Abstract: A groove in which a curable resin is filled, is formed on the opposite side face of a face for reflecting light of an oscillating mirror unit. The groove extends so as to cross the swing axis of the oscillating mirror unit, seen from the opposite side of the reflection face of the oscillating mirror unit.

Abstract: An optical scanning device includes an oscillating mirror part, a torsion bar part, a piezoelectric element (driving part), a housing, and an optical element part. The oscillating mirror part includes a reflective surface capable of reflecting light from a first light source and a mass adjustment part formed on an opposite surface of the oscillating mirror part to the reflective surface and configured to be capable of reducing a mass thereof by exposure to laser light. The torsion bar part supports the oscillating mirror part. The piezoelectric element is configured to torsionally oscillate the oscillating mirror part about the torsion bar part. The housing accommodates the oscillating mirror part, the torsion bar part, and the piezoelectric element. The optical element part is configured to reflect or transmit the laser light from a second light source disposed outside of the housing to expose the mass adjustment part to the laser light.

Abstract: A surface acoustic wave filter includes a piezoelectric substrate, a lower-layer wiring line, an upper-layer wiring line, and an interlayer insulating film. The lower-layer wiring line is disposed on the piezoelectric substrate. The upper-layer wiring line crosses the lower-layer wiring line. The upper-layer wiring line has a potential that is different from the potential of the lower-layer wiring line. The interlayer insulating film is disposed between the lower-layer wiring line and the upper-layer wiring line. The interlayer insulating film has a portion that has a width that is not greater than the width of the upper-layer wiring line in a cross-sectional view taken along a direction in which the lower-layer wiring line extends.

Abstract: A groove in which a curable resin is filled, is formed on the opposite side face of a face for reflecting light of an oscillating mirror unit. The groove extends so as to cross the swing axis of the oscillating mirror unit, seen from the opposite side of the reflection face of the oscillating mirror unit.

Abstract: An optical scanning device includes an oscillating mirror part, a torsion bar part, a piezoelectric element (driving part), a housing, and an optical element part. The oscillating mirror part includes a reflective surface capable of reflecting light from a first light source and a mass adjustment part formed on an opposite surface of the oscillating mirror part to the reflective surface and configured to be capable of reducing a mass thereof by exposure to laser light. The torsion bar part supports the oscillating mirror part. The piezoelectric element is configured to torsionally oscillate the oscillating mirror part about the torsion bar part. The housing accommodates the oscillating mirror part, the torsion bar part, and the piezoelectric element. The optical element part is configured to reflect or transmit the laser light from a second light source disposed outside of the housing to expose the mass adjustment part to the laser light.

Abstract: A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded.

Abstract: The present invention provides a release agent containing polyolefin, isocyanate, polyolefin polyol and a metal complex catalyst, wherein the metal complex catalyst is a non-organotin compound.

Abstract: A method for manufacturing an electronic component includes a step of preparing a plurality of electrical elements, a step of preparing a base including a plurality of boards on which the plurality of electrical elements are to be mounted, respectively, a step of forming a resin on the base, a step of pressing the plurality of electrical elements against the resin to join portions of side surfaces of the plurality of electrical elements to the resin, a step of grinding the plurality of electrical elements to thin the plurality of electrical elements, and a step of dividing the base to form the plurality of board into individual pieces.

Abstract: A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded.

Abstract: A method of forming a wiring pattern which includes the steps of: forming a resist pattern having a shrinkage-inhibiting effect on a substrate; releasing gas from the resist pattern by baking the resist pattern; film-forming an electrode material on the substrate and the resist pattern while the temperature of the substrate is kept lower than the baking temperature of the resist pattern; and removing the electrode material on the resist pattern by separating the resist pattern from the substrate.

Abstract: A process for the formation of a wiring pattern, which includes the steps of: exposing a resist through a photomask, the photomask having a pattern whose line width is equal to or less than a resolution limit; and developing the exposed resist to form a resist pattern having groove depressions on the surface thereof, the depressions not reaching the back of the resist pattern. The resist may be a positive resist in which case the resist pattern is formed on an underplate feed film; a plating metal is precipitated on the feed film in a region not covered by the resist pattern; the resist pattern is stripped after the precipitation; and the feed film is selectively removed in a region not covered by the plating metal. Alternatively, the resist may be a negative resist in which case the resist pattern is formed on a substrate; a metallic material is deposited on the resist pattern and the substrate; and the resist is stripped from the substrate to remove the overlying metallic material.

Abstract: A method of forming a dielectric thin film pattern, comprises the steps of: depositing a dielectric thin film on a substrate having a resist pattern thereon by a vapor deposition method, wherein as a material for the dielectric thin film, at least one of CeO.sub.2, Sm.sub.2 O.sub.3, Dy.sub.2 O.sub.3, Y.sub.2 O.sub.3, TiO.sub.2, Al.sub.2 O.sub.3, and MgO is used; and removing the resist pattern whereby the dielectric thin film is patterned.