Abstract: A printing apparatus including a conveyer system configured to convey a pallet having a print substrate thereon, anteroposterior moving mechanisms, fitting members disposed on the moving mechanisms, a guide bar member that extends in a lateral direction mounted on the fitting members, and a head device that is movably disposed along the guide bar member and has a plurality of inkjet nozzles. The printing apparatus is adapted to conduct printing by ejecting ink droplets from the inkjet nozzles to the print substrate on the pallet which is secured above an upper conveying passage and which is conveyed by the conveyer system while moving the head device.

Abstract: The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.

Abstract: Previously, it was difficult to obtain high-affinity antibodies that specifically bind to HMGB-1 but not to HMGB-2. Under this circumstance, the present inventors successfully obtained antibodies that are more reactive to HMGB-1 than to HMGB-2 by using specific peptides as an antigen. The present inventors also demonstrated that the antibodies had a HMGB-1-neutralizing activity. The present inventors administered the antibodies to amyloidosis model animals, and as a result, successfully demonstrated that the antibodies produced a significant therapeutic effect.

Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes. In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.

Abstract: An electronic component accommodating device which can be stacked in plural, the electronic component accommodating device includes an upper surface side wall part extending from an upper surface of the electronic component accommodating device, the upper surface side wall part being positioned close to a flange extending from a lower surface of another electronic component accommodating device stacked on the electronic component accommodating device, wherein a side surface of the upper surface side wall part a side end part of the electronic component accommodating device is formed in a taper shape and has an inclination angle from a horizontal surface, the inclination angle being equal to or less than 60 degrees.

Abstract: A printing apparatus for printing on a print substrate by sequentially conducting a plurality of processing operations. The printing apparatus includes a pallet configured to receive the print substrate, and work station units each comprising a conveyer mechanism configured to convey the pallet and a work mechanism configured to conduct a predetermined processing operation to the print substrate on the pallet. A plurality of the work station units are aligned adjacent to each other, and the work station units are configured to be replaceable or rearrangeable to change the sequence of the plurality of processing operations.

Abstract: A printing apparatus including a pallet configured to receive a print substrate, a conveyer system configured to convey the pallet, and a plurality of work mechanisms arranged along a pallet conveying direction of the conveyer system. The work mechanisms are configured to conduct processing operations to the print substrate. The conveyer system includes an upper conveyer mechanism configured to sequentially convey the pallet to respective working positions of the work mechanisms, and a lower conveyer mechanism arranged below and along the upper conveyer mechanism. The lower conveyer mechanism is configured to convey the pallet in a direction opposite to the pallet conveying direction of the upper conveyer mechanism so that the conveyer system is structured to have an upper stage and a lower stage.

Abstract: A printing apparatus including a pallet configured to receive a print substrate, a conveyer mechanism configured to convey the pallet, and a working device configured to conduct a processing operation for printing on the print substrate on the pallet. The printing apparatus further includes a locating mechanism configured to stop the pallet at a first holding position and a first holding mechanism configured to hold the pallet, stopped at the first holding position by the first locating mechanism, to be spaced apart from the conveying mechanism. After the pallet being conveyed by the conveying mechanism is stopped by the first locating mechanism, the pallet is held to be spaced apart from the conveying mechanism by the first holding mechanism and the processing operation is conducted by the working device relative to the print substrate on the pallet thus held.

Abstract: A printing apparatus including a conveyer system configured to convey a pallet having a print substrate thereon, anteroposterior moving mechanisms, fitting members disposed on the moving mechanisms, a guide bar member that extends in a lateral direction mounted on the fitting members, and a head device that is movably disposed along the guide bar member and has a plurality of inkjet nozzles. The printing apparatus is adapted to conduct printing by ejecting ink droplets from the inkjet nozzles to the print substrate on the pallet which is secured above an upper conveying passage and which is conveyed by the conveyer system while moving the head device.

Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes. In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.

Abstract: The purpose of the present invention is to provide a cover tape for packaging semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for semiconductor device using the cover tape for packaging semiconductor device. The cover tape for packaging semiconductor device of the present invention has a net-like structure 20 at least in a portion, and the cover tape for packaging semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices so as to cover the pockets. The package for semiconductor device of the present invention contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging semiconductor device of the present invention.

Abstract: An electronic device receiving apparatus having a sealed structure, includes a tape whereby an electronic device is received in the electronic device receiving apparatus. The tape elastically holds the electronic device and runs inside of the electronic device receiving apparatus. An opening part for loading/unloading and a tape extending mechanism are provided inside of the electronic device receiving apparatus. The opening part for loading/unloading is provided above the tape so that the electronic device is loaded onto and unloaded from the tape. The opening part for loading/unloading has an opening part configured to open the electronic device receiving apparatus. The tape extending part extends the tape in a direction substantially perpendicular to a running direction of the tape.

Abstract: A tray for a semiconductor device and the semiconductor device are disclosed in which the resist of the semiconductor is not easily separated from the substrate. A tray for semiconductor device has a support section formed as a pocket for carrying the semiconductor device, a pair of first protrusions formed on the opposite sides of the support section, and a pair of second protrusions formed on the opposite sides of the tray on the surface side reverse to the surface side where the support section are provided. The second protrusions are arranged in spaced relation to and in the same direction as the first protrusions. The interval between the first protrusions is larger than the interval between the second protrusions, so that in the case where the tray receives a shock, the semiconductor device comes into contact with the second protrusions earlier than with the first protrusions, thereby making it difficult for the resist of the semiconductor device to come off.

Abstract: It is intended to provide a preparation whereby an oligonucleotide is efficiently transferred into a cell and the localization thereof in nucleus is promoted, a preparation for facilitating the conversion of the base sequence of a target genomic gene, and a preparation for gene therapy. Namely, a preparation for facilitating site-specific gene conversion which comprises at least a collagen and an oligonucleotide for gene conversion; a preparation for site-specific gene therapy which comprises at least a collagen and an oligonucleotide for gene conversion; a method of arbitrarily converting a specific base on a genomic gene in the nucleus of a cell which comprises bringing the above-described preparation for facilitating gene conversion into contact with the cell; and an preparation for facilitating oligonucleotide intranuclear localization which comprises at least a collagen and an oligonucleoitde.

Abstract: A pharmaceutical for the prophylaxis and/or treatment of amyloidosis such as familial amyloid polyneuropathy is provided. A pharmaceutical for the prophylaxis and/or treatment of amyloidosis that contains a compound containing the trivalent chromium ion, such as a fatty acid chromium salt, as an active ingredient, and that is capable of suppressing the decomposition of mutant transthyretin in amyloidosis.

Abstract: A tray for a semiconductor device and the semiconductor device are disclosed in which the resist of the semiconductor is not easily separated from the substrate. A tray for semiconductor device has a support section formed as a pocket for carrying the semiconductor device, a pair of first protrusions formed on the opposite sides of the support section, and a pair of second protrusions formed on the opposite sides of the tray on the surface side reverse to the surface side where the support section are provided. The second protrusions are arranged in spaced relation to and in the same direction as the first protrusions. The interval between the first protrusions is larger than the interval between the second protrusions, so that in the case where the tray receives a shock, the semiconductor device comes into contact with the second protrusions earlier than with the first protrusions, thereby making it difficult for the resist of the semiconductor device to come off.

Abstract: A player is assisted in selecting an action to be executed by a character on a screen by displaying multiple options, associated with corresponding actions, on the screen. A graphic, in virtual three dimensions, is displayed on the screen to visually depict a preview of a range of effect of an action corresponding to an option selected by an operational input by the player. The position of the graphic may be based on the position of the character at the time the option is selected. The range of effect may be switched to preview another action when the player switches the selected option. The options may be represented by icons and grouped according to the types of corresponding actions.

Abstract: An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.

Abstract: There is disclosed a member for office machines which comprises a core body and an annular elastic body installed on the peripheral surface thereof, wherein the expansion rate of the annular elastic body E(%) falls within the range of 5 to 30%, when expressed by the formula E(%)={(d1−d2)/d2}×100 wherein d1 in mm is the diameter of the core body, or a longest value in the cross-section of the core body in the shape of a roller or odd-shape; and d2 in mm is the inside diameter in mm of the annular elastic body before being installed on the peripheral surface of the core body. The member for office machines enables stable and steady paper sheet feeding, when used as a paper feeding member in electrophotographic equipment and electrostatic recording equipment, and equipment having a variety of paper feeding mechanisms such as ink-jet printers, automatic teller machines (ATM), money exchange machines, counting machines, automatic vending machines and cash dispensers (CD).

Abstract: A method for fabricating a carrier tape having a row of pockets, including forming carrier tape sections by injection molding so that each of the carrier tape sections has at least one pocket for accommodating an article therein, and joining the carrier tape sections in the form of a tape. The first carrier tape section is first injection molded, and the second carrier tape section is then injection molded such that one side of the first carrier tape section is in contact with one side of the second carrier tape section. A further carrier tape section is then injection molded such that one side of the second carrier tape section is in contact with a side of the further carrier tape section, whereby the carrier tape sections are successively joined together.