Patents by Inventor Yukimasa Saito
Yukimasa Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11761075Abstract: A substrate cleaning apparatus that cleans a processing target substrate by blasting the gas clusters to the processing target substrate. The apparatus includes: a chamber configured to accommodate the processing target substrate; a rotary stage configured to rotatably support the processing target substrate in the chamber; an blasting unit configured to blast the gas clusters to the processing target substrate supported by the rotary stage; a driving unit configured to scan a gas cluster-blasted position on the processing target substrate; an exhaust port configured to evacuate the chamber; and a control mechanism configured to control a scattering direction of particles by controlling a rotation direction of the processing target substrate by the rotary stage and a scanning direction of the gas cluster-blasted position, thereby suppressing re-adhesion of the particles to the processing target substrate.Type: GrantFiled: October 25, 2016Date of Patent: September 19, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Yukimasa Saito, Toshiki Hinata, Kazuya Dobashi, Kyoko Ikeda, Shuji Moriya
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Publication number: 20220143655Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: ApplicationFiled: January 26, 2022Publication date: May 12, 2022Inventors: Kazuya DOBASHI, Takehiko ORII, Yukimasa SAITO, Kunihiko KOIKE, Takehiko SENOO, Koichi IZUMI, Yu YOSHINO, Tadashi SHOJO, Keita KANEHIRA
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Patent number: 11267021Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: GrantFiled: February 9, 2018Date of Patent: March 8, 2022Assignees: TOKYO ELECTRON LIMITED, IWATANI CORPORATIONInventors: Kazuya Dobashi, Takehiko Orii, Yukimasa Saito, Kunihiko Koike, Takehiko Senoo, Koichi Izumi, Yu Yoshino, Tadashi Shojo, Keita Kanehira
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Publication number: 20210107041Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: ApplicationFiled: February 9, 2018Publication date: April 15, 2021Inventors: Kazuya DOBASHI, Takehiko ORII, Yukimasa SAITO, Kunihiko KOIKE, Takehiko SENOO, Koichi IZUMI, Yu YOSHINO, Tadashi SHOJO, Keita KANEHIRA
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Patent number: 10882330Abstract: An embodiment of the present invention is a printer that includes a platen roller to feed a print medium, a print head to print on the print medium fed by the platen roller, a connector that is attachable and detachable with respect to the print head the print head, and a controller to stop power supply to the print head via the connector when the platen roller and the print head are separated.Type: GrantFiled: August 28, 2017Date of Patent: January 5, 2021Assignee: SATO HOLDINGS KABUSHIKI KAISHAInventors: Shun Komagome, Yukimasa Saito
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Patent number: 10786837Abstract: According to the present invention, a substrate processing apparatus has a chamber (1), a stage (4) for holding a substrate (W) to be processed in the chamber (1), and a nozzle part (13) from which a gas cluster is blasted onto the substrate (W) to be processed, and has a function for processing the substrate (W) to be processed by the gas cluster. Cleaning of the inside of the chamber (1) is performed by: placing a prescribed reflecting member (dW, 60) in the chamber (1), blasting a gas cluster (C) onto the reflecting member (dW, 60), and applying the gas-cluster flow reflected by the reflecting member (dW, 60) onto a wall section of the chamber (1) to remove particles (P) adhered to the wall section of the chamber (1).Type: GrantFiled: October 20, 2016Date of Patent: September 29, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yukimasa Saito, Toshiki Hinata, Kazuya Dobashi, Kyoko Ikeda, Shuji Moriya
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Publication number: 20200278084Abstract: There is provide a gas supply method including: preparing a gas container filled with an easy-to-liquefy gas; and supplying the easy-to-liquefy gas from the gas container to a processing container in which a substrate process is performed using the easy-to-liquefy gas, via a gas supply path, wherein a pressure and a temperature of the easy-to-liquefy gas are controlled such that in the gas supply path, the pressure of the easy-to-liquefy gas decreases in a step-by-step manner and the temperature of the easy-to-liquefy gas increases from the gas container toward the processing container.Type: ApplicationFiled: February 27, 2020Publication date: September 3, 2020Inventors: Yukimasa SAITO, Naohiro FURUYA, Shinichi KAWAGUCHI
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Patent number: 10421218Abstract: A roller-type depressing device, an imprinting device, and a roller-type depressing method which are capable of suppressing an uneven elastic deformation of a main roller, and which are also capable of depressing an object uniformly. A roller-type depressing device depresses an object, and includes a main roller having at least a surface formed of an elastic material, and depressing the object, a roller moving unit moving the main roller relative to the object, a pressure adjusting unit adjusting pressure applied to the object by the main roller, a pressure receiving stage receiving the pressure from the main roller via the object, an intermediate roller having at least a surface formed of a material with a larger elastic modulus than the elastic material, and supporting the main roller, and, a backup roller formed shorter in an axial direction than the main roller and the intermediate roller, and supporting the intermediate roller.Type: GrantFiled: June 3, 2015Date of Patent: September 24, 2019Assignee: SCIVAX CORPORATIONInventors: Hirosuke Kawaguchi, Yutaka Taniguchi, Yukimasa Saito, Masaki Sugiyama, Daisuke Matono, Satoru Tanaka
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Publication number: 20190240991Abstract: An embodiment of the present invention is a printer that includes a platen roller to feed a print medium, a print head to print on the print medium fed by the platen roller, a connector that is attachable and detachable with respect to the print head the print head, and a controller to stop power supply to the print head via the connector when the platen roller and the print head are separated.Type: ApplicationFiled: August 28, 2017Publication date: August 8, 2019Applicant: SATO HOLDINGS KABUSHIKI KAISHAInventors: Shun KOMAGOME, Yukimasa SAITO
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Publication number: 20180369881Abstract: According to the present invention, a substrate processing apparatus has a chamber (1), a stage (4) for holding a substrate (W) to be processed in the chamber (1), and a nozzle part (13) from which a gas cluster is blasted onto the substrate (W) to be processed, and has a function for processing the substrate (W) to be processed by the gas cluster. Cleaning of the inside of the chamber (1) is performed by: placing a prescribed reflecting member (dW, 60) in the chamber (1), blasting a gas cluster (C) onto the reflecting member (dW, 60), and applying the gas-cluster flow reflected by the reflecting member (dW, 60) onto a wall section of the chamber (1) to remove particles (P) adhered to the wall section of the chamber (1).Type: ApplicationFiled: October 20, 2016Publication date: December 27, 2018Applicant: TOKYO ELECTRON LIMITEDInventors: Yukimasa SAITO, Toshiki HINATA, Kazuya DOBASHI, Kyoko IKEDA, Shuji MORIYA
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Publication number: 20180355465Abstract: A substrate cleaning apparatus that cleans a processing target substrate by blasting the gas clusters to the processing target substrate. The apparatus includes: a chamber configured to accommodate the processing target substrate; a rotary stage configured to rotatably support the processing target substrate in the chamber; an blasting unit configured to blast the gas clusters to the processing target substrate supported by the rotary stage; a driving unit configured to scan a gas cluster-blasted position on the processing target substrate; an exhaust port configured to evacuate the chamber; and a control mechanism configured to control a scattering direction of particles by controlling a rotation direction of the processing target substrate by the rotary stage and a scanning direction of the gas cluster-blasted position, thereby suppressing re-adhesion of the particles to the processing target substrate.Type: ApplicationFiled: October 25, 2016Publication date: December 13, 2018Applicant: TOKYO ELECTRON LIMITEDInventors: Yukimasa SAITO, Toshiki HINATA, Kazuya DOBASHI, Kyoko IKEDA, Shuji MORIYA
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Publication number: 20170072620Abstract: A roller-type depressing device, an imprinting device, and a roller-type depressing method which are capable of suppressing an uneven elastic deformation of a main roller, and which are also capable of depressing an object uniformly. A roller-type depressing device depresses an object, and includes a main roller having at least a surface formed of an elastic material, and depressing the object, a roller moving unit moving the main roller relative to the object, a pressure adjusting unit adjusting pressure applied to the object by the main roller, a pressure receiving stage receiving the pressure from the main roller via the object, an intermediate roller having at least a surface formed of a material with a larger elastic modulus than the elastic material, and supporting the main roller, and, a backup roller formed shorter in an axial direction than the main roller and the intermediate roller, and supporting the intermediate roller.Type: ApplicationFiled: June 3, 2015Publication date: March 16, 2017Inventors: Hirosuke Kawaguchi, Yutaka Taniguchi, Yukimasa Saito, Masaki Sugiyama, Daisuke Matono
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Publication number: 20140373783Abstract: A film forming device forms a thin film on a substrate by reacting reaction gases in a process vessel. Electrode portions each oriented vertically are arranged to be spaced from each other in a horizontal direction. By applying high-frequency powers having different phases to adjacent electrode portions, a strong plasma generation space is formed above the substrate placed on a mounting table, while a weak plasma generation space is formed in the gap between the electrode portions and the substrate. A first reaction gas is supplied to the strong plasma generation space and a second reaction gas that forms the thin film by reacting with the active species of the first reaction gas is supplied to the weak plasma generation space. The reaction gases in the weak plasma generation space are discharged through exhaust channels.Type: ApplicationFiled: September 12, 2014Publication date: December 25, 2014Inventors: Ikuo SAWADA, Masato MORISHIMA, Yukimasa SAITO
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Patent number: 8070302Abstract: A laminate type light emitting diode device having excellent heat radiation performance and high output capability is provided. A plurality of reflection type light emitting diode units 10 each of which includes a light emitting diode 2 and a dichroic mirror 3 in a hollow metal holder case 5 having high thermal conductivity so as to face each other are joined to one another through joint members 4 formed of electrical insulating material, thereby constructing the laminate type light emitting diode device 100.Type: GrantFiled: August 11, 2010Date of Patent: December 6, 2011Assignee: Iwasaki Electric Co., Ltd.Inventors: Mitsuyuki Hatanaka, Takashi Sato, Kazuo Yamamoto, Yukimasa Saito, Koji Uchida, Yasufumi Kawanabe
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Patent number: 8057046Abstract: A laminate type light emitting diode device having excellent heat radiation performance and high output capability is provided. A plurality of reflection type light emitting diode units 10 each of which includes a light emitting diode 2 and a dichroic mirror 3 in a hollow metal holder case 5 having high thermal conductivity so as to face each other are joined to one another through joint members 4 formed of electrical insulating material, thereby constructing the laminate type light emitting diode device 100.Type: GrantFiled: May 2, 2006Date of Patent: November 15, 2011Assignee: Iwasaki Electric Co., Ltd.Inventors: Mitsuyuki Hatanaka, Takashi Sato, Kazuo Yamamoto, Yukimasa Saito, Koji Uchida, Yasufumi Kawanabe
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Publication number: 20100321933Abstract: A laminate type light emitting diode device having excellent heat radiation performance and high output capability is provided. A plurality of reflection type light emitting diode units 10 each of which includes a light emitting diode 2 and a dichroic mirror 3 in a hollow metal holder case 5 having high thermal conductivity so as to face each other are joined to one another through joint members 4 formed of electrical insulating material, thereby constructing the laminate type light emitting diode device 100.Type: ApplicationFiled: August 11, 2010Publication date: December 23, 2010Applicant: IWASAKI ELECTRIC CO., LTD.Inventors: Mitsuyuki Hatanaka, Takashi Sato, Kazuo Yamamoto, Yukimasa Saito, Koji Uchida, Yasufumi Kawanabe
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Patent number: 7479619Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.Type: GrantFiled: July 17, 2006Date of Patent: January 20, 2009Assignee: Tokyo Electron LimitedInventors: Takanori Saito, Toshiyuki Makiya, Hisaei Osanai, Tsuyoshi Takizawa, Tomohisa Shimazu, Kazuhide Hasebe, Hiroyuki Yamamoto, Yukimasa Saito, Kenichi Yamaga
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Publication number: 20090015797Abstract: A laminate type light emitting diode device having excellent heat radiation performance and high output capability is provided. A plurality of reflection type light emitting diode units 10 each of which includes a light emitting diode 2 and a dichroic mirror 3 in a hollow metal holder case 5 having high thermal conductivity so as to face each other are joined to one another through joint members 4 formed of electrical insulating material, thereby constructing the laminate type light emitting diode device 100.Type: ApplicationFiled: May 2, 2006Publication date: January 15, 2009Applicant: IWASAKI ELECTRIC CO., LTD.Inventors: Mitsuyuki Hatanaka, Takashi Sato, Kazuo Yamamoto, Yukimasa Saito, Koji Uchida, Yasufumi Kawanabe
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Patent number: 7144823Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.Type: GrantFiled: September 27, 2002Date of Patent: December 5, 2006Assignee: Tokyo Electron LimitedInventors: Takanori Saito, Toshiyuki Makiya, Hisaei Osanai, Tsuyoshi Takizawa, Tomohisa Shimazu, Kazuhide Hasebe, Hiroyuki Yamamoto, Yukimasa Saito, Kenichi Yamaga
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Publication number: 20060258170Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.Type: ApplicationFiled: July 17, 2006Publication date: November 16, 2006Inventors: Takanori Saito, Toshiyuki Makiya, Hisaei Osanai, Tsuyoshi Takizawa, Tomohisa Shimazu, Kazuhide Hasebe, Hiroyuki Yamamoto, Yukimasa Saito, Kenichi Yamaga