Abstract: A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

Abstract: Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween. The method includes an assembled body forming step where the electronic part is mounted on the substrate with the metal particle paste interposed therebetween, an assembled body arranging step of arranging the assembled body between two heating plates opposite to one another, and a bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body by moving at least one of two heating plates to the other of two heating plates. The bonding step is performed under a condition that a temperature of the assembled body is within 0° C. to 150° C. In the bonding step, a metal particle paste minimally generates a sintering reaction.

Abstract: A semiconductor module includes: a first substrate having a first insulating substrate and a first conductor layer; a power device part having a first electrode, a second electrode and a gate electrode; a second substrate having a second insulating substrate, a second conductor layer and a third conductor layer wherein a hole is formed in the second insulating substrate, the second conductor layer has a bonding portion and a surrounding wall portion; an inner resin portion; a control IC; and an outer resin portion, wherein the first substrate, the power device part, the second substrate and the control IC are stacked in this order, a connector is disposed in the inside of the hole, and the gate electrode is electrically connected to a control signal output terminal of the control IC through a connector.

Abstract: A semiconductor module includes: a first substrate having a first insulating substrate and a first conductor layer; a power device part having a first electrode, a second electrode and a gate electrode; a second substrate having a second insulating substrate and a second conductor layer, wherein the second conductor layer has a bonding portion and a surrounding wall portion formed at a position which surrounds the bonding portion as viewed in a plan view; an inner resin portion; a control IC; and an outer resin portion, wherein the power device part is disposed such that the gate electrode is positioned outside a region defined by the surrounding wall portion as viewed in a plan view, and the gate electrode is electrically connected to an output terminal of the control IC through a connecting member.

Abstract: A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

Abstract: The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component.

Abstract: A semiconductor module according to one embodiment of the present invention includes: a first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.

Abstract: Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween. The method includes an assembled body forming step where the electronic part is mounted on the substrate with the metal particle paste interposed therebetween, an assembled body arranging step of arranging the assembled body between two heating plates opposite to one another, and a bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body by moving at least one of two heating plates to the other of two heating plates. The bonding step is performed under a condition that a temperature of the assembled body is within 0° C. to 150° C. In the bonding step, a metal particle paste minimally generates a sintering reaction.

Abstract: A semiconductor module according to one embodiment of the present invention includes: a first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.