Patents by Inventor Yu-Jie Huang
Yu-Jie Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136183Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Ming-Hsi Yeh, Kuo-Bin Huang
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Publication number: 20240133841Abstract: A bio-field effect transistor (bioFET) system includes a bioFET configured to receive to a first voltage signal and output a current signal, where the current signal varies exponentially with respect to the first voltage signal. A logarithmic current-to-time converter is connected to the bioFET and is configured to receive the current signal and convert the current signal to a time domain signal. The time domain signal varies logarithmically with respect to the current signal, such that the time domain signal varies linearly with respect to the first voltage signal.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Jie Huang, Jui-Cheng Huang
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Publication number: 20240102959Abstract: An IC structure includes a biologically sensitive field-effect transistor (BioBET) in a semiconductor substrate, and a dielectric layer over a backside surface of the semiconductor substrate. The dielectric layer has a sensing well extending through the dielectric layer to a channel region of the BioFET. The IC structure further includes a biosensing film, a plurality of fluid channel walls, and a first heater. The biosensing film lines the sensing well in the dielectric layer. The fluid channel walls are over the biosensing film and define a fluid containment region over the sensing well of the dielectric layer. The first heater is in the semiconductor substrate. The first heater has at least a portion overlapping with the fluid containment region.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tung-Tsun CHEN, Yi-Hsing HSIAO, Jui-Cheng HUANG, Yu-Jie HUANG
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Patent number: 11940412Abstract: A biosensor system includes an array of biosensors with a plurality of electrodes situated proximate the biosensor. A controller is configured to selectively energize the plurality of electrodes to generate a DEP force to selectively position a test sample relative to the array of biosensors.Type: GrantFiled: August 9, 2022Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Jie Huang, Jui-Cheng Huang, Yi-Hsing Hsiao
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Patent number: 11934239Abstract: In an embodiment, a circuit includes: an error amplifier; a temperature sensor, wherein the temperature sensor is coupled to the error amplifier; a discrete time controller coupled to the error amplifier, wherein the discrete time controller comprises digital circuitry; a multiple bits quantizer coupled to the discrete time controller, wherein the multiple bits quantizer produces a digital code output; and a heating array coupled to the multiple bits quantizer, wherein the heating array is configured to generate heat based on the digital code output.Type: GrantFiled: December 6, 2021Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jui-Cheng Huang, Yi-Hsing Hsiao, Yu-Jie Huang, Tsung-Tsun Chen, Allen Timothy Chang
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Publication number: 20240085398Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Inventors: Kun-Lung Chen, Tung-Tsun Chen, Cheng-Hsiang Hsieh, Yu-Jie Huang, Jui-Cheng Huang
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Publication number: 20240053133Abstract: Curved surface measurement device comprises a plurality of vector sensors, each comprising: a main body and a vector device connected thereto. The vector device comprises a linear extension, with an end provided with a connector for connecting with the main body of another vector sensor; a sensing chip to sense the vector of gravity; a wireless communication circuit to transmit to the external a sensing value of the sensing chip. Computing device calculates the vector value of the end of the linear extension relative to the gravity, the result of which is a plurality of point representing a curve in the space. Method for preparation of the vector device is disclosed.Type: ApplicationFiled: January 19, 2023Publication date: February 15, 2024Inventors: Kuei Ann WEN, Yu Jie HUANG
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Publication number: 20240041367Abstract: A biosensor apparatus comprises a biosensor device and a cover that is configured to attach to the biosensor device. The biosensor device includes a surface section that is disposed above the user's skin and an implantable section that is injected into the user's skin. The implantable section includes a bending detector and sensing circuitry. The sensing circuitry includes one or multiples of a biomarker sensor array, a control biomarker sensor array, a temperature sensor, and/or a biofouling detector.Type: ApplicationFiled: August 10, 2023Publication date: February 8, 2024Inventors: Yu-Jie Huang, Jui-Cheng Huang, Allen Timothy Chang
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Publication number: 20240044889Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; and a cap structure attached to the buried oxide layer, the cap structure comprising a microneedle.Type: ApplicationFiled: August 10, 2023Publication date: February 8, 2024Inventors: Allen Timothy Chang, Jui-Cheng Huang, Wen-Chuan Tai, Yu-Jie Huang
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Publication number: 20240044837Abstract: A biosensor system includes an array of biosensors with a plurality of electrodes situated proximate the biosensor. A controller is configured to selectively energize the plurality of electrodes to generate a DEP force to selectively position a test sample relative to the array of biosensors.Type: ApplicationFiled: August 10, 2023Publication date: February 8, 2024Inventors: Yu-Jie Huang, Jui-Cheng Huang, Yi-Hsing Hsiao
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Patent number: 11892427Abstract: A bio-field effect transistor (bioFET) system includes a bioFET configured to receive to a first voltage signal and output a current signal, where the current signal varies exponentially with respect to the first voltage signal. A logarithmic current-to-time converter is connected to the bioFET and is configured to receive the current signal and convert the current signal to a time domain signal. The time domain signal varies logarithmically with respect to the current signal, such that the time domain signal varies linearly with respect to the first voltage signal.Type: GrantFiled: March 1, 2023Date of Patent: February 6, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Jie Huang, Jui-Cheng Huang
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Publication number: 20240036037Abstract: A fluidic cartridge module includes a casing, a biosensor package, and a fluidic channel. The casing includes a sample inlet and a buffer inlet, a biosensor package disposed in the casing and comprising a sensor array and a reference electrode. The fluidic channel is disposed over the biosensor package and connected to the sample inlet and the buffer inlet, wherein the fluidic channel includes a first opening aligned with the sensor array and a second opening aligned with the reference electrode.Type: ApplicationFiled: July 26, 2022Publication date: February 1, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Hsing Hsiao, Yu-Jie Huang, Tung-Tsun Chen
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Patent number: 11877847Abstract: A biosensor apparatus comprises a biosensor device and a cover that is configured to attach to the biosensor device. The biosensor device includes a surface section that is disposed above the user's skin and an implantable section that is injected into the user's skin. The implantable section includes a bending detector and sensing circuitry. The sensing circuitry includes one or multiples of a biomarker sensor array, a control biomarker sensor array, a temperature sensor, and/or a biofouling detector.Type: GrantFiled: December 18, 2020Date of Patent: January 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Jie Huang, Jui-Cheng Huang, Allen Timothy Chang
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Patent number: 11860120Abstract: An IC includes a source region and a drain region in a semiconductor layer. A channel region is between the source region and the drain region. A sensing well is on a back surface of the semiconductor layer and over the channel region. An interconnect structure is on a front surface of the semiconductor layer opposite the back surface of the semiconductor layer. A biosensing film lines the sensing well and contacts a bottom surface of the sensing well that is defined by the semiconductor layer. A coating of selective binding agent is over the biosensing film and configured to bind with a cardiac cell.Type: GrantFiled: August 31, 2020Date of Patent: January 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tung-Tsun Chen, Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
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Patent number: 11860121Abstract: An IC includes a source region and a drain region in a semiconductor layer. A channel region is between the source region and the drain region. A sensing well is on a back surface of the semiconductor layer and over the channel region. An interconnect structure is on a front surface of the semiconductor layer opposite the back surface of the semiconductor layer. A biosensing film lines the sensing well and contacts a bottom surface of the sensing well that is defined by the semiconductor layer. A coating of selective binding agent is over the biosensing film and configured to bind with a cardiac cell.Type: GrantFiled: August 9, 2022Date of Patent: January 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tung-Tsun Chen, Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
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Patent number: 11860152Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.Type: GrantFiled: July 8, 2020Date of Patent: January 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Kun-Lung Chen, Tung-Tsun Chen, Cheng-Hsiang Hsieh, Yu-Jie Huang, Jui-Cheng Huang
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Publication number: 20230393091Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; a carrier substrate on the MLI structure; a first through substrate via (TSV) structure extending though the carrier substrate and configured to provide an electrical connection between the MLI structure and a separate die; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; and a microfluidic channel cap structure attached to the buried oxide layer.Type: ApplicationFiled: August 17, 2023Publication date: December 7, 2023Inventors: Allen Timothy Chang, Jui-Cheng Huang, Wen-Chuan Tai, Yu-Jie Huang
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Publication number: 20230375500Abstract: A bioFET device includes a semiconductor substrate having a first surface and an opposite, parallel second surface and a plurality of bioFET sensors on the semiconductor substrate. Each of the bioFET sensors includes a gate formed on the first surface of the semiconductor substrate and a channel region formed within the semiconductor substrate beneath the gate and between source/drain (S/D) regions in the semiconductor substrate. The channel region includes a portion of the second surface of the semiconductor substrate. An isolation layer is disposed on the second surface of the semiconductor substrate. The isolation layer has an opening positioned over the channel region of more than one bioFET sensor of the plurality of bioFET sensors. An interface layer is disposed on the channel region of the more than one bioFET sensor in the opening.Type: ApplicationFiled: July 31, 2023Publication date: November 23, 2023Applicant: Tawian Semiconductor Manufacturing Co., Ltd.Inventors: Jui-Cheng Huang, Yi-Hsien Chang, Chin-Hua Wen, Chun-Ren Cheng, Shih-Fen Huang, Tung-Tsun Chen, Yu-Jie Huang, Ching-Hui Lin, Sean Cheng, Hector Chang
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Patent number: 11808731Abstract: A bioFET device includes a semiconductor substrate having a first surface and an opposite, parallel second surface and a plurality of bioFET sensors on the semiconductor substrate. Each of the bioFET sensors includes a gate formed on the first surface of the semiconductor substrate and a channel region formed within the semiconductor substrate beneath the gate and between source/drain (S/D) regions in the semiconductor substrate. The channel region includes a portion of the second surface of the semiconductor substrate. An isolation layer is disposed on the second surface of the semiconductor substrate. The isolation layer has an opening positioned over the channel region of more than one bioFET sensor of the plurality of bioFET sensors. An interface layer is disposed on the channel region of the more than one bioFET sensor in the opening.Type: GrantFiled: December 28, 2020Date of Patent: November 7, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jui-Cheng Huang, Yi-Hsien Chang, Chin-Hua Wen, Chun-Ren Cheng, Shih-Fen Huang, Tung-Tsun Chen, Yu-Jie Huang, Ching-Hui Lin, Sean Cheng, Hector Chang
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Patent number: 11791834Abstract: A semiconductor circuit and a method of operating the same are provided. The semiconductor circuit comprises a first digital-to-analog converter configured to generate a first output current in response to a first binary code, and a second digital-to-analog converter configured to generate a second output current in response to a second binary code associated with the first binary code. The semiconductor circuit further comprises a first current-to-voltage converter configured to generate a first candidate voltage based on the first output current, and a second current-to-voltage converter configured to generate a second candidate voltage based on the second output current. The semiconductor circuit further comprises a multiplexer configured to output the target voltage based on the first candidate voltage or the second candidate voltage. The target voltage includes a configurable range associated with the second binary code.Type: GrantFiled: February 15, 2022Date of Patent: October 17, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yu-Jie Huang, Mu-Shan Lin, Chien-Chun Tsai