Abstract: There is disclosed a resist composition, wherein the composition is used in a lithography and comprises at least: a polymer (A) that becomes a base resin whose alkaline-solubility changes by an acid, a photo acid generator (B) generating a sulfonic acid represented by the following general formula (1) by responding to a high energy beam, and a polymer additive (C) represented by the following general formula (2). There can be provided a resist composition showing not only excellent lithography properties but also a high receding contact angle, and in addition, being capable of suppressing a blob defect in both the immersion exposures using and not using a top coat; and a patterning process using the same.

Abstract: The invention provides a resist top coat composition wherein the composition contains polymer (P1-1) with a weight-average molecular weight of 1,000 to 500,000, having at least repeating units represented by the following general formulae (1a), (1b-1), and (1c). There can be a resist top coat composition having excellent water repellent and water sliding properties with fewer development defects and with a good resist pattern profile after development, and a patterning process using this composition.