Patents by Inventor Yukihiro Hyobu
Yukihiro Hyobu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8480348Abstract: Arbitrary pieces of semiconductor wafers are supported flexibly on either the upper side or the lower side. The present invention is a thin plate container for supporting plural semiconductor wafers for use in carriage, storage, processing, etc. It comprises processing trays plurally stacked in a state of each supporting at least one semiconductor wafer individually and a coupling mechanism for integrally coupling the processing trays in a state where the processing trays are plurally stacked and separating the processing trays at an arbitrary location. Each processing tray has a one-side support for supporting at least one semiconductor wafer on its one side and the other-side support mutually fitted to the one-side support of the other processing tray on the other side to form a housing space sealed off from the external environment for constraining and supporting the thin plate.Type: GrantFiled: September 20, 2006Date of Patent: July 9, 2013Assignee: Miraial Co., Ltd.Inventors: Yukihiro Hyobu, Atsushi Osada
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Patent number: 8397917Abstract: A wafer-retaining unit has a plurality of vertically superimposed single-wafer retaining sections, each having a wafer-retaining frame abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer, a wafer-securing frame disposed vertically movably relative to the wafer-retaining frame to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer, and wafer lift members that lift the semiconductor wafer to a position where it is upwardly separate from the wafer-retaining frame and keeps the semiconductor wafer in this position. Consequently, a plurality of semiconductor wafers can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers. At the same time, the semiconductor wafers can be loaded and unloaded satisfactorily.Type: GrantFiled: February 19, 2008Date of Patent: March 19, 2013Assignee: Miraial Co., Ltd.Inventors: Nobuyuki Kasama, Yukihiro Hyobu
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Patent number: 7922000Abstract: A thin plate container includes: a tray stack for holding and housing semiconductor wafers in spaces between a plurality of stacked, removable loading trays; and an external container for housing the tray stack. At opposite ends of each of the loading trays, a pair of grips for engagement by a processing arm of an external apparatus is provided. The external container includes: a container body; a lid; a sealing material provided between the lid and the container body to seal the inside; a pair of tray stack supporters for supporting the tray stack; and tray stack retainers for holding and supporting the tray stack housed in the container body from above and below.Type: GrantFiled: February 13, 2007Date of Patent: April 12, 2011Assignee: Miraial Co., Ltd.Inventor: Yukihiro Hyobu
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Patent number: 7854327Abstract: A loading tray 13 supports at least one thin plate safely and reliably. It comprises a first loading portion 18, provided on one side thereof, on which at least one thin plate is loaded; a second loading portion 19, provided on the other side thereof, fitted to the first loading portion 18 of adjacent loading tray 13 to form a housing space sealed off from the external environment, for sandwiching the thin plate within the housing space, and for loading the thin plate on the loading tray when the loading tray is placed upside-down; a hook 30, provided on one side thereof, for coupling with an adjacent loading tray 13; and a hook locking mechanism 31, provided on the other side thereof, for coupling with the hook 30 of an adjacent loading tray 13. As many loading trays 13 as the number of the thin plate is stacked to constitute a thin plate container 11. The thin plate container 11 can support the thin plate from both upper and lower sides.Type: GrantFiled: November 28, 2006Date of Patent: December 21, 2010Assignee: MIRAIAL Co., Ltd.Inventor: Yukihiro Hyobu
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Publication number: 20100276324Abstract: A thin board container is composed of a tray storing body for stacking a plurality of placing trays which can be removed from each other, and storing semiconductor wafers by sandwiching the semiconductor wafers in spaces between the placing trays; and an external container for storing the tray storing body inside. At the both facing side ends of each placing tray, a pair of holding sections wherein the processing arms of an external mechanical device fit for holding the tray are arranged. The external container is provided with a container main body; a cover body; and a sealing material arranged between the cover body and the container main body for sealing the inside; a pair of tray storing body supporting sections for supporting the tray storing body; and a tray storing body holder for supporting the tray storing body stored in the container main body by holding the tray storing body from the bottom surface side and the cover body side.Type: ApplicationFiled: February 13, 2007Publication date: November 4, 2010Applicant: MIRAIAL CO., LTD.Inventor: Yukihiro Hyobu
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Patent number: 7722095Abstract: The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35.Type: GrantFiled: April 13, 2005Date of Patent: May 25, 2010Assignee: Miraial Co., Ltd.Inventors: Yukihiro Hyobu, Chiaki Matsutori, Tadahiro Obayashi
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Publication number: 20090297303Abstract: Arbitrary pieces of semiconductor wafers are supported flexibly on either the upper side or the lower side. The present invention is a thin plate container for supporting plural semiconductor wafers for use in carriage, storage, processing, etc. It comprises processing trays plurally stacked in a state of each supporting at least one semiconductor wafer individually and a coupling mechanism for integrally coupling the processing trays in a state where the processing trays are plurally stacked and separating the processing trays at an arbitrary location. Each processing tray has a one-side support for supporting at least one semiconductor wafer on its one side and the other-side support mutually fitted to the one-side support of the other processing tray on the other side to form a housing space sealed off from the external environment for constraining and supporting the thin plate.Type: ApplicationFiled: September 20, 2006Publication date: December 3, 2009Applicant: MIRAIAL CO., LTD.Inventors: Yukihiro Hyobu, Atsushi Osada
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Publication number: 20090250374Abstract: A wafer-retaining unit (20) has a plurality of vertically superimposed single-wafer retaining sections (21 to 23), each having a wafer-retaining frame (21) abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer (W), a wafer-securing frame (22) disposed vertically movably relative to the wafer-retaining frame (21) to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer (W), and wafer lift members (23) that lift up the semiconductor wafer (W) to a position where it is upwardly separate from the wafer-retaining frame (21) and keep the semiconductor wafer (W) in this position. Consequently, a plurality of semiconductor wafers (W) can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers (W). At the same time, the semiconductor wafers (W) can be loaded and unloaded satisfactorily.Type: ApplicationFiled: February 19, 2008Publication date: October 8, 2009Applicant: MIRAIAL CO., LTD.Inventors: Nobuyuki Kasama, Yukihiro Hyobu
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Publication number: 20090038987Abstract: A loading tray 13 supports at least one thin plate safely and reliably. It comprises a first loading portion 18, provided on one side thereof, on which at least one thin plate is loaded; a second loading portion 19, provided on the other side thereof, fitted to the first loading portion 18 of adjacent loading tray 13 to form a housing space sealed off from the external environment, for sandwiching the thin plate within the housing space, and for loading the thin plate on the loading tray when the loading tray is placed upside-down; a hook 30, provided on one side thereof, for coupling with an adjacent loading tray 13; and a hook locking mechanism 31, provided on the other side thereof, for coupling with the hook 30 of an adjacent loading tray 13. As many loading trays 13 as the number of the thin plate is stacked to constitute a thin plate container 11. The thin plate container 11 can support the thin plate from both upper and lower sides.Type: ApplicationFiled: November 28, 2006Publication date: February 12, 2009Applicant: MIRAIAL CO., LTD.Inventor: Yukihiro Hyobu
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Publication number: 20090009861Abstract: An optical sheet of the present invention is constituted by a micro-lens array sheet formed with a flat face and a back face having micro lenses aligned laterally and longitudinally and an anisotropic light-absorbing sheet with different light absorbing properties depending on incident angle of incident light entering an incident face arranged oppositely and proximally to each other. The optical sheet may be constituted by the micro-lens array sheet, the anisotropic light-absorbing sheet, a pinhole array sheet and a light diffusing sheet arranged proximally in this order. In an image display device of the present invention, the optical sheet of the present invention is arranged proximally to a display face of an image display element. The anisotropic light-absorbing sheet of the present invention has through cavities surrounded by light-absorbing side walls mutually sharing the side walls and collected closely in a large number.Type: ApplicationFiled: February 13, 2007Publication date: January 8, 2009Applicant: MIRAIAL CO., LTDInventor: Yukihiro Hyobu
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Patent number: 7314068Abstract: While gas in a general storage container with no gas inlet and in the storage container with the gas inlet is replaced in a short time, the semiconductor wafer surface is cleaned. In an apparatus for replacing gas in a semiconductor wafer storage container which includes a lid unit and a storage container main body with a gas inlet, the apparatus includes gas introducing means for introducing the gas into the storage container main body, gas evacuating means for evacuating the gas in the storage container main body, and gas circulating means for circulating the gas in the storage container main body through a chemical adsorption filter. Gas introducing means for introducing the gas from a gap between the storage container main body and the lid unit while the lid unit is opened in the storage container mounting means is provided in the storage container with no gas inlet.Type: GrantFiled: April 20, 2005Date of Patent: January 1, 2008Assignee: Miraial Co., Ltd.Inventors: Ryuichi Nakano, Yukihiro Hyobu, Yoshihisa Okamoto
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Publication number: 20060268404Abstract: In a screen using a microlens array, it is an object of the present invention to provide a low cost rear projection type screen with favorable contrast achieved by improving effect of blocking external light without reducing the luminance and the view angle characteristics and also to provide a rear projection type screen free from image quality degradation over a prolonged period due to its resistance to dust adhesion. The rear projection type screen has at least a transparent microlens array sheet 1 having a transparent microlens 3 which are arrayed on one surface thereof and which condenses parallel incident light on a focus, and a directional light absorbing sheet 2 having an aperture which transmits light from a specific direction and absorbs other light. The aperture is a pinhole array having an apertured pinhole 5 arrayed near the focus of the microlens 3. The aperture part of the pinhole is shaped into a truncated cone.Type: ApplicationFiled: May 17, 2006Publication date: November 30, 2006Applicant: MIRAIAL CO., LTD.Inventor: Yukihiro Hyobu
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Publication number: 20060244256Abstract: A resin pipe joint is provided so that a general worker can easily connect a resin pipe material without using a special tool. The resin pipe joint unit includes synthetic resin joint bodies, a synthetic resin pipe unit, and junk rings. The synthetic resin joint bodies have tubular sockets at one end portion thereof. The synthetic resin pipe unit has predetermined diameter and length, and inner ring portions are integrally formed in at least one end of a pipe portion in the synthetic resin pipe unit. The junk rings are screwed on the sockets of the joint bodies. In the resin pipe joint unit, the pipe unit is connected to the joint bodies by pressing end faces of the inner ring portions toward the side of the joint bodies respectively, when the junk rings are screwed on the sockets of the joint bodies.Type: ApplicationFiled: March 27, 2006Publication date: November 2, 2006Applicant: MIRAIAL CO., LTD.Inventors: Yukihiro Hyobu, Ryuichi Nakano, Tadao Iwaki
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Patent number: 7048127Abstract: The present invention provides a lid unit for closing a container body used to transport thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms are provided at the centers of the respective sides of the lid unit. The attaching/detaching mechanism includes a locking plate, for locking within a second recess, a lid receiving portion of the container body and a drive-out member for raising and locking the locking plate. A locking arm for fixing the drive-out member is provided on its leading side in the direction of engaging rotation. A supporting rail for guiding the raising and locking/unlocking movement of the locking plate is provided on the drive-out member. The locking plate is mounted for pivoting and sliding movement, and is provided with a holding claw for engagement within a second recess at the distal end thereof.Type: GrantFiled: July 23, 2001Date of Patent: May 23, 2006Assignee: Kakizaki Manufacturing Co., Ltd.Inventors: Yukihiro Hyobu, Chiaki Matsutori, Tadahiro Obayashi
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Publication number: 20050252571Abstract: While gas in a general storage container with no gas inlet and in the storage container with the gas inlet is replaced in a short time, the semiconductor wafer surface is cleaned. In an apparatus for replacing gas in a semiconductor wafer storage container which includes a lid unit and a storage container main body with a gas inlet, the apparatus includes gas introducing means for introducing the gas into the storage container main body, gas evacuating means for evacuating the gas in the storage container main body, and gas circulating means for circulating the gas in the storage container main body through a chemical adsorption filter. Gas introducing means for introducing the gas from a gap between the storage container main body and the lid unit while the lid unit is opened in the storage container mounting means is provided in the storage container with no gas inlet.Type: ApplicationFiled: April 20, 2005Publication date: November 17, 2005Inventors: Ryuichi Nakano, Yukihiro Hyobu, Yoshihisa Okamoto
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Publication number: 20050173296Abstract: The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35.Type: ApplicationFiled: April 13, 2005Publication date: August 11, 2005Inventors: Yukihiro Hyobu, Chiaki Matsutori, Tadahiro Obayashi
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Publication number: 20040020930Abstract: The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35.Type: ApplicationFiled: May 27, 2003Publication date: February 5, 2004Inventors: Yukihiro Hyobu, Chiaki Matsutori, Tadahiro Obayashi
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Patent number: 6491177Abstract: Disclosed is a thin-plate accommodating/transporting container including a container body for accomodating and supporting a plurality of thin plates while keeping the interior of the container clean, comprising: positioning means, provided at the container body, for accurately adjusting a placement position of the container body; lid receiving portion which is provided in the container body and to which the lid is attached; and engagement means, provided at the lid receiving portion, for engaging with various types of lids of different attachment methods.Type: GrantFiled: March 28, 2000Date of Patent: December 10, 2002Assignee: Kakizaki Manufacturing Co., Ltd.Inventor: Yukihiro Hyobu
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Patent number: 6474474Abstract: The present invention relates to a thin-plate supporting container 1 having a container body 2, and a thin-plate supporting unit 3 for supporting the semiconductor wafers from both sides thereof in the container body. There are provided a lid 4, and an easy attach/detach mechanism for attaching and detaching the lid 4. The easy attach/detach mechanism 31 is composed of a lid engaging claw 32 provided on the circumference of the lid 4, and object engagement part 28, provided on the container body 2, for engaging with the lid engagement claw 32 so as to secure the lid 4 to the container body 2, an arm 34 for releasing the lid engagement claw 32 from the object engagement part 28; and an elevating mechanism for slightly elevating the lid 4 from the container body 2 when the lid engagement claw 32 is released by means of the arm 34. The thin-plate supporting unit 3, the top flange 5, the carrying handle 6 are detachably mounted. The thin-plate supporting unit 3 is formed with a V-shaped groove 38.Type: GrantFiled: September 21, 1999Date of Patent: November 5, 2002Assignees: Sumitomo Metal Industries, Ltd., Kakizaki Manufacturing Co., Ltd.Inventors: Yukihiro Hyobu, Yasunori Oka
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Publication number: 20020027138Abstract: A container for a plurality of thin plates has a driving unit for moving one of a pair of magnetic members, at least one of which is a magnet, embedded in a container body and contained in a chamber in a lid, respectively, to selectively produce attractive and non-attractive magnetic conditions between the first and second magnetic members. In one embodiment, the driving unit includes a rotatable plate, and an arm having one end attached to the rotatable plate and the second end attached to the movable magnetic member to move the movable magnetic member in response to rotation of the rotatable plate. In a second embodiment a parallel movement link has a long groove for engaging a pin provided on the rotatable plate; a magnetic member supporting link has a first end attached to one end of the parallel movement link and has its second end attached to the movable magnetic member.Type: ApplicationFiled: August 13, 2001Publication date: March 7, 2002Inventor: Yukihiro Hyobu