Patents by Inventor Yukihiro Sayama

Yukihiro Sayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180301491
    Abstract: The present technology relates to a solid-state imaging device, a manufacturing method, and an electronic device, which can improve sensitivity while improving color mixing. The solid-state imaging device includes a first wall provided between a pixel and a pixel arranged two-dimensionally to isolate the pixels, in which the first wall includes at least two layers including a light shielding film of a lowermost layer and a low refractive index film of which refractive index is lower than the light shielding film. The present technology can be applied to, for example, a solid-state imaging device, an electronic device having an imaging function, and the like.
    Type: Application
    Filed: October 12, 2016
    Publication date: October 18, 2018
    Inventors: YUKA NAKAMOTO, YUKIHIRO SAYAMA, NOBUYUKI OHBA, SINTARO NAKAJIKI
  • Patent number: 9735190
    Abstract: There is provided a solid-state imaging device which includes a plurality of pixels including an imaging pixel for generating a captured image and a focus detection pixel for detecting a focus, in which the focus detection pixel includes a microlens, a photoelectric conversion unit which receives light incident from the microlens, a light-shielding unit which shields a portion of light incident on the photoelectric conversion unit, and a dimming filter which dims the light incident on the photoelectric conversion unit and is formed to contain a black pigment. The present technology can be applied to, for example, a CMOS image sensor.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: August 15, 2017
    Assignee: Sony Corporation
    Inventors: Masanori Harasawa, Yuichi Seki, Yukihiro Sayama
  • Publication number: 20160276398
    Abstract: There is provided a solid-state imaging device including: an imaging pixel including a photoelectric conversion unit which receives incident light; and a phase difference detection pixel including the photoelectric conversion unit and a light shielding unit which shields some of the light incident to the photoelectric conversion unit, in which the imaging pixel further includes a high refractive index film which is formed on the upper side of the photoelectric conversion unit, and the phase difference detection pixel further includes a low refractive index film which is formed on the upper side of the photoelectric conversion unit.
    Type: Application
    Filed: June 1, 2016
    Publication date: September 22, 2016
    Inventors: Yuichi Seki, Toshinori Inoue, Yukihiro Sayama, Yuka Nakamoto
  • Patent number: 9425230
    Abstract: There is provided a solid-state imaging device including: an imaging pixel including a photoelectric conversion unit which receives incident light; and a phase difference detection pixel including the photoelectric conversion unit and a light shielding unit which shields some of the light incident to the photoelectric conversion unit, in which the imaging pixel further includes a high refractive index film which is formed on the upper side of the photoelectric conversion unit, and the phase difference detection pixel further includes a low refractive index film which is formed on the upper side of the photoelectric conversion unit.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: August 23, 2016
    Assignee: SONY CORPORATION
    Inventors: Yuichi Seki, Toshinori Inoue, Yukihiro Sayama, Yuka Nakamoto
  • Patent number: 9263493
    Abstract: Provided is an image pickup element, including: condenser lenses made of a resin containing fine metal particles; photoelectric conversion elements formed in a silicon substrate and each configured to photoelectrically convert incident light that enter from an outside through corresponding one of the condenser lenses; and a protective film made of a silicon compound, the protective film being formed between the condenser lenses and the silicon substrate.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: February 16, 2016
    Assignee: SONY CORPORATION
    Inventors: Sintaro Nakajiki, Yukihiro Sayama, Yoshinori Toumiya, Tadayuki Dofuku, Toyomi Jinwaki
  • Patent number: 9124822
    Abstract: Disclosed herein is a solid-state image pickup device including a solid-state image pickup element operable to produce an electric charge according to the amount of light received, a lens disposed on the upper side of a pixel of the solid-state image pickup element, a protective film which covers the upper side of the lens and a surface of which is flattened, and a surface film which is formed at the surface of the protective film and which is higher in hydrophilicity than the inside of the protective film.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: September 1, 2015
    Assignee: SONY CORPORATION
    Inventors: Youichi Otsuka, Kazuaki Ogawa, Taichi Natori, Atsushi Yamamoto, Yasunori Koshino, Hitomi Kamiya, Yoshinori Toumiya, Tadayuki Dofuku, Ina Hori, Takayuki Shoya, Yukihiro Sayama, Masaya Shimoji, Yoshikazu Tanaka
  • Publication number: 20150171126
    Abstract: There is provided a solid-state imaging device including: an imaging pixel including a photoelectric conversion unit which receives incident light; and a phase difference detection pixel including the photoelectric conversion unit and a light shielding unit which shields some of the light incident to the photoelectric conversion unit, in which the imaging pixel further includes a high refractive index film which is formed on the upper side of the photoelectric conversion unit, and the phase difference detection pixel further includes a low refractive index film which is formed on the upper side of the photoelectric conversion unit.
    Type: Application
    Filed: December 11, 2014
    Publication date: June 18, 2015
    Inventors: Yuichi Seki, Toshinori Inoue, Yukihiro Sayama, Yuka Nakamoto
  • Publication number: 20150098007
    Abstract: There is provided a solid-state imaging device which includes a plurality of pixels including an imaging pixel for generating a captured image and a focus detection pixel for detecting a focus, in which the focus detection pixel includes a microlens, a photoelectric conversion unit which receives light incident from the microlens, a light-shielding unit which shields a portion of light incident on the photoelectric conversion unit, and a dimming filter which dims the light incident on the photoelectric conversion unit and is formed to contain a black pigment. The present technology can be applied to, for example, a CMOS image sensor.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 9, 2015
    Inventors: Masanori Harasawa, Yuichi Seki, Yukihiro Sayama
  • Publication number: 20150035105
    Abstract: Provided is an image pickup element, including: condenser lenses made of a resin containing fine metal particles; photoelectric conversion elements formed in a silicon substrate and each configured to photoelectrically convert incident light that enter from an outside through corresponding one of the condenser lenses; and a protective film made of a silicon compound, the protective film being formed between the condenser lenses and the silicon substrate.
    Type: Application
    Filed: July 24, 2014
    Publication date: February 5, 2015
    Inventors: Sintaro Nakajiki, Yukihiro Sayama, Yoshinori Toumiya, Tadayuki Dofuku, Toyomi Jinwaki
  • Patent number: 8902348
    Abstract: A solid-state image capture device including: at least one photoelectric converter at an image capture surface of a substrate; at least one on-chip lens at the image capture surface of the substrate and above a light-receiving surface of the photoelectric converter; and an antireflection layer on an upper surface of the on-chip lens. The antireflection layer contains a binder resin having a lower refractive index than that of the on-chip lens and low-refractive-index particles having a lower refractive index than that of the binder resin.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: December 2, 2014
    Assignee: Sony Corporation
    Inventors: Akiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji, Yoshikazu Tanaka
  • Patent number: 8779541
    Abstract: A solid-state imaging device including a plurality of pixels arranged two-dimensionally, wherein each of the pixels has at least a planarizing film formed on the upper side of a photoelectric conversion element, a filter formed on the upper side of the planarizing film, and a microlens formed on the upper side of the filter. The filter of some of the pixels is a color filter permitting transmission therethrough of light of a predetermined color component, whereas the filter of other pixels is a white filter permitting transmission therethrough of light in the whole visible spectral range. The refractive indices of the white filter, the microlens and the planarizing film have the following relationship: (Refractive index of white filter)?(Refractive index of microlens)>(Refractive index of planarizing film).
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: July 15, 2014
    Assignee: Sony Corporation
    Inventors: Sintaro Nakajiki, Yukihiro Sayama, Yuichi Seki, Masanori Harasawa, Yoshinori Toumiya
  • Patent number: 8546262
    Abstract: Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: October 1, 2013
    Assignee: Sony Corporation
    Inventors: Akiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji
  • Publication number: 20130235230
    Abstract: Disclosed herein is a solid-state image pickup device including a solid-state image pickup element operable to produce an electric charge according to the amount of light received, a lens disposed on the upper side of a pixel of the solid-state image pickup element, a protective film which covers the upper side of the lens and a surface of which is flattened, and a surface film which is formed at the surface of the protective film and which is higher in hydrophilicity than the inside of the protective film.
    Type: Application
    Filed: April 10, 2013
    Publication date: September 12, 2013
    Applicant: Sony Corporation
    Inventors: Youichi Otsuka, Kazuaki Ogawa, Taichi Natori, Atsushi Yamamoto, Yasunori Koshino, Hitomi Kamiya, Yoshinori Toumiya, Tadayuki Dofuku, Ina Hori, Takayuki Shoya, Yukihiro Sayama, Masaya Shimoji, Yoshikazu Tanaka
  • Patent number: 8432010
    Abstract: Disclosed herein is a solid-state image pickup device including a solid-state image pickup element operable to produce an electric charge according to the amount of light received, a lens disposed on the upper side of a pixel of the solid-state image pickup element, a protective film which covers the upper side of the lens and a surface of which is flattened, and a surface film which is formed at the surface of the protective film and which is higher in hydrophilicity than the inside of the protective film.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: April 30, 2013
    Assignee: Sony Corporation
    Inventors: Youichi Otsuka, Kazuaki Ogawa, Taichi Natori, Atsushi Yamamoto, Yasunori Koshino, Hitomi Kamiya, Yoshinori Toumiya, Tadayuki Dofuku, Ina Hori, Takayuki Shoya, Yukihiro Sayama, Masaya Shimoji, Yoshikazu Tanaka
  • Patent number: 8355072
    Abstract: A solid-state image capture device includes: at least one photoelectric converter provided at an image capture surface of a substrate to receive incident light at a light-receiving surface of the photoelectric converter and photoelectrically convert the incident light to thereby generate signal charge; at least one on-chip lens provided at the image capture surface of the substrate and above the light-receiving surface of the photoelectric converter to focus the incident light onto the light-receiving surface; and an antireflection layer provided on an upper surface of the on-chip lens at the image capture surface of the substrate. The antireflection layer contains a binder resin having a lower refractive index than the on-chip lens and low-refractive-index particles having a lower refractive index than the binder resin.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: January 15, 2013
    Assignee: Sony Corporation
    Inventors: Akiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji, Yoshikazu Tanaka
  • Publication number: 20120258563
    Abstract: Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
    Type: Application
    Filed: June 14, 2012
    Publication date: October 11, 2012
    Applicant: SONY CORPORATION
    Inventors: Akiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji
  • Patent number: 8222705
    Abstract: Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: July 17, 2012
    Assignee: Sony Corporation
    Inventors: Akiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji
  • Publication number: 20100301438
    Abstract: Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
    Type: Application
    Filed: May 7, 2010
    Publication date: December 2, 2010
    Applicant: SONY CORPORATION
    Inventors: Akiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji
  • Publication number: 20100289100
    Abstract: Disclosed herein is a solid-state image pickup device including a solid-state image pickup element operable to produce an electric charge according to the amount of light received, a lens disposed on the upper side of a pixel of the solid-state image pickup element, a protective film which covers the upper side of the lens and a surface of which is flattened, and a surface film which is formed at the surface of the protective film and which is higher in hydrophilicity than the inside of the protective film.
    Type: Application
    Filed: April 29, 2010
    Publication date: November 18, 2010
    Applicant: SONY CORPORATION
    Inventors: Youichi Otsuka, Kazuaki Ogawa, Taichi Natori, Atsushi Yamamoto, Yasunori Koshino, Hitomi Kamiya, Yoshinori Toumiya, Tadayuki Dofuku, Ina Hori, Takayuki Shoya, Yukihiro Sayama, Masaya Shimoji, Yoshikazu Tanaka
  • Publication number: 20100289939
    Abstract: A solid-state image capture device includes: at least one photoelectric converter provided at an image capture surface of a substrate to receive incident light at a light-receiving surface of the photoelectric converter and photoelectrically convert the incident light to thereby generate signal charge; at least one on-chip lens provided at the image capture surface of the substrate and above the light-receiving surface of the photoelectric converter to focus the incident light onto the light-receiving surface; and an antireflection layer provided on an upper surface of the on-chip lens at the image capture surface of the substrate. The antireflection layer contains a binder resin having a lower refractive index than the on-chip lens and low-refractive-index particles having a lower refractive index than the binder resin.
    Type: Application
    Filed: April 22, 2010
    Publication date: November 18, 2010
    Applicant: SONY CORPORATION
    Inventors: Akiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji, Yoshikazu Tanaka