Abstract: According to one embodiment, a wireless apparatus includes a first antenna and a second antenna. The first antenna is positioned on a first imaginary plane orthogonal to a rotation axis and includes a first main radiating element. The second antenna is positioned on a second imaginary plane orthogonal to the rotation axis and opposite to the first imaginary plane at a first space from the first imaginary plane and includes a second main radiating element. The second antenna is rotatable around the rotation axis and performs at least one of transmission and reception of electromagnetic wave to and from the first antenna, and at least one of the first main radiating element and the second main radiating element is displaced from the rotation axis.

Abstract: According to an embodiment, a signal conversion apparatus includes a control information generator and a selector. The control information generator generates first control information based on rate information indicating transmission rates of original signals. The first control information designates a first timing at which each of the original signals is sampled. The selector selects each of the sampled signals at a timing based on the first timing. The original signal group includes a first original signal at a first transmission rate and a second original signal at a second transmission rate. The first transmission rate is higher than the second transmission rate. The frequency of allocating the first timing to the first original signal is higher than a frequency of allocating the first timing to the second original signal.

Abstract: According to one embodiment, a radio device includes: a mounting board having a conductive plane; a semiconductor package mounted on the mounting board and having a interposer having a conductive plane, a semiconductor chip mounted on one surface of the interposer, and an antenna having a conductive element formed on the one surface and connected to the semiconductor chip; and a plurality of connection portions connecting the mounting board and the interposer. A first electrical length of the first connection portion which is nearest the conductive element among the plurality of connection portions or a second electrical length of the first connection portion including a conductive plane of the mounting board or interposer connected to the first connection portion is less than ½ wavelength of the operating frequency of the antenna.

Abstract: According to one embodiment, a wireless apparatus includes an antenna, a semiconductor chip and a board. The antenna comprises a radiating element includes a main radiating part. The semiconductor chip is connected with the antenna. The board has a first surface and a second surface, terminals are arranged on the first surface, and the semiconductor chip is arranged on the second surface. The main radiating part is arranged outside a first region and a second region, the first region is defined by imaginary lines passing through centers of peripheral terminals of the terminals, the second region is defined as a region where the first region is orthogonally projected onto the second surface.

Abstract: According to one embodiment, a wireless device includes a circuit board, a semiconductor chip, a nonconductive layer, and a conductive film. The semiconductor chip includes a transmitting/receiving circuit and is mounted on the circuit board. The nonconductive layer is to seal the semiconductor chip. The conductive film is to cover a surface of the nonconductive layer, the conductive film being provided with a plurality of apertures serving as radiating elements. At least one aperture of the plurality of apertures is fed with power.

Abstract: According to one embodiment, a wireless device is provided with a semiconductor chip, a substrate, an antenna, and a sealing material. The chip includes a wireless circuit. The substrate has a plurality of terminals arranged on a first surface and the chip arranged on a second surface. The antenna includes a radiation element and is electrically connected to the chip. The sealing material seals the chip and the antenna. A distance between a first wall of the sealing material substantially parallel to the second surface and the radiation element is equal to or more than a distance between a second wall of the sealing material substantially perpendicular to the second surface and the radiation element.

Abstract: According to an embodiment, a wireless communication device includes first and second wireless units. The first wireless unit includes a first reception antenna and a first transmission antenna in an enclosure, transmits a first wireless signal via the first transmission antenna, and receives a second wireless signal via the first reception antenna. The second wireless unit includes a second reception antenna and a second transmission antenna in the enclosure, transmits the second wireless signal via the second transmission antenna, and receives the first wireless signal via the second reception antenna. The first and second wireless units are disposed such that value of half distance between the first and second transmission antennas is smaller than value of a smaller one among a first shortest distance between the first transmission antenna and an inner wall of the enclosure, and a second shortest distance between the second transmission antenna and the inner wall.

Abstract: According to one embodiment, a semiconductor apparatus includes a substrate, a first semiconductor chip, a second semiconductor chip and a first converter. The first semiconductor chip includes a first surface and a second surface and is mounted on the substrate, the first surface is opposed to the substrate, the second surface is opposed to the first surface. The second semiconductor chip includes a first area and is stacked on the second surface. The first converter is arranged in the first area, the first converter is configured to perform at least one of analog-to-digital conversion and digital-to-analog conversion and arranged in the first area. A part of the first area does not overlap the first semiconductor chip when viewed from a direction perpendicular to the second surface.

Abstract: There is provided a radio device including an antenna, a first impedance converting circuit, a second impedance converting circuit and a differential output unit. The antenna has a first terminal and a second terminal to receive a signal. The first impedance converting circuit and the second impedance converting circuit have a first impedance and a second impedance, respectively. The first impedance and the second impedance each are controllable. One end of the first impedance converting circuit and one end of the second impedance converting circuit are connected to the first terminal and the second terminal of the antenna, respectively. The differential output unit is connected to the other end of the first impedance converting circuit and the other end of the second impedance converting circuit through which the signal received by the antenna is input to the differential output unit, and transform the signal into a differential signal.

Abstract: According to one embodiment, a wireless apparatus includes a substrate, a first semiconductor chip, a transmission line, a non-conductive layer, a conductive layer and a wire. The first semiconductor chip is arranged on the substrate and includes a circuit which transmits and receives a signal. The transmission line includes a first portion which is formed in at least one of the substrate and the first semiconductor chip. The non-conductive layer seals the first semiconductor chip. The conductive layer covers a surface of the non-conductive layer, an opening being formed in at least a part of the conductive layer. The wire is connected to the first portion so as to extend from the first portion toward the opening and is arranged in a position in which the opening is excited.

Abstract: According to one embodiment, a wireless device includes a board, a semiconductor chip, a radiation element, a sealing resin, a conductive layer, and a first conductive wall. The semiconductor chip is mounted on the board and includes a transmission/reception circuit. The radiation element is formed on the board. The sealing resin seals the semiconductor chip. The conductive layer covers at least a portion of a surface of the sealing resin. The first conductive wall is provided between the semiconductor chip and the radiation element and is connected to the conductive layer.

Abstract: According to one embodiment, a semiconductor apparatus includes a substrate, a first semiconductor chip, a second semiconductor chip and a first converter. The first semiconductor chip includes a first surface and a second surface and is mounted on the substrate, the first surface is opposed to the substrate, the second surface is opposed to the first surface. The second semiconductor chip includes a first area and is stacked on the second surface. The first converter is arranged in the first area, the first converter is configured to perform at least one of analog-to-digital conversion and digital-to-analog conversion and arranged in the first area. A part of the first area does not overlap the first semiconductor chip when viewed from a direction perpendicular to the second surface.

Abstract: According to one embodiment, a semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a discrete element part. The first semiconductor chip is arranged on the substrate and includes a first electrode group. The second semiconductor chip is arranged on the substrate and includes a second electrode group, at least one of electrodes included in the second electrode group being connected to at least one of electrodes included in the first electrode group via at least one bonding wire. The discrete element part is arranged on the substrate and under the at least one bonding wire.

Abstract: A transformer between waveguide and transmission-line includes a high-frequency circuit module, transmission-lines, a waveguide, and feed pins. The high-frequency circuit module has differential-pair terminals to input and output a differential signal. The transmission-lines are connected to the differential-pair terminals. The waveguide includes a first to third metal walls. The feed pins are connected to the transmission-lines inside of the waveguide. The feed pins have a first distance of approximately (?g/2) from each other. One of the feed pins has a second distance of approximately (?g*(1+2?)/4) from the third metal plane. “?g” is a wavelength in the waveguide and “?” is an integer which is equal or larger than “0”. Each of the feed pins has a third distance of approximately (a/2) from the first or second wall. “a” is length of the waveguide along the third metal wall.

Abstract: A stationary proximity wireless communication apparatus has an electromagnetic-wave transmitting and receiving part comprising a first indicator that indicates a zone to place a portable proximity wireless communication apparatus and an antenna that is installed in the zone to emit electromagnetic waves having directivity in a direction of a recommended optimum position suitable to place the portable proximity wireless communication apparatus in the zone from a position different from the recommended optimum position, and a wireless communication part configured to perform modulation and demodulation processes of electromagnetic waves transmitted and received at the antenna.

Abstract: According to one embodiment, a radio device comprises a differential antenna that has a pair of differential power supply terminals, a transmitter that transmits a first signal via the differential antenna, a receiver that has a pair of differential input terminals and receives a second signal via the differential antenna, a first control unit, and a second control unit. The first control unit causes a signal conduction state between the differential antenna and the receiver when the receiver receives the second signal. The second control unit switches from a signal conduction state to a signal block state between one of the differential input terminals and one of the differential power supply terminals based on a reception state when the receiver receives the second signal.

Abstract: According to one embodiment, a wireless device includes a circuit board, a semiconductor chip, a nonconductive layer, and a conductive film. The semiconductor chip includes a transmitting/receiving circuit and is mounted on the circuit board. The nonconductive layer is to seal the semiconductor chip. The conductive film is to cover a surface of the nonconductive layer, the conductive film being provided with a plurality of apertures serving as radiating elements. At least one aperture of the plurality of apertures is fed with power.

Abstract: According to the embodiments, a semiconductor package includes a semiconductor chip, a first conductive layer, a second conductive layer, and a power feeder. The semiconductor chip is provided on a substrate, is sealed with a resin, and contains a transmission/reception circuit. The first conductive layer is grounded and covers a first region on a surface of the resin. The second conductive layer is not grounded and covers a second region on the surface of the resin other than the first region. A power feeder electrically connects the semiconductor chip to the second conductive layer.

Abstract: According to one embodiment, a wireless device includes a circuit board, a semiconductor chip, a sealing resin, a conductive film, and an antenna element. The semiconductor chip includes a transmitting/receiving circuit and is mounted on the circuit board. The sealing resin seals the semiconductor chip. The conductive film covers a first surface portion of the sealing resin. An aperture is formed in a portion of the conductive film that corresponds to a second surface portion of the sealing resin other than the first surface portion, and the second surface portion is included in a side surface of the sealing resin and closest to an antenna terminal connected to the antenna element.

Abstract: According to one embodiment, a wireless device includes a board, a semiconductor chip, a radiation element, a sealing resin, a conductive layer, and a first conductive wall. The semiconductor chip is mounted on the board and includes a transmission/reception circuit. The radiation element is formed on the board. The sealing resin seals the semiconductor chip. The conductive layer covers at least a portion of a surface of the sealing resin. The first conductive wall is provided between the semiconductor chip and the radiation element and is connected to the conductive layer.