Abstract: The carrier including a plurality of storage sections for individually accommodating electronic parts and a plurality of connecting sections for connecting the adjacent storage sections with each other. Each storage section is provided with a bottom wall and a side wall for defining a recess, and a support section for supporting the electronic part. The support section includes one rib continuously extending on the bottom wall along a generally rectangular profile, and a plurality of columnar projections projecting from the bottom wall to a height generally identical to one another and lower than a height of the rib. The bottom wall includes a first surface extending between the side wall and the rib to define a first region of the recess, and a second surface extending inside the rib to define a second region of the recess shallower than the first region. The columnar projections are arranged in a distributed manner on the second surface of the bottom wall.

Abstract: A roller is equipped with an elastic layer comprising a foam, wherein at least a part of the elastic layer is subjected to permanent compressional deformation by heating compression, and the cells in the elastic layer subjected to permanent compressional deformation by heating compression outnumber the cells therein before the heating compression; and a process for producing the above roller in high efficiency. The above process enables the production of the roller in which the surface state of only an arbitrary portion thereof is modified according to the purpose of use, and the roller thus obtained can exhibit high performances in a variety of applications including paper feed roller, developer conveying roller and so forth.

Abstract: A carrier tape having a row of pockets for accommodating electronic components therein is made by injection molding such that a thickness of connecting walls between the pockets is less than a thickness of a bottom wall of each pocket, to allow rolling of the row, and reinforcement of the bottom to protect the electronic components.

Abstract: A semiconductor accommodating device using an embossed tape and a method for inserting and taking out semiconductor devices, without using a top cover tape that had hitherto been used. The semiconductor accommodating device comprises a reel and an embossed tape wound on the reel. The embossed tape has a bottom wall for placing a semiconductor device thereon, two side walls upwardly extending from both side edges of the boom wall, and top walls having an opening. The side walls are formed such that the semiconductor device inserted through the opening is held by the side walls with the semiconductor device placed on the bottom wall.

Abstract: A roller is equipped with an elastic layer comprising a foam, wherein at least a part of the elastic layer is subjected to permanent compressional deformation by heating compression, and the cells in the elastic layer subjected to permanent compressional deformation by heating compression outnumber the cells therein before the heating compression; and a process for producing the above roller in high efficiency. The above process enables the production of the roller in which the surface state of only an arbitrary portion thereof is modified according to the purpose of use, and the roller thus obtained can exhibit high performances in a variety of applications including paper feed roller, developer conveying roller and so forth.

Abstract: A semiconductor device is provided with a rectangular package body, a large number of leads projecting out from the body, and a heat radiating fin assembly on top of the package body. The heat radiating fin assembly is constructed of a support column extending vertically from the top surface of the package body and at least one heat radiating fin extending outwardly from the support column in a radial direction. The heat radiating fin is supported by direct or indirect engagement within a container for accommodating and holding the semiconductor device. The support is achieved in such a way that the leads of the device are held out of contact with the inside of the container and such that the device is accommodated and held within the container in a predetermined orientation.

Abstract: There is disclosed a rubber composition having excellent vibration-insulating properties. The rubber composition comprises 45 to 75 parts by weight of at least one rubber selected from the group consisting of natural rubber, isoprene rubber, butadiene rubber and styrene-butadiene rubber; 40 to 20 parts by weight of halogenated butyl rubber; 5 to 15 parts by weight of copolymer having a styrene content of not less than 50%; 20 to 80 parts by weight of carbon black based on 100 parts by weight of the total of the above rubbers and copolymer; and 3 to 25 parts by weight of aromatic process oil based on 100 parts by weight of the total of the above rubbers and copolymer.