Abstract: A photosensitive composition for exposure to light having a wavelength of 300 nm or shorter, the photosensitive composition including: a coloring material; and a polymerizable monomer, in which the total content of the polymerizable monomer and a photopolymerization initiator is 15 mass % or lower with respect to the total solids content of the photosensitive composition.

Abstract: Provided are a photosensitive composition for pulse exposure including: a coloring material A; a photoradical polymerization initiator B; and a radically polymerizable compound C, in which a content of a radically polymerizable compound C1 having a weight-average molecular weight of 3000 or higher is 70 mass % or higher with respect to a total mass of the radically polymerizable compound C.

Abstract: Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 ?m is formed by heating the resin composition at 200° C. for 30 minutes, a rate of change ?A in an absorbance of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere, which is represented by Expression (1), is 50% or less; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device. In the following expression, ?A is the rate of change in the absorbance of the film after the heating treatment, A1 is a maximum value of an absorbance of the film before the heating treatment in a wavelength range of 400 to 1100 nm, and A2 is an absorbance of the film after the heating treatment, and is an absorbance at a wavelength showing the maximum value of the absorbance of the film before the heating treatment in a wavelength range of 400 to 1100 nm.

Abstract: Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 ?m is formed by heating the resin composition at 200° C. for 30 minutes, a thickness of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere is 70% or more of a thickness of the film before the heating treatment; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device.

Abstract: Provided are a photosensitive resin composition including a colorant, a resin, a polymerizable compound, a photopolymerization initiator, an ultraviolet absorber, and a solvent, in which the colorant includes at least one phthalocyanine pigment selected from Color Index Pigment Blue 15:3 or Color Index Pigment Blue 15:4, and includes 50 mass % or more of the phthalocyanine pigment, and the ultraviolet absorber is contained in an amount of 0.1 to 10 mass % in a total solid content of the photosensitive resin composition; a cured film using the photosensitive resin composition; a color filter; a solid-state imaging element; and an image display device.

Abstract: Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.

Abstract: Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.

Abstract: A method of producing a pattern includes a step of forming a photocurable composition layer on a support, using a photocurable composition including a color material and a resin and having an acid value of a solid content of 1 to 25 mgKOH/g; a step of patternwise exposing the photocurable composition layer; and a step of treating the photocurable composition layer in an unexposed area using a developer including an organic solvent, thereby performing development.

Abstract: Provided is a photosensitive composition including a radically polymerizable compound, a photoradical polymerization initiator, and at least one selected from a chain transfer agent or a radical trapping agent.

Abstract: Provided are a photosensitive composition for pulse exposure including: a coloring material A; a photoradical polymerization initiator B; and a radically polymerizable compound C, in which a content of a radically polymerizable compound C1 having a weight-average molecular weight of 3000 or higher is 70 mass % or higher with respect to a total mass of the radically polymerizable compound C.

Abstract: Provided is a photosensitive composition for exposure to light having a wavelength of 300 nm or shorter, the photosensitive composition including: a coloring material; and a polymerizable monomer, in which a total content of the polymerizable monomer and a photopolymerization initiator is 15 mass % or lower with respect to a total solid content of the photosensitive composition.

Abstract: Provided is a photosensitive composition for pulse exposure including: a coloring material A; a photoinitiator B; and a compound C that is cured by reacting with an active species generated from the photoinitiator B, in which the photoinitiator B includes a photoinitiator b1 that satisfies the following condition 1. Condition 1: after a propylene glycol monomethyl ether acetate solution including 0.035 mmol/L of the photoinitiator b1 is exposed to pulses of light having a wavelength of 355 nm under conditions of maximum instantaneous illuminance: 375000000 W/m2, pulse duration: 8 nanoseconds, and frequency: 10 Hz, a quantum yield q355 is 0.05 or higher.

Abstract: Provided is a photosensitive coloring composition with which a pixel having excellent adhesiveness with a support and excellent rectangularity can be formed. In addition, provided is also a method of manufacturing an optical filter including a pixel having excellent adhesiveness with a support and excellent rectangularity. This photosensitive coloring composition is a photosensitive coloring composition for exposure to light having a wavelength of 300 nm or shorter, the photosensitive coloring composition including a coloring material and a curable compound. In a case where a film having a thickness of 0.5 ?m after drying is formed using the photosensitive coloring composition, an optical density of the above-described film with respect to light having a wavelength of 248 nm is 1.6 or higher. It is preferable that a content of the coloring material is 50 mass % or higher with respect to a total solid content of the photosensitive coloring composition.

Abstract: Provided is a method of manufacturing an optical filter in which a pixel having excellent rectangularity can be accurately formed in a region that is partitioned by a partition wall or at a position corresponding to the region partitioned by the partition wall.

Abstract: Provided is a composition with which a film having a lower refractive index and reduced defects can be formed. In addition, provided are a film forming method and a method of manufacturing an optical sensor. This composition includes colloidal silica particles and a solvent. In the colloidal silica particles, an average particle size D1 that is measured using a dynamic light scattering method is 25 to 1000 nm and a ratio D1/D2 of the average particle size D1 to an average particle size D2 that is obtained from a specific surface area of the colloidal silica particles measured using a nitrogen adsorption method is 3 or higher. The solvent includes a solvent A1 having a boiling point of 245° C. or higher and a solubility parameter of lower than 11.3 (cal/cm3)0.5 and a solvent A2 having a boiling point of 120° C. or higher and lower than 245° C. and a solubility parameter of 11.3 (cal/cm3)0.5 or higher.

Abstract: Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.

Abstract: There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 ?m or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 ?m or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.

Abstract: An object of the present invention is to provide a near-infrared-absorbing composition capable of forming a cured film having excellent heat resistance while maintaining strong near-infrared shielding properties when a cured film is produced. The near-infrared-absorbing composition of the present invention includes a copper complex obtained by reacting two or more kinds of sulfonic acids represented by General Formula (I) described below or salts thereof with a copper component and a solvent.

Abstract: Provided are an infrared-light-blocking composition capable of forming an infrared-light-blocking layer having excellent light-transmitting performance in the visible region and having excellent light-blocking performance in the infrared region; an infrared-light-blocking layer; an infrared cut-off filter; and a camera module. An infrared-light-blocking composition of the invention contains inorganic microparticles and a dispersing agent, and the infrared-light-blocking layer formed from the infrared-light-blocking composition has a transmittance at a wavelength of 1,000 nm of 60% or less, a transmittance at a wavelength of 1,100 nm of 50% or less, and a transmittance at a wavelength of 500 nm of 80% or more.

Abstract: An object of the present invention is to provide a composition for forming a far-infrared radiation shielding layer which is able to form a layer having excellent far-infrared radiation shielding properties. A composition for forming a far-infrared radiation shielding layer of the present invention contains at least inorganic fine particles and a dispersant.