Patents by Inventor Yuji Saga

Yuji Saga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180230290
    Abstract: The present invention relates to a thermally conductive polymer composition. The thermally conductive polymer composition comprises (a) 30 to 60 parts by weight of a polymer, and (b) 100 parts by weight of a boron nitride filler comprising, (b-1) 70 to 99 parts by weight of a spherical boron nitride filler, and (b-2) 1 to 30 parts by weight of a sheet boron nitride filler having a thickness of 5 to 500 nm, a surface area of 4 to 50 m2/g and an aspect ratio of 100:1 to 10000:1.
    Type: Application
    Filed: February 8, 2018
    Publication date: August 16, 2018
    Inventors: Yuji Saga, Takeshi Kondo, Yuri Noma, Takaaki Tomai, Itaru Honma
  • Patent number: 9090751
    Abstract: Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: July 28, 2015
    Assignee: Ticona LLC
    Inventors: Yuji Saga, Narumi Une
  • Publication number: 20150184056
    Abstract: Thermally conductive polymer compositions comprising polymer, highly moisture resistant magnesium oxide, and filler having higher aspect ratio than 5. The compositions are particularly useful for metal/polymer hybrid parts.
    Type: Application
    Filed: March 16, 2015
    Publication date: July 2, 2015
    Inventor: Yuji Saga
  • Patent number: 8980984
    Abstract: Thermally conductive polymer compositions comprising polymer, highly moisture resistant magnesium oxide, and filler having higher aspect ratio than 5. The compositions are particularly useful for metal/polymer hybrid parts.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: March 17, 2015
    Assignee: Ticona LLC
    Inventor: Yuji Saga
  • Patent number: 8877851
    Abstract: Polyester compositions comprising: 3 to 40 weight percent, preferably 3 to 30 weight percent, of at least one polyester, preferably polybutylene terephthalate, polytrimethylene terephthalate, polyethylene terephthalate, poly(ethylene 2,6-naphthoate), and poly(1,4-cyclohexyldimethylene terephthalate); 25 to 50 weight percent non-fibrous graphite, preferably a platy or particulate graphite; 10 to 40 weight percent inorganic filler selected from the group consisting of wollastonite, glass fibers, aramid fibers, ceramic fibers, potassium titanate whiskers, or combinations of them; 3 to 10 weight percent copolyether ester elastomer; wherein: the amount of a+b+c+d is 100 weight percent of the composition; the amount of b+c is at least 50 weight percent of the composition; the weight ratio of copolyether ester elastomer to polyester is from 0.3 to 0.4; and the composition has at least a 0.2 percent elongation, a thermal conductivity of at least 3 WmK, and a tensile strength of at least 25 MPa.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: November 4, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventor: Yuji Saga
  • Patent number: 8715534
    Abstract: The invention discloses an injection molding method for manufacture of a metal-resin composite member; wherein the resin composition used in the method includes a plurality of metal particles having one or more metal melting points between about 200° C. and 400° C.; the resin composition is heated to a temperature higher than the resin melting point and higher than one or more metal melting points to provide a heated resin composition; and wherein injecting the heated resin into a mold results in contact of the heated resin with one or more disposed heated metal member(s) to provide a composite member.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: May 6, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventor: Yuji Saga
  • Publication number: 20130292603
    Abstract: Polyester compositions comprising: 3 to 40 weight percent, preferably 3 to 30 weight percent, of at least one polyester, preferably polybutylene terephthalate, polytrimethylene terephthalate, polyethylene terephthalate, poly(ethylene 2,6-naphthoate), and poly(1,4-cyclohexyldimethylene terephthalate); 25 to 50 weight percent non-fibrous graphite, preferably a platy or particulate graphite; 10 to 40 weight percent inorganic filler selected from the group consisting of wollastonite, glass fibers, aramid fibers, ceramic fibers, potassium titanate whiskers, or combinations of them; 3 to 10 weight percent copolyether ester elastomer; wherein: the amount of a+b+c+d is 100 weight percent of the composition; the amount of b+c is at least 50 weight percent of the composition; the weight ratio of copolyether ester elastomer to polyester is from 0.3 to 0.4; and the composition has at least a 0.2 percent elongation, a thermal conductivity of at least 3 WmK, and a tensile strength of at least 25 MPa.
    Type: Application
    Filed: March 7, 2013
    Publication date: November 7, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Yuji Saga
  • Publication number: 20130200297
    Abstract: A thermally conductive polymer composition is disclosed including liquid crystalline polymer; graphite, talc and low aspect fibrous filler. The composition has a thermal conductivity of at least about 3 W/m·K.
    Type: Application
    Filed: February 18, 2011
    Publication date: August 8, 2013
    Inventor: Yuji Saga
  • Publication number: 20130062556
    Abstract: Thermally conductive polymer compositions comprising polymer, highly moisture resistant magnesium oxide, and filler having higher aspect ratio than 5. The compositions are particularly useful for metal/polymer hybrid parts.
    Type: Application
    Filed: July 21, 2010
    Publication date: March 14, 2013
    Inventor: Yuji Saga
  • Publication number: 20130003416
    Abstract: Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 3, 2013
    Inventors: Yuji Saga, Narumi Une
  • Patent number: 8293831
    Abstract: Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C.; a thermally conducting filler having a thermal conductivity of at least 5 W/mK, for instance CaF2 powder; and at least one hyperbranched polyesteramide having terminal hydroxy groups; and molded articles made therefrom.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: October 23, 2012
    Assignee: E I du Pont de Nemours and Company
    Inventors: Yuji Saga, Wei W. Zhang
  • Publication number: 20120157600
    Abstract: Disclosed are molded thermally conductive thermoplastic articles having low light reflectance, comprising thermoplastic polymers blended with thermally conductive fillers and carbon black powders. The polymer blends are characterized by a unique combination of high thermal conductiveness and low light reflectance. The molded articles in which such properties are desirable include, without limitation, a chassis structure for electrical and electronic devices wherein a light source is constructed inside and wherein heat is generated in the light source so as to be dissipated to an ambient atmosphere.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 21, 2012
    Applicant: E.I.DU PONT DE NEMOURS AND COMPANY
    Inventor: Yuji Saga
  • Publication number: 20120153217
    Abstract: Thermally conductive polymer resin compositions comprising polymer, calcium fluoride, fibrous filler and optionally, to polymeric toughening agent are particularly useful for producing composite members having metal members and polymer resin members.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 21, 2012
    Applicant: E.I.DU PONT DE NEMOURS AND COMPANY
    Inventor: Yuji Saga
  • Publication number: 20120080640
    Abstract: Thermally conductive resin compositions comprising polymer, calcium fluoride, fibrous filler and optionally, polymeric toughening agent are particularly useful for metal/polymer hybrid parts and as encapsulants.
    Type: Application
    Filed: September 29, 2011
    Publication date: April 5, 2012
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventor: Yuji Saga
  • Patent number: 8127445
    Abstract: Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: a) disposing the at least two heat transfer members in a mold cavity, such that said heat transfer members each have at least one exposed surface forming a surface of a resin injection cavity; and b) injecting a thermally conductive resin into the resin injection cavity to contact the exposed surfaces of the at least two heat transfer members, to form the integrated composite member; wherein the thermally conductive resin has a thermal conductivity of at least 0.7 W/mK or higher.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: March 6, 2012
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Yuji Saga, Narumi Une, Yoshinobu Uchida
  • Patent number: 8029694
    Abstract: A thermally conductive polymer composition comprising liquid crystalline polymer; metal alloy having a melting point of between about 200° C. and about 500° C.; and thermally conductive filler other than the metal alloy. The composition has a volume resistivity of at least about 1×1013 ?·cm and a thermal conductivity of at least about 0.7 W/m·K.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: October 4, 2011
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Yuji Saga
  • Patent number: 7999018
    Abstract: A thermoplastic resin composition having good electromagnetic shielding properties and high stiffness comprising thermoplastic polymer, metal alloy having a melting point of between about 200° C. and 500° C.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: August 16, 2011
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Yuji Saga
  • Patent number: 7989538
    Abstract: There is provided high temperature flame retarded polyamides which provide superior properties in molded articles while maintaining high flow in the molding process. The resin compositions include, in addition to the polyamide and flame retardant, talc and at least one inorganic reinforcing agent and/or filler other than talc. Processes for their preparation and articles made from these compositions are also disclosed.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: August 2, 2011
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Yuji Saga
  • Patent number: 7989526
    Abstract: There is provided high temperature flame retarded semiaromatic polyamides which provide superior properties in molded articles while maintaining high flow in the molding process. The resin compositions include, in addition to the polyamide and flame retardant, aromatic organic acid and at least one inorganic reinforcing agent and/or filler. Processes for their preparation and articles made from these compositions are also disclosed.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: August 2, 2011
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Yuji Saga
  • Patent number: 7939975
    Abstract: A stator assembly and a method for making a stator assembly wherein the stator assembly is over-molded with thermally conductive and electrically insulating polymer composition. The stator core of the stator assembly is coated with adhesive component to provide higher heat transfer at the interface of stator core and over-molded insulator and coil.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: May 10, 2011
    Assignee: E. I du Pont de Nemours and Company
    Inventors: Yuji Saga, Masahiro Matsuzaki, Yoko Matsuzaki, legal representative