Patents by Inventor Yukinobu Wataya
Yukinobu Wataya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190035837Abstract: A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. Also, a through hole extends from the second side of the semiconductor device towards the first side. An electrically conductive material is located in the through hole. Additionally, the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion.Type: ApplicationFiled: October 1, 2018Publication date: January 31, 2019Applicant: Sony CorporationInventor: Yukinobu Wataya
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Patent number: 10068938Abstract: A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. Also, a through hole extends from the second side of the semiconductor device towards the first side. An electrically conductive material is located in the through hole. Additionally, the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion.Type: GrantFiled: August 30, 2016Date of Patent: September 4, 2018Assignee: Sony CorporationInventor: Yukinobu Wataya
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Publication number: 20160372506Abstract: A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. Also, a through hole extends from the second side of the semiconductor device towards the first side. An electrically conductive material is located in the through hole. Additionally, the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion.Type: ApplicationFiled: August 30, 2016Publication date: December 22, 2016Inventor: Yukinobu Wataya
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Patent number: 9455286Abstract: A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. Also, a through hole extends from the second side of the semiconductor device towards the first side. An electrically conductive material is located in the through hole. Additionally, the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion.Type: GrantFiled: June 1, 2015Date of Patent: September 27, 2016Assignee: Sony CorporationInventor: Yukinobu Wataya
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Publication number: 20150263051Abstract: A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. Also, a through hole extends from the second side of the semiconductor device towards the first side. An electrically conductive material is located in the through hole. Additionally, the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion.Type: ApplicationFiled: June 1, 2015Publication date: September 17, 2015Inventor: Yukinobu Wataya
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Patent number: 9048352Abstract: A solid image pick-up device has a plurality of light sensors arranged on its image pick-up area of a semiconductor substrate. A transparent plate having the same shape and size as the semiconductor substrate is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image pick-up area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is attached to the inner surface of each of the through holes, while another insulating film is attached to the back surface of the semiconductor substrate.Type: GrantFiled: March 5, 2013Date of Patent: June 2, 2015Assignee: Sony CorporationInventor: Yukinobu Wataya
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Publication number: 20130241020Abstract: A solid image pick-up device has a plurality of light sensors arranged on its image pick-up area of a semiconductor substrate. A transparent plate having the same shape and size as the semiconductor substrate is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image pick-up area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is attached to the inner surface of each of the through holes, while another insulating film is attached to the back surface of the semiconductor substrate.Type: ApplicationFiled: March 5, 2013Publication date: September 19, 2013Applicant: SONY CORPORATIONInventor: Yukinobu Wataya
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Patent number: 8410567Abstract: An improved solid image-pickup device is so formed that its semiconductor device has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A plurality of bonding pads are formed on the surface of the semiconductor device and arranged around the image-pickup area. A plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate and each of the through holes is filled with an electrically conductive material, thereby effecting an electric connection between the bonding pads and the copper wire of the flexible circuit substrate bonded to the back surface of the semiconductor substrate.Type: GrantFiled: March 5, 2007Date of Patent: April 2, 2013Assignee: Sony CorporationInventor: Yukinobu Wataya
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Patent number: 7531375Abstract: It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image-pickup area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is tightly attached to the inner surface of each of the through holes, while another insulating film is tightly attached to the back surface of the semiconductor substrate.Type: GrantFiled: February 7, 2005Date of Patent: May 12, 2009Assignee: Sony CorporationInventor: Yukinobu Wataya
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Publication number: 20070158774Abstract: It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image-pickup area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is tightly attached to the inner surface of each of the through holes, while another insulating film is tightly attached to the back surface of the semiconductor substrate.Type: ApplicationFiled: March 5, 2007Publication date: July 12, 2007Inventor: Yukinobu Wataya
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Patent number: 7187051Abstract: It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image-pickup area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is tightly attached to the inner surface of each of the through holes, while another insulating film is tightly attached to the back surface of the semiconductor substrate.Type: GrantFiled: December 16, 2005Date of Patent: March 6, 2007Assignee: Sony CorporationInventor: Yukinobu Wataya
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Patent number: 7045870Abstract: It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image-pickup area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is tightly attached to the inner surface of each of the through holes, while another insulating film is tightly attached to the back surface of the semiconductor substrate.Type: GrantFiled: October 2, 2002Date of Patent: May 16, 2006Assignee: Sony CorporationInventor: Yukinobu Wataya
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Publication number: 20060091486Abstract: It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image-pickup area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is tightly attached to the inner surface of each of the through holes, while another insulating film is tightly attached to the back surface of the semiconductor substrate.Type: ApplicationFiled: December 16, 2005Publication date: May 4, 2006Inventor: Yukinobu Wataya
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Publication number: 20050146632Abstract: It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image-pickup area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is tightly attached to the inner surface of each of the through holes, while another insulating film is tightly attached to the back surface of the semiconductor substrate.Type: ApplicationFiled: February 7, 2005Publication date: July 7, 2005Inventor: Yukinobu Wataya
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Patent number: 6693674Abstract: A pilot opening to the outside is formed at one side end of a package for a solid-state image-pickup device and a guide opening to the outside is formed at a side end opposite to and approximately in parallel with the one side end of the package. The pilot is made to face a pilot pin projecting above a circuit board and a guide pin is inserted into the guide. The solid-state image-pickup device is then fixed at a prescribed position on the circuit board after the pilot comes into contact with the pilot pin. With a solid-state-,image-pickup device and a mounting method thus provided, package size does not become large and mounting is carried out with an extremely high positioning precision.Type: GrantFiled: May 19, 1998Date of Patent: February 17, 2004Assignee: Sony CorporationInventors: Yukinobu Wataya, Emiko Sekimoto
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Publication number: 20030080434Abstract: It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image-pickup area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is tightly attached to the inner surface of each of the through holes, while another insulating film is tightly attached to the back surface of the semiconductor substrate.Type: ApplicationFiled: October 2, 2002Publication date: May 1, 2003Inventor: Yukinobu Wataya
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Patent number: 6392309Abstract: A semiconductor device such as a solid state imaging device has a semiconductor chip mounted on a bottom surface of a cavity of a hermetic sealed box-shaped resin-molded package. The device comprises a radiator plate provided in a bottom wall of the package under the cavity or on the bottom surface of the cavity. The semiconductor chip and the radiator plate are bonded with an adhesive having a larger thermal conductivity than that of the resin forming the package. The radiator plate may be a part of a lead frame.Type: GrantFiled: August 13, 1996Date of Patent: May 21, 2002Assignee: Sony CorporationInventors: Yukinobu Wataya, Hideto Isono
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Patent number: D395423Type: GrantFiled: March 13, 1997Date of Patent: June 23, 1998Assignee: Sony CorporationInventors: Michio Koyama, Yukinobu Wataya