Patents by Inventor Yu Jen Chen

Yu Jen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12362559
    Abstract: An embedded power supply apparatus is partially buried in an enclosed structure, is configured to provide a first DC voltage to a plurality of electronic devices, and includes a first power conversion circuit, a plurality of switch circuits, a human-machine interface module and a control circuit. The first power conversion circuit is configured to convert an input AC voltage into the first DC voltage and provide the first DC voltage to the switch circuits. The switch circuits each is configured to selectively transmit the first DC voltage to a corresponding electronic device of the electronic devices according to a corresponding first control signal of a plurality of first control signals. The control circuit is configured to receive a second control signal generated by the human-machine interface module, and generate the first control signals to the switch circuits according to the second control signal.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: July 15, 2025
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yu-Jen Chen, Chih-Yen Liu
  • Publication number: 20250197947
    Abstract: The present disclosure provides a method and a gene detection panel for evaluating treatment response, recurrence and survival by detecting genetic variants and their changes before and after concurrent chemoradiotherapy in tumor tissues of patients with esophageal cancer. The present disclosure develops a set of esophageal cancer NGS analysis panel. Aiming at 402 mutation sites including 35 genes that frequently occur in esophageal squamous cell carcinoma tissue cells, 62 pairs of esophageal squamous cell carcinoma tissues before and after CCRT are analyzed for specific site variation, hoping to find new predictive markers. The present disclosure combines these potential markers into an esophageal cancer detection panel, which has extremely high value for improving the prognosis of esophageal cancer.
    Type: Application
    Filed: December 12, 2024
    Publication date: June 19, 2025
    Inventors: Hung-Tai Wu, Yen-Su Huang, Hang Chang, Yu-Jen Chen, Pei-Wen Yang
  • Patent number: 12289877
    Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction substantially perpendicular to the first direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and each of the gate structures extending at least unilaterally substantially beyond a first side of the corresponding first or second active region that is proximal to the gap or a second side of the corresponding first or second active region that is distal to the gap; and some but not all of the gate structures also extending bilaterally substantially beyond each of the first and second sides of the corresponding first or second active region.
    Type: Grant
    Filed: November 27, 2023
    Date of Patent: April 29, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Jen Chen, Wen-Hsi Lee, Ling-Sung Wang, I-Shan Huang, Chan-yu Hung
  • Publication number: 20250077219
    Abstract: The present disclosure discloses an electronic system having firmware forward and backward compatibility mechanism. A read-only storage circuit stores first version firmware. A processing circuit configured to store the first version firmware from the read-only storage circuit to a readable and writable storage circuit to perform a system initialization, determine a version of second version firmware included in a driver received from a driver storage terminal is earlier than the first version firmware, merge a variable function having a first version content in the first version firmware and the variable function having a second version content in the second version firmware, replace a first version function pointer in the first version firmware by a second version function pointer in the second version firmware to generate updated firmware having a updated share data section and perform function call according to the updated share data section to continue performing system initialization.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Inventor: YU-JEN CHEN
  • Patent number: 12223123
    Abstract: Disclosed herein are teeth-operated mouth mouses and methods of using the same. In some embodiments, the teeth-operated mouth mouse includes a mounting conforming to a row of upper teeth in the oral cavity of a user; and a plurality of sensors independently disposed at a position corresponding to an individual tooth along the mounting and wirelessly coupled to the computer for transmitting and receiving signals therebetween; wherein, each of the plurality sensors is capable of performing at least one teeth-activating task selected from the group consisting of “moving to the right”, “moving to the left”, “moving forward”, “moving backward”, and “enter”. Also provided herein are methods of operating a computer with the aid of the disclosed teeth-operated mouth mouse.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: February 11, 2025
    Assignee: Mackay Memorial Hospital
    Inventor: Yu-Jen Chen
  • Publication number: 20240415859
    Abstract: The invention relates to a new use of Isorhoifolin and its derivatives. The invention provides uses of the Isorhoifolin derivatives for promoting regeneration of injured brain neurons and retinal neurons.
    Type: Application
    Filed: October 25, 2022
    Publication date: December 19, 2024
    Inventors: Linyi CHEN, Yu-Jen CHEN
  • Publication number: 20240404889
    Abstract: A non-active gate structure is formed over a shallow trench isolation (STI) region that is adjacent to at least one fin structure of a semiconductor device that includes a fin-based transistor. The non-active gate structure includes at least one support structure that extends from the gate in a direction that is approximately orthogonal to the direction in which the main body of the non-active gate structure extends. The support structure provides structural support for the non-active gate structure, which increases the stability of the non-active gate structure relative to a gate structure that does not include the support structure.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 5, 2024
    Inventors: Shih-Sian TU, Yu-Jen CHEN, Jhen-Wei CHEN
  • Publication number: 20240389445
    Abstract: A method of reducing splicing spacing of an OLED display panel splicing unit includes the steps of: A) preparing: preparing a semi-finished splicing unit having a substrate, the substrate having thereon a plurality of wires, a plurality of light-emitting components, a plurality of edge connecting pads, at least one baffle and a transparent gum; B) cutting: cutting off a portion of the substrate, with the portion cut off at least lying outside the at least one baffle, leaving intact at least the plurality of wires, the plurality of light-emitting components, the plurality of edge connecting pads and the transparent gum on the substrate; and C) partial degumming: removing a portion of the transparent gum to allow the plurality of edge connecting pads to be partially exposed and not covered with the transparent gum.
    Type: Application
    Filed: June 16, 2023
    Publication date: November 21, 2024
    Inventor: Yu-Jen CHEN
  • Publication number: 20240387487
    Abstract: A display panel splicing unit and a display panel spliced by the display panel splicing unit are provided. The display panel splicing unit has a splicing unit and a double-sided circuit substrate. The splicing unit has a transparent splicing board and a plurality of light-emitting components disposed on the transparent splicing board to emit light penetrating the transparent splicing board and thus traveling downward. The double-sided circuit substrate is not a printed circuit board (PCB) but is made of glass or ceramic and has a plurality of connecting elements for connecting wires on upper and lower surfaces of the double-sided circuit substrate, allowing a controller to be mounted thereon. Two splicing units share one double-sided circuit substrate and thus can be controlled with just one controller, allowing a display panel to be formed by splicing, using a small number of controllers.
    Type: Application
    Filed: June 16, 2023
    Publication date: November 21, 2024
    Inventor: Yu-Jen CHEN
  • Publication number: 20240387366
    Abstract: Disclosed are methods of manufacturing semiconductor devices that include the operations of forming an isolation structure in a semiconductor substrate, forming an active region adjacent the isolation structure, forming at least two primary polysilicon structures over the active region, the primary polysilicon structures defining a contacted polysilicon pitch (CPP), and forming a secondary polysilicon structure over the isolation structure. In some methods, the secondary polysilicon structure is further modified and/or replaced in order to provide additional functional elements on the semiconductor devices.
    Type: Application
    Filed: May 15, 2023
    Publication date: November 21, 2024
    Inventors: Yi-Ming LIN, Jhen-Wei CHEN, Ling-Sung WANG, Yu-Jen CHEN
  • Publication number: 20240379628
    Abstract: A splicing unit for display panels includes: a splicing board having an upper surface on which a plurality of main wires are disposed and at least one lateral surface defined as a splicing surface; a lead board having a lower surface on which a plurality of lead wires are disposed, at least one lateral surface defined as a lead splicing surface being flush with the splicing surface substantially, and an upper surface attached to a lower surface of the splicing board; and a plurality of bridging wires each having one end connected to one of the main wires and positioned proximate to the upper surface of the splicing board, a body extending and crossing the splicing surface and the lead splicing surface, and the other end connected to one of the lead wires and positioned proximate to the lower surface of the lead board.
    Type: Application
    Filed: June 16, 2023
    Publication date: November 14, 2024
    Inventor: Yu-Jen CHEN
  • Publication number: 20240288950
    Abstract: Disclosed herein are teeth-operated mouth mouses and methods of using the same. In some embodiments, the teeth-operated mouth mouse includes a mounting conforming to a row of upper teeth in the oral cavity of a user; and a plurality of sensors independently disposed at a position corresponding to an individual tooth along the mounting and wirelessly coupled to the computer for transmitting and receiving signals therebetween; wherein, each of the plurality sensors is capable of performing at least one teeth-activating task selected from the group consisting of “moving to the right”, “moving to the left”, “moving forward”, “moving backward”, and “enter”. Also provided herein are methods of operating a computer with the aid of the disclosed teeth-operated mouth mouse.
    Type: Application
    Filed: June 22, 2021
    Publication date: August 29, 2024
    Inventor: Yu-Jen CHEN
  • Patent number: 12062635
    Abstract: Semiconductor device packages may include a first semiconductor device over a substrate and a second semiconductor device over the first semiconductor device. An active surface of the second semiconductor device may face away from the substrate. Conductors may extend from bond pads of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to pads of routing members of the substrate. The conductors may be in contact with the bond pads and the routing members and a dielectric material interposed between the conductors and the first semiconductor device and between the conductors and the second semiconductor device. An encapsulant distinct from the dielectric material may cover the conductors, the first semiconductor device, the second semiconductor device, and an upper surface of the substrate. Methods of fabrication are also disclosed.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: August 13, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Po Chih Yang, Yu Jen Chen, Po Chen Kuo, Shih Wei Liang
  • Patent number: 12013736
    Abstract: A power supply system includes a plurality of power modules for supplying power to a load, and each power module provides an output current according to a modulation signal, and provides the output current to a power bus through an output end and supply the output current to the load through the power bus. Each power module is connected to a common-connected point of a signal bus to generate a second voltage level, acquires a first ratio according to a full-load output power of the conversion circuit corresponding to the controller and the full-load output power of the power module capable of outputting the maximum power, adjusts the first voltage level according to the first ratio and the second voltage level to adjust the amplified signal by adjusting the first voltage level, and adjusts the output current to a target value corresponding to the first ratio by adjusting the amplified signal.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: June 18, 2024
    Assignee: CHICONY POWER TECHNOLOGY CO., LTD.
    Inventors: Chin-Pin Chen, Yu-Jen Chen
  • Publication number: 20240119200
    Abstract: A method of building a characteristic model includes: acquiring raw electrical data from a measurement system outside one or more processing units; acquiring operational state-related data from an information collector inside the one or more processing units; performing a data annealing process on the raw electrical data and the operational state-related data to obtain and purified electrical data and purified operational state-related data; and performing a machine learning (ML)-based process to build the characteristic model based on the purified electrical data and the purified operational state-related data.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yu-Jen Chen, Chien-Chih Wang, Wen-Wen Hsieh, Ying-Yi Teng
  • Publication number: 20240090190
    Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction substantially perpendicular to the first direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and each of the gate structures extending at least unilaterally substantially beyond a first side of the corresponding first or second active region that is proximal to the gap or a second side of the corresponding first or second active region that is distal to the gap; and some but not all of the gate structures also extending bilaterally substantially beyond each of the first and second sides of the corresponding first or second active region.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Jen CHEN, Wen-Hsi LEE, Ling-Sung WANG, I-Shan HUANG, Chan-yu HUNG
  • Publication number: 20240007302
    Abstract: A data verification system comprises a provider-end computer apparatus and a request-end computer apparatus. The provider-end computer apparatus is configured to: receive a request of data from the request-end computer apparatus; retrieve a data cluster designated in the request of data; execute a first fingerprint process on an unrequested part of the data cluster, which includes everything in the data cluster other than a requested part so as to obtain an unrequested data fingerprint; and return the requested part of the data cluster and the unrequested data fingerprint to the request-end computer apparatus.
    Type: Application
    Filed: September 18, 2023
    Publication date: January 4, 2024
    Inventors: NAI-HO HSU, CHI-KUANG LEE, YU-JEN CHEN
  • Publication number: 20230409096
    Abstract: A power supply system includes a plurality of power modules for supplying power to a load, and each power module provides an output current according to a modulation signal, and provides the output current to a power bus through an output end and supply the output current to the load through the power bus. Each power module is connected to a common-connected point of a signal bus to generate a second voltage level, acquires a first ratio according to a full-load output power of the conversion circuit corresponding to the controller and the full-load output power of the power module capable of outputting the maximum power, adjusts the first voltage level according to the first ratio and the second voltage level to adjust the amplified signal by adjusting the first voltage level, and adjusts the output current to a target value corresponding to the first ratio by adjusting the amplified signal.
    Type: Application
    Filed: December 7, 2022
    Publication date: December 21, 2023
    Inventors: Chin-Pin CHEN, Yu-Jen CHEN
  • Patent number: 11844205
    Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and for each active region, a portion of each of some but not all of the gate structures (gate extension) extending partially into the gap; and when viewing the gate structures as a group, the group having a notched profile relative to the second direction, where notches in the notched profile correspond to ones of the gate structures which are substantially free of extending into the gap.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: December 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Jen Chen, Wen-Hsi Lee, Ling-Sung Wang, I-Shan Huang, Chan-yu Hung
  • Publication number: 20230385508
    Abstract: A semiconductor structure includes first and second active regions extending in a first direction. The semiconductor structure further includes gate electrodes extending in a second direction perpendicular to the first direction. Each of the gate electrodes includes a first segment over at least one of the first active region or the second active region; a gate extension extending beyond each of the first active region and the second active region, wherein the gate extension has a uniform width in the first direction, and a conductive element, wherein a width of the conductive element in the first direction increases as a distance from the gate extension increases along an entirety of the conductive element in the second direction.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 30, 2023
    Inventors: Yu-Jen CHEN, Ling-Sung WANG, I-Shan HUANG, Chan-yu HUNG