Abstract: A built-in electronic component-mounted wiring board includes an electronic component having a connecting terminal and being mounted on a support; an insulating layer provided on the support so as to cover at least a portion of the electronic component; an opening provided in the insulating layer so as to expose the connecting terminal of the electronic component; and a connecting portion provided in the opening.

Abstract: A semiconductor part 1 in which a metal terminal 2 is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal 2 is in contact with a cream solder 3. When the side surface portion of the metal terminal 2 is irradiated with laser beams, the back surface portion of the metal terminal 2 is heated by thermal conduction from the side surface portion to the back surface portion of the metal terminal 2 and the cream solder 3 in contact with the back surface portion of the metal terminal 2 is melted, whereby soldering is performed.

Abstract: By photographing pad forming faces of CSPs 400 to recognize a pad arrangement through image processing so as to transfer and position the CSPs 400 in accordance with the recognition result of the pad arrangement, even if pads 401 are formed in any arrangement state in the CSPs 400 to be transferred, the positional relation between the pads 401 included in the CSPs 400 is made to always accurately coincide with the positional region between a plurality of solder ball attracting nozzles of a solder ball mounting apparatus.

Abstract: A built-in electronic component-mounted wiring board includes an electronic component having a connecting terminal and being mounted on a support; an insulating layer provided on the support so as to cover at least a portion of the electronic component; an opening provided in the insulating layer so as to expose the connecting terminal of the electronic component; and a connecting portion provided in the opening.