Abstract: There is provided a mounting substrate on which a semiconductor chip is mounted using a flip chip bonding, having a plurality of connection pads which are connected to the semiconductor chip, and an insulation layer formed in such a manner as to cover the connection pads partially, wherein the insulation layer includes a first insulation layer which is formed in such a manner as to correspond to a center of the semiconductor chip and a second insulation layer which is formed in such a manner as to surround the first insulation layer, and wherein the plurality of connection pads include first connection pads which are partially covered by the first insulation layer and second connection pads which are partially covered by the second insulation layer.

Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

Abstract: There is provided a mounting substrate on which a semiconductor chip is mounted using a flip chip bonding, having a plurality of connection pads which are connected to the semiconductor chip, and an insulation layer formed in such a manner as to cover the connection pads partially, wherein the insulation layer includes a first insulation layer which is formed in such a manner as to correspond to a center of the semiconductor chip and a second insulation layer which is formed in such a manner as to surround the first insulation layer, and wherein the plurality of connection pads include first connection pads which are partially covered by the first insulation layer and second connection pads which are partially covered by the second insulation layer.

Abstract: A novel premix for cooking by a microwave oven comprising flour, sugar, baking powder and emulsifier, characterized in that the moisture content of the flour ranges from 1.0 to 9.5 weight %. The premix has good storage property. Namely, deterioration of oils, color and taste are not observed and caking and gas generation do not occur.

Abstract: This invention provides a food material-container combination which allows the food material to be cooked and solidified by simple operations without a pot, and which simplifies the work of cleaning up after cooking. Referring to FIG. 1, a self-standing container 11 has an opening 12 at the top portion thereof. A food material such as tofu material is charged in the container 11 together with water. The upper portion 13 is sealed by folding it by hand. The container and contents are then thoroughly shaken, whereafter the content of the container 11 is heated by a microwave oven. After a prescribed period of heating, the container 11 is taken out from the microwave oven and the container is cut along the line 16. The end product can then be removed.

Abstract: An erectable container formed by folding a single base board, in which a bottom surface is made in a polygonal form having more than six sides of an even number, first and second side plates are alternately integrally provided extending from each side of the bottom surface provided with a concave fold line, a lid plate is integrally provided at the edge of the first side plate, a tab is integrally provided at the edge of the second side plate, the second side plate being provided with two first convex fold lines extending till upper ends from each vertex at the lower end thereof and the tab being provided with two second convex fold lines extending till upper ends from each end of the first convex fold lines and approaching toward each other with an inclination greater than that of the first convex fold lines, and the boundary line between the second side plate and the tab is made a concave fold at the portion between each end of the first convex fold.