Abstract: A drying unit is disposed above a cleaning tank containing a cleaning liquid for cleaning semiconductor wafers W. A wafer boat holding semiconductor wafers moves between the cleaning tank and the drying unit. The drying unit has a fixed base surrounding an opening formed in the cleaning tank, a liftable top cover placed on the fixed base, and an O ring interposed between the fixed base and the liftable top cover. The liftable top cover can be moved vertically by a first lifting means.

Abstract: A cleaning and drying apparatus includes a cleaning bath 22 for collecting cleaning liquid for wafers, a drying chamber 23 arranged above the cleaning bath 22 to dry the wafers, a shutter 36 positioned between the cleaning bath 22 and the drying chamber 23 to define them communicably, a opening and closing mechanism 54 arranged outside a processing container to open and close the shutter 36, a connecting member 58 extending through an opening formed in an outer wall of the container to connect the shutter 36 with the mechanism 54, and a liquid sealing mechanism 60 for sealing the opening with sealing liquid. Another cleaning and drying apparatus is also provided with a wafer boat 24 for arranging the wafers at intervals horizontally and carrying the wafers, the drying chamber 23 which accommodate the wafers together with the wafer boat 24 for drying the wafers, dry-gas nozzles 37 for supplying dry gas to the wafers and a moving unit for moving the wafers in relation to the nozzles 37.

Abstract: A cleaning equipment generally comprises: a cleaning bath 30 for storing therein a cleaning solution to allow a semiconductor wafer W to be dipped in the cleaning solution to clean the surface of the wafer W; a cleaning solution supply pipe 33 for connecting the cleaning bath 30 to a pure water supply source 31; a chemical storing container 34 for storing therein a chemical; a chemical supply pipe 36 for connecting the cleaning solution supply pipe 33 to the chemical storing container 34 via an injection shut-off valve 35; and a diaphragm pump 37 for injecting a predetermined amount of chemical from the chemical storing container 34 into pure water flowing through the cleaning solution supply pipe 33. The temperature of the cleaning solution in the cleaning bath 30 is detected by, e.g., a temperature sensor 44.

Abstract: An enclosure 23A that defines a drying chamber 23 is configured of a pair of enclosing elements 23c and 23d and a base element 23b. When wafers enter or leave the drying chamber 23, the enclosing elements 23c and 23d are lifted upward by vertical air cylinders 42 to separate them from the base element 23b. The enclosing elements 23c and 23d are then moved in directions that mutually separate them. To dry wafers within the drying chamber 23, the enclosing elements and the base element 23b are mutually engaged to form a hermetic seal, in the opposite sequence.The present invention reduces the dimensions of the drying chamber without impeding the work of moving wafers into and out of the drying chamber. This makes it possible to reduce the internal volume of the drying chamber, achieving a reduction is the consumption of drying gas, an improvement in the drying efficiency, and a reduction in overall size of the apparatus.

Abstract: The purpose of the present invention is to provide a cleaning apparatus and a cleaning method which can prevent the object to be processed being subjected to a bad influence caused by a chemical treatment, have a high degree of freedom in designing the apparatus, make the cleaning process rapid and be designed in smaller size. In this cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 by a nitrogen-gas curtain 59c and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while screening it by the nitrogen-gas curtain 59c. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72.

Abstract: In order to remove water adhering to the surfaces of cleaned semiconductor wafers W, a vibration transmitting device 20 capable of approaching the surfaces of the semiconductor wafers W, and an oscillator 25 for applying an ultrasonic vibration to the vibration transmitting device 20. The oscillator 25 is driven to apply the ultrasonic vibration to the vibration transmitting plates 24 of the vibration transmitting device 20 and to apply energy of the ultrasonic vibration to a gas between the vibration transmitting device 20 and the surfaces of the semiconductor wafer W to remove water adhering the surfaces of the semiconductor wafers W. Thus, it is possible to surely remove water adhering to the surfaces of cleaned objects to be treated, to dry the objects without the need of a dry gas of an organic solvent vapor, such as IPA.

Abstract: Disclosed is a liquid treatment for an object to be processed, such as a semiconductor wafer or a glass LCD substrate, which is designed to remove any chemicals remaining in chemical supply nozzles and also improve the rinse capability and throughput. To that end, a processing liquid supply means is configured as jet nozzle pipes 40, a bottom surface 40c of each of the jet nozzle pipes 40 is inclined so as to slope downward from a chemical supply side thereof to an end portion, and the end portion is connected to a drain pipe 55 by a waste liquid orifice 40d and a drain valve 54. A chemical is supplied from nozzle orifices 40b of the jet nozzle pipes 40, the chemical is brought into contact with wafers W, and a treatment is performed thereby. Thereafter, a chemical-removing agent such as pure water or N.sub.2 is supplied through the jet nozzle pipes 40 to remove any remaining chemical from the jet nozzle pipes 40, then pure water is brought into contact with the wafers W to wash them.

Abstract: A cleaning tank 30 stores a cleaning liquid to clean the surfaces of semiconductor wafers W immersed in the cleaning liquid. A cleaning liquid supply pipe 33 connects the cleaning tank 30 to a pure water supply source 31. A chemical liquid container 34 stores a chemical liquid, and a chemical liquid supply pipe 36 connects the cleaning liquid supply pipe 33 to the chemical liquid container 34 via an infusion open/close switching valve 35, and a chemical liquid feed means is interposed in the chemical liquid supply pipe 36. The chemical liquid feed means is a reciprocal pump, such as diaphragm pump 37. Thus, a predetermined quantity of the chemical liquid can be infused into pure water or to a drying gas generator to ensure that the chemical liquid of a predetermined concentration be available for washing or drying treatment, regardless of fluctuations in flow amount or pressure of pure water or a drying gas carrier gas.

Abstract: A drying unit is disposed above a cleaning tank containing a cleaning liquid for cleaning semiconductor wafers W. A wafer boat holding semiconductor wafers moves between the cleaning tank and the drying unit. The drying unit has a fixed base surrounding an opening formed in the cleaning tank, a liftable top cover placed on the fixed base, and an O-ring interposed between the fixed base and the liftable top cover. The liftable top cover can be moved vertically by a first lifting means.

Abstract: A cleaning apparatus and a cleaning method for cleaning an object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A cleaning apparatus and a cleaning method for restricting an occurrence of water marks on a surface of a object to be processed are provided. The cleaning apparatus is constructed so as to dry wafers W, which have been rinsed by DIW in a drying chamber 42, in a cooling system. Thus, the reaction between, for example, IPA, DIW etc. and silicon in surfaces of the wafers W is inactivated to cause the surfaces to be oxidized with difficulty, so that it is possible to restrict the occurrence of the water marks on the surfaces.

Abstract: A drying treatment apparatus for drying cleaned semiconductor wafers comprises drying gas producing means (41) connected to a drying treating unit (30) through a drying gas supplying pipe line (32). A flowrate controlling diaphragm pump (50) is provided in an isopropyl alcohol (IPA) supplying pipe line (32) that connects an IPA tank (48) and the drying gas producing means (41). An N.sub.2 gas supply source (52) is provided for supplying nitrogen gas into the drying gas producing means (41), and a heater (44) is disposed within the drying gas producing means to produce a drying gas. As a result of this, the amount of the IPA supplied to the drying gas producing means (41) by the diaphragm pump (50) is controllable, thus enabling the concentration of the IPA contained in the drying gas to be maintained at a value within a range of from 3% to 80%, inclusive, and enabling the temperature of the drying gas to be maintained at a value within a range of from 80.degree. to 150.degree.

Abstract: A substrate transporting and processing system generally comprises: a supply section of a carrier 1 for housing therein wafers W to be processed, in a horizontal state; a discharge section of the carrier 1; a wafer unloading arm 14 for unloading the wafers W from said carrier 1; a wafer loading arm 16 for loading the wafers W into the carrier 1; an attitude changing unit 40 for changing the attitude of the wafers W between a horizontal state and a vertical state; a processing section 3 for suitably processing the wafers W; and a wafer transport arm 56 for delivering the wafers W between the attitude changing unit 40 and the processing section 3 and for transporting the wafers W into and from the processing section.

Abstract: A substrate drying device including a process chamber, a transferring device for transferring a substrate to/from the process chamber, a solvent vapor generating chamber having a container for receiving liquid organic solvent and a heater for heating the liquid organic solvent of the container to generate vapor of the organic solvent, a solvent supply unit for supplying the liquid organic solvent in the container, a first passage, communicating with the solvent vapor generating chamber and the process chamber, for passing vapor of the organic solvent, a second passage, communicating with the container of the solvent vapor generating chamber and the solvent supply unit, for passing liquid organic solvent, a flow rate controller for controlling flow rate of the liquid organic solvent to be supplied to the solvent vapor generating chamber from the solvent supply unit, and a control device for detecting a state of organic solvent of at least one of the solvent supply unit, the solvent vapor generating chamber, an

Abstract: Disclosed is a liquid treatment for an object to be processed, such as a semiconductor wafer or a glass LCD substrate, which is designed to remove any chemicals remaining in chemical supply nozzles and also improve the rinse capability and throughput. To that end, a processing liquid supply means is configured as jet nozzle pipes 40, a bottom surface 40c of each of the jet nozzle pipes 40 is inclined so as to slope downward from a chemical supply side thereof to an end portion, and the end portion is connected to a drain pipe 55 by a waste liquid orifice 40d and a drain valve 54. A chemical is supplied from nozzle orifices 40b of the jet nozzle pipes 40, the chemical is brought into contact with wafers W, and a treatment is performed thereby. Thereafter, a chemical-removing agent such as pure water or N.sub.2 is supplied through the jet nozzle pipes 40 to remove any remaining chemical from the jet nozzle pipes 40, then pure water is brought into contact with the wafers W to wash them.

Abstract: The substrate cleaning method for performing cleaning processing on a plurality of substrates disposed such that front surfaces of the substrates on which a circuit pattern is to be formed extend substantially in a vertical direction. This method includes a step of picking up substrates contained in a cassette, all together, from the cassette, a step of making front surfaces of adjacent substrates face each other without bringing the front surfaces into contact with each other, while making back surfaces of adjacent substrates face each other without bringing the back surfaces into contact with each other, the front surfaces of the adjacent substrates being situated with a pitch interval L.sub.1 interposed therebetween, and the pitch interval being set to be larger than a pitch interval L.sub.

Abstract: Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Abstract: The present invention relates to a cleaning treatment apparatus wherein two neighboring treatment chambers are allowed to communicate through a communicating opening provided in a lower portion of a separating wall that separates the two treatment chambers, and a movable treatment tank containing a treatment liquid is arranged in a movable manner within the two treatment chambers. The liquid contained in the movable treatment tank and the separating wall are in contact and the two treatment chambers are covered. This configuration ensures that the atmospheres in the two treatment chambers are mutually isolated so that the movable treatment tank can be used in both treatment chambers, the overall apparatus can be made more compact, and also the amount of treatment liquid used can be reduced. In addition, there is no need for a wafer conveyor means, so throughput can also be improved.

Abstract: A driving device comprises a first cover, a second cover telescopically engaging with the first cover, and a third cover surrounding the first and second covers. Part of a driving member for moving the second cover in relation to the first cover is arranged in a first space defined in the first cover. The first space is supplied with nitrogen, and pressure in the space is kept at a positive value. Gas is fed into and exhausted from a second space defined between the first and second covers, in accordance with a change in the volume thereof, whereby pressure in the second space is kept at a substantially constant value. Gas contained in a third space defined between the third cover and the first and second covers is exhausted, and pressure in the third space is kept at a negative value. Thus, the first space is completely isolated from a space around the driving device.

Abstract: A washing apparatus for performing a batch treatment of a plurality of wafers has a vessel and a wafer boat dedicated to the vessel and movable in the vertical direction. The boat has a fork, which supports the wafers in the vessel in a manner such that the wafers are spaced from one another at predetermined intervals. The wafers are received in a carrier, and are transferred to the boat by a rotary transfer arm. This arm has a fork for supporting the wafers during transfer thereof in a manner such that the wafers are spaced from one another at the predetermined intervals. Transfer of the rotary transfer arm is performed above the washing vessel by moving the boat up and down. At this time, the forks of the boat and arm engage with each other.