Abstract: A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

Abstract: To provide a mesh member such that a static charge can be suppressed. Provided is a mesh member including a mesh woven fabric and a coating layer that is formed on the surface of the mesh woven fabric and contains a carbon nanotube and/or graphene.

Abstract: To better fulfill a sleep-inducing function for a seated person, a seat device includes a pressing device provided in a seat back and configured to press a back or a waist of a seated person to induce breathing; at least one of a temperature adjusting device configured to change a temperature of a seat cushion and/or the seat back and a shape adjusting device configured to change a surface shape of the seat cushion and/or the seat back; and a controller configured to control the pressing device to press the back or the waist of the seated person at a set cycle corresponding to a breathing cycle of a person at a sleeping time, and control the at least one of the temperature adjusting device and the shape adjusting device.

Abstract: An object of the present invention is to suppress a crack in a sealing resin and a warpage in a semiconductor device in a power semiconductor device. A power semiconductor device includes: a semiconductor element; a terminal; a chassis; and a sealing resin sealing the semiconductor element and the terminal in the chassis. The sealing resin includes: a first sealing resin covering at least the semiconductor element; and a second sealing resin formed on an upper portion of the first sealing resin, and in an operation temperature of the semiconductor element, the first sealing resin has a smaller linear expansion coefficient than the second sealing resin, and a difference of a linear expansion coefficient between the first sealing resin and the terminal is smaller than a difference of a linear expansion coefficient between the second sealing resin and the terminal.

Abstract: The time required to complete current-to-target state transitions of a plurality of movable portions constituting a seat is shortened. A seat unit 1 includes an occupant support portion S1, a plurality of movable mechanisms respectively moving a plurality of parts constituting the occupant support portion S1, and an ECU 40 controlling respective operations of the plurality of movable mechanisms. The ECU 40 causes each of the plurality of movable mechanisms to undergo a transition from a current state to a target state and the plurality of movable mechanisms have a first movable mechanism requiring a longest time for the transition. The ECU 40 causes the transitions of the plurality of movable mechanisms other than the first movable mechanism to be completed by completion of the transition of the first movable mechanism from the current state to the target state.

Abstract: A semiconductor chip (6) is disposed on the insulation substrate (2). A lead frame (8) is bonded to an upper surface of the semiconductor chip (6). A sealing resin (12) covers the semiconductor chip (6), the insulation substrate (2), and the lead frame (8). A stress mitigation resin (13) having a lower elastic modulus than that of the sealing resin (12) is partially applied to an end of the lead frame (8).

Abstract: Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.

Abstract: To provide a mesh member such that a static charge can be suppressed. Provided is a mesh member including a mesh woven fabric and a coating layer that is formed on the surface of the mesh woven fabric and contains a carbon nanotube and/or graphene.

Abstract: An object of the present invention is to provide a highly reliable semiconductor device that allows voids remaining in a bonding material to be reduced. The semiconductor device includes a semiconductor chip, an insulation substrate, a metal base plate, a resin section, and a bump. The semiconductor chip is warped into a concave shape. On the insulation substrate, the semiconductor chip is mounted by bonding. The metal base plate has the insulation substrate mounted thereon and has a heat dissipation property. The resin section seals the insulation substrate and the semiconductor chip. The bump is disposed in a joint between the semiconductor chip and the insulation substrate. A warp amount of the semiconductor chip warped into a concave shape is equal to or greater than 1 ?m and less than a height of the bump.

Abstract: An object of the present invention is to suppress a crack in a sealing resin and a warpage in a semiconductor device in a power semiconductor device. A power semiconductor device includes: a semiconductor element; a terminal; a chassis; and a sealing resin sealing the semiconductor element and the terminal in the chassis. The sealing resin includes: a first sealing resin covering at least the semiconductor element; and a second sealing resin formed on an upper portion of the first sealing resin, and in an operation temperature of the semiconductor element, the first sealing resin has a smaller linear expansion coefficient than the second sealing resin, and a difference of a linear expansion coefficient between the first sealing resin and the terminal is smaller than a difference of a linear expansion coefficient between the second sealing resin and the terminal.

Abstract: The time required to complete current-to-target state transitions of a plurality of movable portions constituting a seat is shortened. A seat unit 1 includes an occupant support portion S1, a plurality of movable mechanisms respectively moving a plurality of parts constituting the occupant support portion S1, and an ECU 40 controlling respective operations of the plurality of movable mechanisms. The ECU 40 causes each of the plurality of movable mechanisms to undergo a transition from a current state to a target state and the plurality of movable mechanisms have a first movable mechanism requiring a longest time for the transition. The ECU 40 causes the transitions of the plurality of movable mechanisms other than the first movable mechanism to be completed by completion of the transition of the first movable mechanism from the current state to the target state.

Abstract: A semiconductor chip (6) is disposed on the insulation substrate (2). A lead frame (8) is bonded to an upper surface of the semiconductor chip (6). A sealing resin (12) covers the semiconductor chip (6), the insulation substrate (2), and the lead frame (8). A stress mitigation resin (13) having a lower elastic modulus than that of the sealing resin (12) is partially applied to an end of the lead frame (8).

Abstract: An object of the present invention is to provide a highly reliable semiconductor device that allows voids remaining in a bonding material to be reduced. The semiconductor device includes a semiconductor chip, an insulation substrate, a metal base plate, a resin section, and a bump. The semiconductor chip is warped into a concave shape. On the insulation substrate, the semiconductor chip is mounted by bonding. The metal base plate has the insulation substrate mounted thereon and has a heat dissipation property. The resin section seals the insulation substrate and the semiconductor chip. The bump is disposed in a joint between the semiconductor chip and the insulation substrate. A warp amount of the semiconductor chip warped into a concave shape is equal to or greater than 1 ?m and less than a height of the bump.

Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Abstract: An electronic device includes a housing having an opening, a connection terminal located in an opening in the housing, and a terminal cover including a first resin member having a first surface facing the connection terminal and a second surface located opposite to the first surface and a second resin member located on the second surface. At least a portion of the second resin member covers a depression located on an outer peripheral portion of the first surface of the first resin member.

Abstract: Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.

Abstract: A semiconductor device includes: a plurality of input circuits each of which receives one of an analog signal and a digital signal, the input circuits being supplied a power supply; a selector that selects one of the input circuits; and an analog-to-digital (AD) converter that performs AD conversion of an analog signal input to the selected input circuit. After the selector selects one of the input circuits, the selector selects another of the input circuits. When the selector selects one of the input circuits and one digital signal of others of the input circuits is changed, the selector does not select another of the input circuits.

Abstract: A control device includes: a display, at least one processor, and a memory configured to store a parameter and instructions that, when executed by the at least one processor, causes the control device to: determine whether a parameter of a controllable device can be changed, when the parameter of the controllable device is possible to change, display a first screen for manipulating the parameter of the controllable device on the display and update the parameter of the controllable device by user's manipulation, and when the parameter of the controllable device is not possible to change, display the second screen on the display and lock the parameter of the controllable device.

Abstract: A lead frame includes a plurality of circuit patterns which each have a die pad and an electrode terminal portion and are disposed in a band shape, a tie bar, a frame portion and a suspension lead. Cut are a connection portion between electrode terminals and the frame portion, a connection portion between the frame portion and the tie bar at both end portions in a disposition direction of circuit patterns, and a connection portion from a connection part of the frame portion with the tie bar, between the circuit patterns to a part of the frame portion extending in the disposition direction. The electrode terminal portion is bent to extend to a direction of an upper surface of a semiconductor element. The lead frame is collectively resin-sealed while exposing the tie bar and the electrode terminal portion above the tie bar.

Abstract: A semiconductor device includes: a plurality of input circuits each of which receives one of an analog signal and a digital signal, the input circuits being supplied a power supply; a selector that selects one of the input circuits; and an analog-to-digital (AD) converter that performs AD conversion of an analog signal input to the selected input circuit. After the selector selects one of the input circuits, the selector selects another of the input circuits. When the selector selects one of the input circuits and one digital signal of others of the input circuits is changed, the selector does not select another of the input circuits.