Abstract: The present embodiments provide a reduction catalyst realizing high reaction efficiency and a reduction reactor employing the catalyst. The reduction catalyst of the embodiment comprises an electric conductor and an organic layer having organic modifying groups placed on the surface of the conductor. The organic modifying groups have an aromatic ring having two or more nitrogen atoms. The reduction catalyst is used in a reduction reactor, and the reactor is also provided.

Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.

Abstract: The embodiments provide an electrode catalyst layer for an electrolysis cell, and also an electrolysis cell and a carbon dioxide electrolysis apparatus comprising that layer. The catalyst layer has a controlled porous structure, and can realize a high partial current density. The catalyst layer of the embodiment comprises carbonous catalyst carriers, a metallic catalyst loaded on the carriers, and an ion-conductive material. The catalyst layer contains pores of 5 to 200 ?m diameters, and the pores have a volume per weight of the catalyst layer in the range of 3.0 to 10 mL/g in total.

Abstract: A carbon dioxide electrolytic device of an embodiment includes: an anode part including an anode which oxidizes water or hydroxide ions to produce oxygen; a cathode part including a cathode which reduces carbon dioxide to produce a carbon compound, a cathode solution flow path which supplies a cathode solution to the cathode, and a gas flow path which supplies carbon dioxide to the cathode; a separator which separates the anode part and the cathode part; and a differential pressure control unit which controls a differential pressure between a pressure of the cathode solution and a pressure of the carbon dioxide so as to adjust a production amount of the carbon dioxide produced by a reduction reaction in the cathode part.

Abstract: An electrolysis cell for carbon dioxide of an embodiment includes: an anode part including an anode which oxidizes water or hydroxide ions to produce oxygen and an anode solution flow path which supplies an anode solution to the anode; a cathode part including a cathode which reduces carbon dioxide to produce a carbon compound, a cathode solution flow path which supplies a cathode solution to the cathode, and a gas flow path which supplies carbon dioxide to the cathode; and a separator which separates the anode part and the cathode part. The anode has a first surface in contact with the separator, and a second surface facing the anode solution flow path so that the anode solution is in contact with the anode.

Abstract: An electrochemical reaction device of an embodiment includes: a reaction tank which includes a first storage storing a first electrolytic solution containing carbon dioxide, and a second storage storing a second electrolytic solution containing water; a reduction electrode which is disposed at the first storage, an oxidation electrode which is disposed at the second storage; a counter electrode which is used for potential sweep using the reduction electrode as a working electrode; a first power supply which is electrically connected to the reduction electrode and the oxidation electrode, to generate a reduction reaction and an oxidation reaction; and a second power supply which is electrically connected to the reduction electrode and the counter electrode, to sweep a potential while setting an oxidation potential of the reduction electrode or less as an upper limit potential.

Abstract: An electrochemical reaction device, includes: an electrolytic solution tank including a first storage part to store a first electrolytic solution containing carbon dioxide, and a second storage part to store a second electrolytic solution containing Water: a reduction electrode disposed in the first storing part; an oxidation electrode disposed in the second storing part; a porous both disposed in the first storing part; and a flow path connecting the porous body and an outside of the electrolytic solution tank to supply gas containing carbon dioxide to the porous body.

Abstract: An electrochemical reaction device includes: an electrolytic solution tank to store an electrolytic solution; an oxidation electrode disposed in the electrolytic solution tank; a reduction electrode disposed in the electrolytic solution tank; and a generator connected to the oxidation electrode and the reduction electrode. At least one of the oxidation electrode or the reduction electrode has a porous structure containing fine pores.

Abstract: A carbon dioxide electrolytic device includes: an electrolysis cell including a cathode, an anode, cathode and anode flow paths, and a separator; a carbon dioxide source to supply carbon dioxide to the cathode flow path; a solution source to supply an electrolytic solution containing water to the anode flow path; at least one sensor to acquire at least one data of a data indicating a discharge amount per unit time of a liquid containing water to be discharged from at least one flow path and a data indicating a concentration of at least one ion in the liquid; a refresh material source including a gas source to supply a gaseous substance to the at least one flow path; and a controller programmed to stop the supply of the carbon dioxide and the electrolytic solution, and start supply of a gaseous substance from the refresh material source, in accordance with the at least one data.

Abstract: An electrochemical reaction device in an embodiment includes: a reaction unit including a first accommodation part to accommodate carbon dioxide and a second accommodation part to accommodate an electrolytic solution containing water; a reduction electrode to reduce the carbon dioxide; an oxidation electrode to oxidize the water; a power supply to pass current between the reduction electrode and the oxidation electrode; a pressure regulator to regulate a pressure in the first accommodation part; a reaction product detector to detect at least one of an amount and a kind of a substance produced at the reduction electrode; and a controller to control the pressure regulator based on a detection signal of the reaction product detector.

Abstract: A carbon dioxide electrolytic device comprises an electrolysis cell including: a cathode to reduce a first substance containing carbon dioxide and thus produce a first product containing a carbon compound; a cathode flow path which faces the cathode and through which a gas containing the carbon dioxide flows; an anode to oxidize a second substance containing water or a hydroxide and thus produce a second product containing oxygen; an anode flow path which faces the anode and through which an electrolytic solution containing the water or the hydroxide flows; a water-repellent porous body which faces the anode flow path and through which the second product flows; and a separator provided between the anode and the cathode.

Abstract: An electrochemical reaction device includes a first unit group having a plurality of first electrochemical reaction units and a second unit group having a plurality of second electrochemical reaction units. Respective electrolytic tanks of the plurality of first electrochemical reaction units are serially connected with each other. Respective electrolytic tanks of the plurality of second electrochemical reaction units are serially connected with each other. The electrolytic tanks of the plurality of second electrochemical reaction units are parallelly connected to the electrolytic tanks of the plurality of first electrochemical reaction units.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.

Abstract: Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.

Abstract: The present embodiments provide: a reduction catalyst having high reaction efficiency, a reduction reactor including the same and a reduction method using the same. This catalyst includes a conductor and an organic layer comprises organic modifying groups capable of binding to the surface of the conductor, wherein the organic modifying groups contain a nitrogen-containing heterocycle.

Abstract: An electrochemical reaction device includes: a first electrolytic solution tank having a first storage part and a second storage part; a second electrolytic solution tank having a third storage part and a fourth storage part; a first reduction electrode layer immersed in a first electrolytic solution; a first oxidation electrode layer immersed in a second electrolytic solution; a first generator electrically connected to the first reduction electrode and the first oxidation electrode layer; a second reduction electrode layer immersed in a third electrolytic solution; a second oxidation electrode layer immersed in a fourth electrolytic solution; a second generator electrically connected to the second reduction electrode and the second oxidation electrode layer; and at least one flow path out of a first flow path connecting the first storage part and the fourth storage part and a second flow path connecting the second storage part and the third storage part.