Abstract: A semiconductor memory device according to an embodiment includes: a semiconductor layer; a gate electrode layer; a first insulating layer provided between the semiconductor layer and the gate electrode layer, the first insulating layer containing silicon (Si), nitrogen (N), and fluorine (F), and the first insulating layer including a first region; a second insulating layer provided between the first insulating layer and the gate electrode layer; and a charge storage layer provided between the first insulating layer and the second insulating layer, the charge storage layer containing silicon (Si) and nitrogen (N), and the charge storage layer including a second region, in which a second atomic ratio (N/Si) in the second region is larger than a first atomic ratio (N/Si) in the first region, and in which a first fluorine concentration in the first region is higher than a second fluorine concentration in the second region.

Abstract: A semiconductor device according to an embodiment includes a first electrode; a second electrode; a gate electrode; an n-type first silicon carbide region positioned between the first electrode and the second electrode and between the gate electrode and the second electrode; a p-type second silicon carbide region positioned between the first electrode and the first silicon carbide region; a third silicon carbide region of metal containing at least one element selected from the group consisting of nickel (Ni), palladium (Pd), and platinum (Pt), positioned between the first electrode and the second silicon carbide region and spaced apart from the first silicon carbide region; and a gate insulating layer positioned between the gate electrode and the second silicon carbide region.

Abstract: A semiconductor memory device according to an embodiment includes: a semiconductor layer; a gate electrode layer; a first insulating layer provided between the semiconductor layer and the gate electrode layer, the first insulating layer containing silicon (Si), nitrogen (N), and fluorine (F), and the first insulating layer including a first region; a second insulating layer provided between the first insulating layer and the gate electrode layer; and a charge storage layer provided between the first insulating layer and the second insulating layer, the charge storage layer containing silicon (Si) and nitrogen (N), and the charge storage layer including a second region, in which a second atomic ratio (N/Si) in the second region is larger than a first atomic ratio (N/Si) in the first region, and in which a first fluorine concentration in the first region is higher than a second fluorine concentration in the second region.

Abstract: According to one embodiment, a semiconductor memory device includes: a first interconnect layer; a second interconnect layer adjacent to the first interconnect layer; a semiconductor layer between the first and second interconnect layers; a first charge storage layer between the first interconnect layer and the semiconductor layer; and a second charge storage layer between the second interconnect layer and the semiconductor layer. A first distance between the first and second interconnect layers is shorter than a second distance between the first and second charge storage layers.

Abstract: According to one embodiment, a semiconductor memory device includes: a first interconnect layer; a second interconnect layer adjacent to the first interconnect layer; a semiconductor layer between the first and second interconnect layers; a first charge storage layer between the first interconnect layer and the semiconductor layer; and a second charge storage layer between the second interconnect layer and the semiconductor layer. A first distance between the first and second interconnect layers is shorter than a second distance between the first and second charge storage layers.

Abstract: A memcapacitor according to an embodiment includes a first electrode, a first dielectric layer provided on the first electrode, a plurality of variable resistance portions provided separately from each other on the first dielectric layer, a second dielectric layer provided on the first dielectric layer and between the variable resistance portions, and a second electrode provided on the variable resistance portions and the second dielectric layer. Each of the variable resistance portions is formed of a material that allows diffusion of metal atoms constituting the second electrode to inside of the variable resistance portion, and the second dielectric layer is formed of a material that prevents diffusion of the metal atoms constituting the second electrode to inside of the second dielectric layer.

Abstract: A semiconductor device according to an embodiment includes a metal layer; an n-type first silicon carbide region; and a second silicon carbide region of metal containing at least one element selected from the group consisting of nickel (Ni), palladium (Pd), and platinum (Pt) and positioned between the metal layer and the first silicon carbide region.

Abstract: A semiconductor device according to an embodiment includes a metal layer; an n-type first silicon carbide region; and a second silicon carbide region of metal containing at least one element selected from the group consisting of nickel (Ni), palladium (Pd), and platinum (Pt) and positioned between the metal layer and the first silicon carbide region.

Abstract: A semiconductor device according to an embodiment includes a first electrode; a second electrode; a gate electrode; an n-type first silicon carbide region positioned between the first electrode and the second electrode and between the gate electrode and the second electrode; a p-type second silicon carbide region positioned between the first electrode and the first silicon carbide region; a third silicon carbide region of metal containing at least one element selected from the group consisting of nickel (Ni), palladium (Pd), and platinum (Pt), positioned between the first electrode and the second silicon carbide region and spaced apart from the first silicon carbide region; and a gate insulating layer positioned between the gate electrode and the second silicon carbide region.

Abstract: According to an embodiment, a memory system includes a memory and a computation unit. Into the memory, data are written. The memory stores therein multiple check matrices. Each of the check matrices is associated with the number of errors in the written data. The computation unit is configured to perform a first error correction on the written data by selectively using, from among the check matrices, a check matrix associated with the number of errors recognized in the written data.

Abstract: According to an embodiment, a decoding device includes a variable node processor, a check node processor, a first forwarder, and a second forwarder. The variable node processor is configured to perform variable node processing on variable nodes defined by a code and output first messages. The check node processor is configured to perform check node processing on check nodes defined by the code based on the first messages and output second messages. The first forwarder is configured to forward one or more first messages remaining after excluding messages to be forwarded to one or more check nodes corresponding to one or more of the second messages having been stored in ae storage, to the check nodes. The second forwarder is configured to forward the second messages to the variable nodes and forward the one or more of the second messages to the storage.

Abstract: A memcapacitor according to an embodiment includes a first electrode, a first dielectric layer provided on the first electrode, a plurality of variable resistance portions provided separately from each other on the first dielectric layer, a second dielectric layer provided on the first dielectric layer and between the variable resistance portions, and a second electrode provided on the variable resistance portions and the second dielectric layer. Each of the variable resistance portions is formed of a material that allows diffusion of metal atoms constituting the second electrode to inside of the variable resistance portion, and the second dielectric layer is formed of a material that prevents diffusion of the metal atoms constituting the second electrode to inside of the second dielectric layer.

Abstract: According to an embodiment, an imaging element includes a plurality of light receiving elements, a plurality of scanning circuits, a first line comprising a plurality of nodes, and a plurality of first variable resistance elements. The plurality of scanning circuits are respectively connected to the plurality of light receiving elements. Each of the plurality of first variable resistance elements is connected between the corresponding one of the nodes and a corresponding one of the scanning circuits. At least one of the first variable resistance elements includes a plurality of resistance elements connected to each other in parallel.

Abstract: According to an embodiment, an authentication system includes a physical device, a calculator, and an authenticator. The physical device includes a data source which outputs a data sequence along time series. The calculator performs, using hidden Markov model, probability calculation on an ID which is based on the data sequence obtained from the physical device. The authenticator authenticates the physical device based on calculation result of the calculator.

Abstract: According to an embodiment, an information processing system includes a time constant processor and a pattern generator. The time constant processor binarizes values indicating a plurality of unit circuits each including a gate insulating film on the basis of a time to emission indicating a time from when a defect in the gate insulating film captures a carrier in a channel current caused to flow by application of a gate voltage to the unit circuits to when the defect emits the carrier. The pattern generator generates a pattern unique to the unit circuits using the values indicating the respective unit circuits binarized by the time constant processor.

Abstract: A semiconductor device of an embodiment includes a SiC layer having a surface, the surface inclined at an angle of 0° to 10° with respect to a {000-1} face or the surface having a normal line direction inclined at an angle of 80° to 90° with respect to a <000-1> direction, a gate electrode, a gate insulating layer provided between the surface and the gate electrode, and a region provided between the surface and the gate insulating layer, a maximum concentration of deuterium (D) in the region being 1×1020 cm?3 or more and a maximum concentration of hydrogen (H) in the region being 1×1019 cm?3 or less.

Abstract: According to an embodiment, a decoding device includes a check node processor, and a converter. The probability acquirer is configured to acquire. The check node processor is configured to perform check node processing during in a decoding operation of encoded data. A probability value for each bit of the encoded data is treated as an initial variable node in the check node processing. The converter is configured to convert, into bit values, updated values of the probability values based on the check node processing. The check node processor includes a check node circuit having a topology corresponding to a two-state trellis diagram representing the check node processing. The check node circuit includes conducting wires each corresponding to an edge of the two-state trellis diagram and includes switch units which are arranged on the conducting wires and switching of which is controlled according to a predetermined probability.

Abstract: According to an embodiment, a semiconductor device includes an error corrector, a read controller, and a majority processor. The error corrector is configured to perform error correction on data read from a storage, and output the number of errors contained in the data when errors cannot be corrected by the error correction. The read controller is configured to read pieces of data from a first address in the storage according to respective read conditions, select, from the read conditions, a read condition corresponding to a smallest of the numbers of errors obtained by the error correction performed on the pieces of data corresponding to the respective read conditions, and perform reading from the first address multiple times according to the selected read condition. The majority processor is configured to perform a majority process between a plurality of pieces of data obtained by the multiple times of reading.

Abstract: This semiconductor device comprises: a gate insulating film provided on a surface of a channel layer; a gate electrode provided on an upper surface of the gate insulating film; and a diffusion layer provided in the channel layer. Furthermore, this semiconductor device comprises: a polycrystalline silicon film provided so as to cover a surface of the gate electrode and the diffusion layer; and an inter-layer insulating film provided so as to cover the gate electrode and the polycrystalline silicon film.

Abstract: According to an embodiment, an authentication device includes an acquiring unit, a predicting unit, and an authenticating unit. The acquiring unit is configured to acquire performance information of a first device that is a device to be authenticated. The predicting unit is configured to predict performance information of a second device that is a device being a reference for authentication according to a change with time from initial performance information. The authenticating unit is configured to perform an authentication process of determining whether or not the first device falls into the second device on a basis of a degree of agreement between the performance information acquired by the acquiring unit and the performance information predicted by the predicting unit.