.3 Al. In the jelly-roll process, a sheet of Nb and a sheet of Al are lap-wound on a copper core. The material obtained by such lap winding is inserted in a copper pipe, and then subjected to drawing. The drawn wire is cut to obtain a plurality of segments. The plurality of segments are bundled and charged in a copper pipe, and then subjected to drawing. The resulting drawn wire is subjected to the first and second thermal steps.

Abstract: A composite superconducting wire using ceramic superconductor material in which one or more elongated superconductor material are accommodated in one or more grooves formed on an elongated reinforcing member so that a long size superconductor wire can be provided. Various methods of producing such composite superconductor wire are also disclosed.

Abstract: A composite superconducting wire using ceramic superconductor material in which one or more elongated superconductor material are accommodated in one or more grooves formed on an elongated reinforcing member so that a long size superconductor wire can be provided. Various methods of producing such composite superconductor wire are also disclosed.

Abstract: A focusing method is disclosed wherein a substrate is moved substantially along a focal plane of a projection optical system up to a predetermined station adjacent to the focal plane of the projection optical system and then, at the predetermined station, the surface of the substrate is brought into substantial coincidence with the focal plane of the projection optical system. The method includes the steps of detecting a deviation of the surface of the substrate with respect to the focal plane of the projection optical system, before the substrate, being moved substantially along the focal plane of the projection optical system, is moved up to the predetermined station; and substantially correcting the deviation on the basis of the detection.

Abstract: A method of bringing a surface of a wafer into coincidence with an image plane of a projection optical system on the basis of the detection of the deviation of the wafer surface from a reference plane of a deviation detecting sensor, includes the steps of: moving the wafer surface along an optical axis of the projection optical system, to a position close to the reference plane; detecting a deviation of the wafer surface from the reference plane; and moving the wafer surface on the basis of the detection, to be brought into coincidence with the image plane of the projection optical system.

Abstract: A position and orientation state pickup is designed to detect the position and orientation state of an endoscope inserted into a living body without any adverse effect on the living body, which is often observed in X-ray analysis. The position and orientation state pickup, generating an electro-magnetic field with frequency at least lower than the visible ray range toward the body from outside; detects influence of the endoscope inserted into the body on two-dimensional energy distribution of the electro-magnetic field generated toward the body; and show the position and orientation state of the endoscope from the detection results.

Abstract: In a dust removing system, the level of influence of dust sticking to an objective lens of an optical head is detected from either an amount of light emitted from the optical head and reflected from an optical head or from an access time. Three stages of levels with regard to the degree of influence of the dust are set in accordance with such detection value, and a different message for the removal of dust is indicated on a display unit in response to the level of the influence. When the influence is low, a dust removing mechanism is automatically rendered operative to remove the dust. At the first level at which the influence of dust is low, the optical disk in the optical disk device is discharged and cleaning of the objective lens is performed, and an indication is provided on the display unit representing that cleaning is proceeding.

Abstract: A die exchanger of a molding apparatus includes a die plate, a die carrying-in apparatus and a die carrying-out apparatus. The die carrying-in apparatus has at least one guide groove engaging a pin of the die and guiding a plurality of corresponding dies and has a first support plate movable forward and backward to the die plate so that the guide groove is connectable to a groove in clamp means provided on the die plate. The die carrying-out apparatus has a second support plate movable forward and backward to the die plate so that the second support plate can receive the die engaging the clamp, the second support plate movably supporting the die. The die carrying-in apparatus has a one-way feed mechanism feeding each of the corresponding dies which is supported by means of the guide groove of the first support plate to the die plate. The die carrying-out apparatus is tiltable for discharging the die.

Abstract: Mark detecting method and apparatus usable, for example, in a semiconductor exposure apparatus such as a stepper for printing a pattern of a reticle upon a semiconductor wafer, for detecting, by using an image sensor, an alignment mark provided on a reticle or wafer for alignment of the same. Plural search marks are provided two-dimensionally around the alignment mark, each search mark having a first pattern and one or more second patterns indicative of the position of the alignment mark. When at least one first pattern of the search mark is caught by an image pickup device, the reticle is displaced in accordance with the positional information as indicated by the second pattern of the search mark. This brings the alignment mark within the image pickup region of the image sensor. The alignment mark is subsequenlty used to accurately align the reticle with a predetermined position. Thus, the time required for completing the reticle alignment can be reduced remarkably.

Abstract: A mark detecting method and device suitably applicable to the alignment of a reticle in a semiconductor device manufacturing exposure apparatus, called a stepper, is disclosed. A mark is provided by repeated patterns having specific pitches. These patterns are set so that at least one pitch of the patterns differs, on a light-receiving surface of an image sensor which receives an image of the mark, from a multiple, by an integral number, of the sampling pitch (pitch of picture elements) of the image sensor. In one preferred form, the mark is formed by repeated patterns of a number N (.gtoreq.2), wherein at least one pitch Pp of the patterns satisfies, on the light-receiving surface of the image sensor, a relationship Pp=(m+n/N).times.Pix where m is an arbitrary number, n is an integral number which satisfies 1.ltoreq.n.ltoreq.N, and Pix is the sampling pitch of the image sensor. The image of such a mark is photoelectrically converted to thereby determine the position of the mark.