Abstract: Provided is a semiconductor package including a substrate, a first chip on the substrate and including a photonic integrated circuit (PIC), a second chip on the first chip and including an electronic integrated circuit (EIC), a support block spaced apart from the second chip and bonded to an upper surface of the first chip, a molding layer on the first chip and at least partially surrounding the second chip and the support block, with an upper surface of the support block free of the molding layer, a micro-lens layer on the molding layer, the first chip, and the support block, and a first transparent adhesive layer between a lower surface of the micro-lens layer and an upper surface of the molding layer, and between the lower surface of the micro-lens layer and the upper surface of the support block.

Abstract: A semiconductor package includes a first chip structure on a first substrate and a first molding layer surrounding the first chip structure on the first substrate, wherein the first chip structure includes a first chip including a PIC on the first substrate, a second chip including an EIC on the first chip, a transparent layer horizontally spaced from the second chip on the first chip, a microlens layer on the transparent layer; and a second molding layer surrounding the second chip, the transparent layer, and the microlens layer on the first chip, the semiconductor package further includes a first insulating layer on an upper surface of the first chip and a second insulating layer on a lower surface of the transparent layer, and the first and second 10 insulating layers are in contact with each other, and the first and second insulating layers are integrally formed of the same material.

Abstract: Semiconductor device packages may include a first semiconductor device over a substrate and a second semiconductor device over the first semiconductor device. An active surface of the second semiconductor device may face away from the substrate. Conductors may extend from bond pads of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to pads of routing members of the substrate. The conductors may be in contact with the bond pads and the routing members and a dielectric material interposed between the conductors and the first semiconductor device and between the conductors and the second semiconductor device. An encapsulant distinct from the dielectric material may cover the conductors, the first semiconductor device, the second semiconductor device, and an upper surface of the substrate. Methods of fabrication are also disclosed.

Abstract: Semiconductor device packages may include a first semiconductor device over a substrate and a second semiconductor device over the first semiconductor device. An active surface of the second semiconductor device may face away from the substrate. Conductors may extend from bond pads of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to pads of routing members of the substrate. The conductors may be in contact with the bond pads and the routing members and a dielectric material interposed between the conductors and the first semiconductor device and between the conductors and the second semiconductor device. An encapsulant distinct from the dielectric material may cover the conductors, the first semiconductor device, the second semiconductor device, and an upper surface of the substrate. Methods of fabrication are also disclosed.

Abstract: Semiconductor device packages may include a first semiconductor device over a substrate and a second semiconductor device over the first semiconductor device. An active surface of the second semiconductor device may face away from the substrate. Electrical interconnections may extend from bond pads of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to pads of routing members of the substrate. The electrical interconnections may include conductors in contact with the bond pads and the routing members and a dielectric material interposed between the conductors and the first semiconductor device, the second semiconductor device and the substrate between the bond pads and the pad of the routing members. An encapsulant distinct from the dielectric material may cover the electrical interconnections, the first semiconductor device, the second semiconductor device, and an upper surface of the substrate.

Abstract: Semiconductor device packages may include a first semiconductor device over a substrate and a second semiconductor device over the first semiconductor device. An active surface of the second semiconductor device may face away from the substrate. Electrical interconnections may extend from bond pads of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to pads of routing members of the substrate. The electrical interconnections may include conductors in contact with the bond pads and the routing members and a dielectric material interposed between the conductors and the first semiconductor device, the second semiconductor device and the substrate between the bond pads and the pad of the routing members. An encapsulant distinct from the dielectric material may cover the electrical interconnections, the first semiconductor device, the second semiconductor device, and an upper surface of the substrate.

Abstract: The present invention provides a signal processing apparatus and a signal processing method of a man-machine interface. The signal processing method comprises steps of: receiving a first touch signal; recognizing an object corresponding to the first touch signal; determining whether a second touch signal is received while receiving the first touch signal; and selecting the object corresponding to the first touch signal when receiving the second touch signal.

Abstract: An inference engine is configured to rank a plurality of clients using at least one parameter associated with each of the plurality of clients. The engine includes a user interface configured to enable a user to select the at least one parameter, a knowledge collection module configured to collect client information based on the at least one parameter, and a calculation module configured to receive the collected information and calculate a client listing using a parameter-based cost function.

Abstract: An image based control method and a image based processing method are applicable to a system including a controller and a terminal device. The control method includes the steps of receiving a selected image and displaying the selected image on a touch screen of the controller, in which the selected image is corresponding to a window-of-interest (WOI) of a terminal screen of the terminal device; receiving a user command corresponding to the selected image through the touch screen; and transferring a control command to the terminal device according to the user command for controlling the terminal device.

Abstract: The present invention provides a signal processing apparatus and a signal processing method of a man-machine interface. The signal processing method comprises steps of: receiving a first touch signal; recognizing an object corresponding to the first touch signal; determining whether a second touch signal is received while receiving the first touch signal; and selecting the object corresponding to the first touch signal when receiving the second touch signal.

Abstract: This invention discloses a method of specifying pin states for a memory chip having one or more pins. In one embodiment of the invention, the pins are prioritized to obtain a pin order, wherein the pin state of a pin of a higher order dominates the pin state of a pin of a lower order. A number of possible combinations of the pin states are generated for the pins based on the pin order. The possible combinations are presented using a data presentation format. At least one pin of a higher order dominates at least one pin of a lower order when the at least one pin of a higher order is set in a predetermined pin state, such that the number of the possible combinations presented is reduced by neglecting combinations generated by the pins states of the dominated pins.

Abstract: A customer impact estimation system to evaluate the impact to a customer by a revision of a technology process in microelectronics manufacturing includes a user interface configured to accept a predefined search scope and a predefined search scheme; an extraction module configured to search and extract information of a customer who has used a design technical documents database, wherein the design technical documents database include information related to the technology process; and an estimation module configured to analyze the information of the customer and evaluate that information for the impact to the customer by the revision of the technology process.

Abstract: A design coordination engine coordinates design implementation among a manufacturing facility, a customer, an IP vendor, and a design group during the design phase of a semiconductor device. The design coordination engine includes a tracking module configured to track design information updates in a design database. The design coordination engine also includes an alert module configured to notify a customer who has accessed a file associated with information updates that occurred during a predefined period of time.