Abstract: Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate; a casing that produces a heat treatment atmosphere by the heat treating plate; a movable top board that is movable between a ceiling surface of the casing and the heat treating plate; and a controller that causes the movable top board to be moved to a raised position when the substrate is loaded/unloaded, and causes the movable top board to be moved to a lowered position when the substrate is placed on the heat treating plate for performing the heat treatment, thereby controlling the lowered position for every substrate.

Abstract: A substrate treating apparatus includes an indexer division, stories, and a controller. Each of the stories includes a first rack, a treating section, and a main transport mechanism. The indexer division includes a carrier rack and a transport device. The transport device performs a feeding operation for transporting substrates from a carrier placed on the carrier rack to the first rack. The transport device further performs an inter-story transporting operation for transporting the substrates between two first racks provided for different stories.

Abstract: A substrate treating apparatus includes the following elements: an indexer block including indexer robots provided for respective carrier receivers and disposed in horizontally fixed positions, each of the indexer robots having arms for taking substrates out of a carrier and loading the substrates into the carrier on the carrier receiver; a bridge block disposed adjacent the indexer block; and a treating block including a plurality of stacked stories each having at least one treating unit. The bridge block includes a buffer, a pass having a plurality of tables covering a range from a bottom story to a top story of the plurality of stories, and two bridge robots each having an arm for transferring the substrates to and from the pass.

Abstract: Disclosed is a substrate treating apparatus including a first liquid treatment chamber that performs a liquid treatment to a substrate, a second liquid treatment chamber that is disposed below the first liquid treatment chamber and performs a liquid treatment to a substrate, a first feed channel that supplies gases to the first liquid treatment chamber, and a second feed channel that supplies gases to the second liquid treatment chamber. The first feed channel includes a first vertical member that extends substantially vertically. The second feed channel includes a second vertical member that extends substantially vertically. The first vertical member and the second vertical member both extend to a position lower in level than the second liquid treatment chamber.

Abstract: A treating liquid vaporizing apparatus includes a buffer tank for storing a treating liquid, a vaporizing container connected to the buffer tank for vaporizing the treating liquid, a further vaporizing container connected to the buffer tank in parallel with the vaporizing container for vaporizing the treating liquid, a switch valve for opening and closing a flow path of the treating liquid between the buffer tank and the vaporizing container, and a switch valve for opening and closing a flow path of the treating liquid between the buffer tank and the further vaporizing container.

Abstract: A substrate treating apparatus includes an indexer division, stories, and a controller. Each of the stories includes a first rack, a treating section, and a main transport mechanism. The indexer division includes a carrier rack and a transport device. The transport device performs a feeding operation for transporting substrates from a carrier placed on the carrier rack to the first rack. The transport device further performs an inter-story transporting operation for transporting the substrates between two first racks provided for different stories.

Abstract: A substrate treating apparatus includes the following elements: an indexer block including indexer robots provided for respective carrier receivers and disposed in horizontally fixed positions, each of the indexer robots having arms for taking substrates out of a carrier and loading the substrates into the carrier on the carrier receiver; a bridge block disposed adjacent the indexer block; and a treating block including a plurality of stacked stories each having at least one treating unit. The bridge block includes a buffer, a pass having a plurality of tables covering a range from a bottom story to a top story of the plurality of stories, and two bridge robots each having an arm for transferring the substrates to and from the pass.

Abstract: A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.

Abstract: Disclosed is a substrate treating apparatus including a first liquid treatment chamber that performs a liquid treatment to a substrate, a second liquid treatment chamber that is disposed below the first liquid treatment chamber and performs a liquid treatment to a substrate, a first feed channel that supplies gases to the first liquid treatment chamber, and a second feed channel that supplies gases to the second liquid treatment chamber. The first feed channel includes a first vertical member that extends substantially vertically. The second feed channel includes a second vertical member that extends substantially vertically. The first vertical member and the second vertical member both extend to a position lower in level than the second liquid treatment chamber.

Abstract: Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate; a casing that produces a heat treatment atmosphere by the heat treating plate; a movable top board that is movable between a ceiling surface of the casing and the heat treating plate; and a controller that causes the movable top board to be moved to a raised position when the substrate is loaded/unloaded, and causes the movable top board to be moved to a lowered position when the substrate is placed on the heat treating plate for performing the heat treatment, thereby controlling the lowered position for every substrate.

Abstract: A substrate is held and rotated by a spin chuck. A processing liquid is discharged from a discharger to the substrate rotated by the spin chuck. The discharger has a plurality of discharge ports arranged in one direction and can selectively discharge the processing liquid from the plurality of respective discharge ports. With a row of the plurality of discharge ports of the discharger crossing and facing a peripheral portion of the substrate rotated by the spin chuck, the processing liquid is supplied to a position further outward than an inner edge of the peripheral portion. The processing liquid is not supplied to a position further inward than the inner edge of the peripheral portion of the substrate.

Abstract: A substrate treating apparatus includes a treating section for treating substrates. The treating section has a front face and a rear face both connectable to an indexer section for feeding the substrates to the treating section. Such substrate treating apparatus can improve the degree of freedom for arranging the treating section and the indexer section.

Abstract: One processing block is arranged between an indexer block and another processing block. One substrate is transported to a main transport mechanism in the one processing block by a main transport mechanism in the indexer block, transported to a first processing section and a thermal processing section by the main transport mechanism in the one processing block and processing is performed on the substrate. The substrate after the processing is transported to the main transport mechanism in the indexer block by the main transport mechanism in the one processing block. Another substrate is transported to a sub-transport mechanism in a sub-transport chamber by the main transport mechanism in the indexer block, and is transported to a main transport mechanism in another processing block by the sub-transport mechanism in the sub-transport chamber.

Abstract: A substrate is transported to a coating processing unit. An annular region of one surface of the substrate is processed. The substrate is carried into an edge exposure unit. Positions of a peripheral edge of the substrate and an inner edge of the annular region are detected. A position deviation amount of a center of the substrate held by a spin chuck from a rotation center of the spin chuck is calculated. Based on schedule management information, a relationship between orientations of the substrate held by the spin chuck at the time of carrying of the substrate into the coating processing unit and the substrate held by the substrate rotation unit at the time of carrying of the substrate into the edge exposure unit is specified. Based on the relationship, a position deviation direction of the center of the substrate from the rotation center is determined.

Abstract: An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.

Abstract: A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.

Abstract: Positions of an outer periphery of a rotating substrate and a processing liquid nozzle are detected. An amplitude of a change with time of the position of the outer periphery of the substrate detected during rotation is acquired. In a direction passing through a rotational center and parallel with the rotating substrate, a relative position of the processing liquid nozzle with respect to the spin chuck is periodically changed at a frequency equal to a rotational frequency of the spin chuck and the acquired amplitude. A difference between a phase of a change with time of the position of the processing liquid nozzle and a phase of a change with time of the position of the outer periphery of the substrate is adjusted to not more than a predetermined value. A processing liquid is discharged from the processing liquid nozzle to a peripheral portion of the rotating substrate.

Abstract: A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.

Abstract: A substrate is held and rotated by a spin chuck. A processing liquid is discharged from a discharger to the substrate rotated by the spin chuck. The discharger has a plurality of discharge ports arranged in one direction and can selectively discharge the processing liquid from the plurality of respective discharge ports. With a row of the plurality of discharge ports of the discharger crossing and facing a peripheral portion of the substrate rotated by the spin chuck, the processing liquid is supplied to a position further outward than an inner edge of the peripheral portion. The processing liquid is not supplied to a position further inward than the inner edge of the peripheral portion of the substrate.

Abstract: An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.