Abstract: In a manufacturing method for a semiconductor device, a main body wafer having an interlayer insulating film is formed, and a monitor wafer on which a monitor element is formed is provided. Characteristics of the main body wafer are copied onto the monitor element by simultaneously processing the main body wafer and the monitor wafer through BPSG densification during formation of the interlayer insulating film. The characteristic of the monitor element is measured by checking a process influence of the monitor element. Manufacturing conditions are set in accordance with the process influence of the monitor element. Variations in electric characteristics of the main body wafer are reduced in accordance with the set manufacturing conditions.

Abstract: In a manufacturing method for a semiconductor device, a main body wafer is formed, and a monitor wafer on which a monitor element is formed is provided. Characteristics of the main body wafer are copied onto the monitor element by simultaneously processing the main body wafer and the monitor wafer. The characteristic of the monitor element is measured by checking a process influence of the monitor element. Manufacturing conditions are set in accordance with the process influence of the monitor element. Variations in electric characteristics of the main body wafer are reduced in accordance with the set manufacturing conditions.

Abstract: A Provided is an electronic device in which: alternating current power from an RF coil which receives an electromagnetic wave and converts the electromagnetic wave into power is rectified by a diode and a first capacitor; the power is stepped up by a charge pump type step-up circuit; the power stepped up by the step-up circuit is stored in a second capacitor by a charging and discharging circuit; and the stored power is supplied from the charging and discharging circuit to an RF transmission circuit.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including, a quality check step and a condition setting step.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: A pneumatic radial tire for a passenger vehicle, characterized in that at least a portion of a carcass line extending radially outwardly from the maximum width position in a carcass line of a tire fitted to a normal rim and inflated up to its normal internal pressure is configured so as to substantially conform to an equilibrium carcass line expressed by the following equations (1) and (2) calculated by using an internal pressure allotment ratio g(y) of a carcass layer at the tread portion that is obtained by setting the distributional configuration index .alpha. of the following equation (3) at 4 or more, and that a tread pattern having a directional property is provided to the tread surface thereof, wherein: ##EQU1## wherein, provided that a line drawn vertically downwardly from the center of the tread portion to the axle of the tire is y axis of coordinates with the axle of the tire being z axis of coordinates, y.sub.A, y.sub.D, y.sub.C, y.sub.B and .eta. denote as follows:y.sub.

Abstract: A pneumatic radial tire for a passenger vehicle, characterized in that at least a portion of a carcass line extending radially outwardly from the maximum width position in a carcass line of a tire fitted to a normal rim and inflated up to its normal internal pressure is configured so as to substantially conform to an equilibrium carcass line expressed by the following equations (1) and (2) calculated by using an internal pressure allotment ratio g(y) of a carcass layer at the tread portion that is obtained by setting the distributional configuration index .alpha.

Abstract: A pneumatic radial tire for a passenger vehicle, characterized in that at least a portion of a carcass line extending radially outwardly from the maximum width position in a carcass line of a tire fitted to a normal rim and inflated up to its normal internal pressure is configured so as to substantially conform to an equilibrium carcass line expressed by the following equations (1) and (2) calculated by using an internal pressure allotment ratio g(y) of a carcass layer at the tread portion that is obtained by setting the distributional configuration index .alpha. of the following equation (3) at 4 or more, and that grooves are provided in the tread surface such that the groove area ratio thereof ranges from 20 to 30%, wherein: ##EQU1## wherein, provided that a line drawn vertically downwardly from the center of the tread portion to the axle of the tire is y axis of coordinates with the axle of the tire being z axis of coordinates, y.sub.A, y.sub.D, y.sub.C, y.sub.B and .eta. denote as follows:y.sub.