Abstract: A backside-illumination solid-state image pickup apparatus and a backside-illumination solid-state image-pickup-apparatus manufacturing method, an image pickup apparatus, and electronic equipment that are configured to make it possible to reduce manufacturing costs. A diced memory circuit and logic circuit are laid out in a horizontal direction, are embedded and flattened by using an oxide film, and are stacked so as to be enclosed in a plane direction under a solid-state image pickup element. The present disclosure can be applied to an image pickup apparatus.

Abstract: The present invention relates to a composition comprising: (a) at least one particle comprising at least one cationic polymer and at least one anionic polymer, at least one cationic polymer and at least one amphoteric polymer, at least one anionic polymer and at least one amphoteric polymer, or at least one amphoteric polymer, and at least one non-polymeric acid having two or more pKa values or salt(s) thereof or at least one non-polymeric base having two or more pKb values or salt(s) thereof; (b) at least one surfactant; and (c) water, wherein the anionic polymer is selected from hyaluronic acid and derivatives thereof, and the amphoteric polymer is selected from cationized hyaluronic acid and salts thereof. The composition according to the present invention can provide long lasting cosmetic effects and/or improved moisturizing texture based on hyaluronic acid or cationized hyaluronic acid.

Abstract: An imaging apparatus includes: an image sensor that captures a subject image to generate image data; an output interface that outputs information to a user; and a controller that controls the output interface, based on recording data and the image data generated by the image sensor, the recording data recording information on a first moving image, wherein the controller causes the output interface to output shooting assist information during shooting of a second moving image with the image sensor, the shooting assist information assisting the user to match the second moving image with the first moving image.

Abstract: A substrate processing method includes providing a substrate processing apparatus including a processing container that accommodates a substrate, and a heater that heats an inside of the processing container; setting a specific section with an in-plane temperature distribution of a substrate that results in a desired outcome of substrate processing based on a first prediction model that predicts a time-dependent change of the in-plane temperature distribution of the substrate after temperature increase or decrease caused by the heater; and performing the substrate processing in the specific section.

Abstract: An image capturing unit captures an image of a surface of a member treated by a surface treatment unit. A comparison unit obtains a correlation coefficient between a reference image stored in a storage unit and the image captured by the image capturing unit. A cross-correlation coefficient between power spectra of the reference image and the image captured by the image capturing unit is obtained. A control unit stops a surface treatment performed by the surface treatment unit when the correlation coefficient obtained by the comparison unit reaches a set value.

Abstract: An aspect of the present disclosure is to accurately estimate whether or not a plurality of people are in close contact with each other in a target space. An estimation system (1) includes a first estimator (12) and a second estimator (13). The first estimator (12) is configured to estimate, based on a heat distribution including a plurality of heat sources detected by at least one infrared sensor (2), three-dimensional positions of heads of a plurality of people in a target space. The second estimator (13) is configured to estimate, based on data on the three-dimensional positions estimated by the first estimator (12), estimate whether or not the plurality of people are in close contact with each other.

Abstract: Provided is solid-state imaging device comprising a semiconductor substrate that a light-receiving element, an on-chip lens disposed on a first surface of the semiconductor substrate, and a glass substrate disposed on the side of the first surface of the semiconductor substrate separately from the on-chip lens. The glass substrate includes a trench in a surface that faces the semiconductor substrate.

Abstract: Picture quality deterioration is curbed. A solid-state imaging device according to an embodiment includes: a semiconductor substrate (131) including a light-receiving element; an on-chip lens (132) disposed on a first surface of the semiconductor substrate; a resin layer (133) covering the on-chip lens; and a glass substrate (134) disposed on the side of the first surface of the semiconductor substrate separately from the resin layer.

Abstract: Provided is an imaging device including: a first semiconductor substrate provided with a photoelectric conversion element, a second semiconductor substrate stacked on the first semiconductor substrate with an interlayer insulating film interposed therebetween and provided with a pixel circuit that reads out charges generated in the photoelectric conversion element as a pixel signal, and a via that penetrates the interlayer insulating film and electrically connects a first surface of the first semiconductor substrate facing the second semiconductor substrate and at least a part of a second surface of the second semiconductor substrate facing the first surface.

Abstract: There are provided a light emitting device capable of forming a light emitting element on a suitable substrate and a method of manufacturing the same. A light emitting device according to the present disclosure includes: a first substrate; a plurality of light emitting elements that are provided on a first surface of the first substrate; and a second substrate that is provided on a second surface of the first substrate opposite to the first surface.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: A solid-state imaging device that can further improve the quality and reliability of the solid-state imaging device is provided. There is provided a solid-state imaging device including: a sensor substrate having an imaging element that generates a pixel signal in a pixel unit; and at least one chip having a signal processing circuit necessary for signal processing of the pixel signal, wherein the sensor substrate and the at least one chip are electrically connected to and stacked on each other, and wherein a protective film is formed on at least a part of a side surface of the at least one chip, the side surface being connected to a surface of the at least one chip on a side on which the at least one chip is stacked on the sensor substrate.

Abstract: An image reading apparatus includes a first stacking unit having a stacking surface, and an abutment portion that abuts a document stacked on the stacking surface, a feeding unit, a reading unit, a second stacking unit, a detection unit, a rotating shaft, a drive unit, and a control unit. The second stacking unit receives the document fed by the feeding unit and read by the reading unit. The detection unit detects presence or absence of the document stacked on the second stacking unit. The drive unit rotates the first stacking unit around the rotating shaft rotatably supporting the first stacking unit. Based on the detection of the absence of the document on the second stacking unit by the detection unit, the control unit controls the drive unit to rotate the first stacking unit in a direction with which the abutment portion is lowered.

Abstract: An image reading apparatus includes a stacking unit having an abutment portion, a feeding unit, a conveyance unit, a reading unit, a rotating shaft, and a drive unit. The abutment portion abuts a document end in a widthwise direction of a document stacked on the stacking unit. The conveyance unit conveys the stacked document fed by the feeding unit in a feeding direction perpendicularly intersecting the document widthwise direction. The reading unit reads an image of the document. The drive unit rotates the stacking unit, rotatably supported by the rotating shaft, around the rotating shaft. The rotating shaft is disposed at a position where at least a part of the rotating shaft exists between one end and other end in the document widthwise direction of a document having a maximum width conveyable by the conveyance unit in a state where the maximum width document abuts on the abutment portion.

Abstract: An image reading apparatus includes a first stacking unit having a stacking surface, and an abutment portion that abuts a document stacked on the stacking surface, a feeding unit, a reading unit, a second stacking unit, a first detection unit, a rotating shaft, a drive unit, and a control unit. The second stacking unit receives the document fed by the feeding unit and read by the reading unit. The first detection unit detects presence or absence of the document stacked on the first stacking unit. The drive unit rotates the first stacking unit around the rotating shaft rotatably supporting the first stacking unit. At a predetermined timing after the first detection unit detects the absence of the document on the first stacking unit, the control unit controls the drive unit to rotate the first stacking unit in a direction with which the abutment portion is lowered.

Abstract: The present disclosure relates to an imaging device, an electronic device, and a manufacturing method enabling to reduce a manufacturing cost. There are provided: a first semiconductor element including an imaging element configured to generate a pixel signal; and a second semiconductor element in which a first signal processing circuit and a second signal processing circuit that are configured to process the pixel signal are embedded by an embedded member. The first signal processing circuit has a structure including at least one more layer than the second signal processing circuit. There are further provided: a first wiring line that connects the first semiconductor element and the first signal processing circuit; and a second wiring line that connects the first signal processing circuit and the second signal processing circuit. The present disclosure can be applied to an imaging device.

Abstract: Provided is a digital switch including: a plurality of input-side memories, which are arranged in a one-to-one correspondence with a plurality of input ports, and are configured to accumulate time-division multiplexed data; a plurality of output-side memories, which are arranged in a one-to-one correspondence with a plurality of output ports, and are configured to accumulate time-division multiplexed data; and a switch matrix configured to receive, as input, the time-division multiplexed data read out in every cycle from each of the plurality of input-side memories, and execute routing for selecting, in accordance with a connection control signal received from outside, any one of the plurality of output-side memories such that the time-division multiplexed data read out in every cycle is output from each of the plurality of output ports without causing a difference in delay, to output the time-division multiplexed data.

Abstract: The present disclosure relates to a backside illumination type solid-state imaging device, a manufacturing method for a backside illumination type solid-state imaging device, an imaging apparatus, and electronic equipment by which the manufacturing cost can be reduced. A singulated memory circuit and a singulated logic circuit are laid out in a horizontal direction and are embedded by an oxide film and flattened, and then are stacked so as to be contained in a plane direction under a solid-state imaging element. The present disclosure can be applied to an imaging apparatus.

Abstract: A multi-stage demultiplexing circuit in which a plurality of circuits each combining a selector and a frequency decimation circuit are connected is included. The selector selects one of input signals based on a control signal, and generates a plurality of output signals. The plurality of output signals output from the selector are input to the frequency decimation circuit, and the frequency decimation circuit performs frequency conversion processing, low pass filter processing, and down-sampling processing based on a control signal to generate an output signal. Two or more reception signals are input to the multi-stage demultiplexing circuit, and the multi-stage demultiplexing circuit executes demultiplexing processing based on a control signal so that an output signal that includes an unused band portion is prevented from being output downstream.

Abstract: Picture quality deterioration is curbed. A solid-state imaging device according to an embodiment includes: a semiconductor substrate (131) including a light-receiving element; an on-chip lens (132) disposed on a first surface of the semiconductor substrate; a resin layer (133) covering the on-chip lens; and a glass substrate (134) disposed on the side of the first surface of the semiconductor substrate separately from the resin layer.