Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.

Abstract: A semiconductor device including: an insulating substrate; a semiconductor element mounted on the insulating substrate; an internal printed circuit board disposed on the semiconductor element; and a sealing member that seals the semiconductor element, the internal printed circuit board, and at least a portion of the insulating substrate. The sealing member is made of a sealant that includes a resin and a pigment, and that initially has a chromatic, white, or gray color, and the sealing member degrades, thereby causing color of a front surface thereof to change to a degree recognizable by a user after the semiconductor device has been in use under a prescribed condition for a prescribed duration.

Abstract: A transmit-and-receive module includes a wiring substrate, a low-noise amplifier, a power amplifier, an insulating resin, and a conductive shield. The wiring substrate has a first surface and a second surface which is a back side of the first surface. The low-noise amplifier includes a first signal terminal and a first ground terminal. The first signal terminal is surface-mounted on the first surface. The power amplifier includes a second signal terminal and a second ground terminal. The second signal terminal and the second ground terminal are surface-mounted on the first surface. The insulating resin covers the low-noise amplifier and the power amplifier. The conductive shield covers a surface of the insulating resin. The first ground terminal is connected to the conductive shield.

Abstract: A communication module includes a power amplifier that amplifies a transmission signal having a first communication system or a second communication system and outputs an amplified signal to a signal path, a switch circuit that switches between a signal path for the first communication system and a signal path for the second communication system and outputs the amplified signal to one of the signal paths for the first communication system and the second communication system in accordance with a control signal supplied in accordance with the communication system of the transmission signal, and an impedance-matching network disposed between the power amplifier and the switch circuit, the impedance-matching network including a first variable capacitance element. The first variable capacitance element has a capacitance value that is controlled in accordance with the communication system of the transmission signal.

Abstract: A communication module includes a power amplifier that amplifies a transmission signal having a first communication system or a second communication system and outputs an amplified signal to a signal path, a switch circuit that switches between a signal path for the first communication system and a signal path for the second communication system and outputs the amplified signal to one of the signal paths for the first communication system and the second communication system in accordance with a control signal supplied in accordance with the communication system of the transmission signal, and an impedance-matching network disposed between the power amplifier and the switch circuit, the impedance-matching network including a first variable capacitance element. The first variable capacitance element has a capacitance value that is controlled in accordance with the communication system of the transmission signal.

Abstract: A transmit-and-receive module includes a wiring substrate, a low-noise amplifier, a power amplifier, an insulating resin, and a conductive shield. The wiring substrate has a first surface and a second surface which is a back side of the first surface. The low-noise amplifier includes a first signal terminal and a first ground terminal. The first signal terminal is surface-mounted on the first surface. The power amplifier includes a second signal terminal and a second ground terminal. The second signal terminal and the second ground terminal are surface-mounted on the first surface. The insulating resin covers the low-noise amplifier and the power amplifier. The conductive shield covers a surface of the insulating resin. The first ground terminal is connected to the conductive shield.

Abstract: Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.

Abstract: A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.

Abstract: To provide a multiband-support radio-frequency module in which the occurrence of a harmonic signal in an amplifier circuit is suppressed and the output of a radio-frequency signal containing unwanted harmonic components is prevented. A first signal path SL1 and a second signal path SL2 are provided such that they intersect each other at least once in a multilayer substrate 2, as viewed from above. With this configuration, high-output radio-frequency signals output from a first amplifier circuit 31 and a second amplifier circuit 32 can be prevented from interfering with other elements disposed in the multilayer substrate 2. It is thus possible to provide a multiband-support radio-frequency module 1 exhibiting excellent RF characteristics by suppressing the occurrence of harmonic signals in each of the first and second amplifier circuits 31 and 32 and by preventing the output of radio-frequency signals containing unwanted harmonic components.

Abstract: A semiconductor device including: an insulating substrate; a semiconductor element mounted on the insulating substrate; an internal printed circuit board disposed on the semiconductor element; and a sealing member that seals the semiconductor element, the internal printed circuit board, and at least a portion of the insulating substrate. The sealing member is made of a sealant that includes a resin and a pigment, and that initially has a chromatic, white, or gray color, and the sealing member degrades, thereby causing color of a front surface thereof to change to a degree recognizable by a user after the semiconductor device has been in use under a prescribed condition for a prescribed duration.

Abstract: To provide a multiband-support radio-frequency module in which the occurrence of a harmonic signal in an amplifier circuit is suppressed and the output of a radio-frequency signal containing unwanted harmonic components is prevented. A first signal path SL1 and a second signal path SL2 are provided such that they intersect each other at least once in a multilayer substrate 2, as viewed from above. With this configuration, high-output radio-frequency signals output from a first amplifier circuit 31 and a second amplifier circuit 32 can be prevented from interfering with other elements disposed in the multilayer substrate 2. It is thus possible to provide a multiband-support radio-frequency module 1 exhibiting excellent RF characteristics by suppressing the occurrence of harmonic signals in each of the first and second amplifier circuits 31 and 32 and by preventing the output of radio-frequency signals containing unwanted harmonic components.

Abstract: A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.

Abstract: A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.

Abstract: A duplexer module prevents a transmission signal and a reception signal in the same band from interfering with each other. The duplexer module includes a transmission line, a reception line, and an antenna common line. In addition, the duplexer module includes a plurality of mounting electrodes arranged along the four sides of an outer edge of a mounting surface of a multilayer substrate. The fourth mounting electrode defining a monitoring port is disposed on a side different from a side on which each of the first mounting electrode defining a transmission port, the second mounting electrode defining a reception port, and the third mounting electrode defining an antenna port is disposed. The fourth mounting electrode defining the monitoring port is a mounting electrode used to output a signal of the monitoring line through which a portion of electrical power is transmitted from the transmission line.

Abstract: In an antenna combining module, coupling of an inductor and individual signal lines provided in a matching circuit is prevented and minimized and isolation of lines from one another and communication performance are improved. The antenna combining module includes a duplexer DUP and a multilayer substrate. The multilayer substrate includes a reception signal line, a transmission signal line, an antenna common line, a matching line and a ground line. A wiring electrode for an inductor is inserted into the matching line from the mounting electrode for grounding up to the position where it combines with the antenna common line. The wiring electrode for the inductor wraps around the outside of a via hole filled with a conductive material of the antenna common line. The ground line is arranged between the wiring electrode for the inductor and the reception signal line, and the transmission signal line.

Abstract: A duplexer module prevents a transmission signal and a reception signal in the same band from interfering with each other. The duplexer module includes a transmission line, a reception line, and an antenna common line. In addition, the duplexer module includes a plurality of mounting electrodes arranged along the four sides of an outer edge of a mounting surface of a multilayer substrate. The fourth mounting electrode defining a monitoring port is disposed on a side different from a side on which each of the first mounting electrode defining a transmission port, the second mounting electrode defining a reception port, and the third mounting electrode defining an antenna port is disposed. The fourth mounting electrode defining the monitoring port is a mounting electrode used to output a signal of the monitoring line through which a portion of electrical power is transmitted from the transmission line.

Abstract: In an antenna combining module, coupling of an inductor and individual signal lines provided in a matching circuit is prevented and minimized and isolation of lines from one another and communication performance are improved. The antenna combining module includes a duplexer DUP and a multilayer substrate. The multilayer substrate includes a reception signal line, a transmission signal line, an antenna common line, a matching line and a ground line. A wiring electrode for an inductor is inserted into the matching line from the mounting electrode for grounding up to the position where it combines with the antenna common line. The wiring electrode for the inductor wraps around the outside of a via hole filled with a conductive material of the antenna common line. The ground line is arranged between the wiring electrode for the inductor and the reception signal line, and the transmission signal line.

Abstract: A duplexer module prevents a transmission signal and a reception signal in the same band from interfering with each other. The duplexer module includes a transmission line, a reception line, and an antenna common line. In addition, the duplexer module includes a plurality of mounting electrodes arranged along the four sides of an outer edge of a mounting surface of a multilayer substrate. The fourth mounting electrode defining a monitoring port is disposed on a side different from a side on which each of the first mounting electrode defining a transmission port, the second mounting electrode defining a reception port, and the third mounting electrode defining an antenna port is disposed. The fourth mounting electrode defining the monitoring port is a mounting electrode used to output a signal of the monitoring line through which a portion of electrical power is transmitted from the transmission line.

Abstract: A circuit board includes a recess in a principal surface thereof. An IC chip is mounted in the recess. An insulating resin is filled in the recess. Via-hole conductors are provided in the insulating resin. A ground electrode covers the recess filled with the insulating resin. First ends of the via-hole conductors are in contact with the ground electrode. Second ends of the via-hole conductors are in contact with the IC chip.