Abstract: A monochromatic continuous light emitted from a laser source is introduced into an optical resonator, and resonated and amplified between reflecting mirrors provided in the optical resonator. An optoacoustic element controller applies a pulsed high frequency electric signal to an optoacoustic element so that the amplified monochromatic continuous light is pulsed through the optoacoustic element. The thus obtained pulsed light is diffracted in an oblique direction and taken out of the optical resonator to the outside.

Abstract: A barrier layer (20, 62) for an integrated circuit structure is disclosed. The barrier layer (20, 62) is a refractory metal silicon compound, such as a refractor metal silicon nitride compound, formed in an amorphous state. The barrier layer (20, 62) has a relatively low composition ratio of silicon, and of nitrogen if present, to provide low resistivity in combination with the high diffusion barrier properties provided by the amorphous state of the film. A disclosed example of the barrier layer (20, 62) is a compound of tantalum, silicon, and nitrogen, formed by controlled co-sputtering of tantalum and silicon in a gas atmosphere including nitrogen and argon. The barrier layer (20) may be used to underlie copper metallization (22), or the barrier layer (62) may be part or all of a lower plate in a ferroelectric memory capacitor (70).

Abstract: A thin film resistor (302) for use in inkjet printer heads that has high resistant and low absolute value of TCR.

Abstract: A ferroelectric capacitor electrode contact structure comprising an insulator (304) placed over a substrate (302), the insulator (304) containing a source plug (310) and a drain contact (312). An upper plug layer (322) is place over and electrically connected to a drain contact (312). A multi-component oxide layer (324) is placed over an upper plug layer (322). A bottom electrode (326) is placed over a multi-component oxide layer 324. Multi-component oxide layer (324) prevents the silicidation of the bottom electrode (326) of a ferroelectric capacitor electrode contact structure while surprisingly maintaining an ohmic contact from the substrate (302) through the drain contact (312) through the upper plug layer (322) through the multi-component oxide layer (324) to the bottom electrode 326.

Abstract: To provide a method that can be used to form a high-qualility ferroelectric film by forming good nuclei when using the sputtering method to manufacture a PZT capacitor or other forroelectric capacitors using Ir or other electrode substances in addition to Pt for the electrode. In the method for manufacturing a PZT ferroelectric capacitor CAP, after titanium film 31 is deposited on Ir electrode 6, lead oxide 32 is deposited at a substrate temperature higher than the crystallization temperature of lead titanate using the sputtering method. Lead zirconate titanate 34 is then deposited at a substrate temperature higher than the aforementioned substrate temperature using the sputtering temperature. Afterwards, a heat treatment of the deposited film is performed to produce PZT film 17.

Abstract: A ferroelectric capacitor electrode contact structure comprising an insulator (4) placed over a substrate (2) and containing a transistor source (6) and transistor drain (8) between the substrate (2) and the insulator (4). The insulator (4) contains a source plug (10) and a conductive drain plug (12). The transistor source (6) is electrically connected to the source plug (10). The transistor drain (8) is electrically connected to the conductive drain plug (12). A transistor gate (14) is between the source plug (10) and a conductive drain plug (12) and is contained by the insulator (4). Metal wiring (16) is electrically connected to the source plug (10). A barrier film (18) is placed over the insulator (4) and the conductive drain plug (12). The bottom electrode (20) is placed over the barrier film (18). The ferroelectric layer (22) is placed over the bottom electrode (20). The top electrode (24) is placed over the ferroelectric layer (22).

Abstract: A metal oxide capacitor is manufactured by sequentially laminating a metal oxide film and a secon electrode on a first electrode. The metal oxide film is formed and then heat-treated in an atmosphere with an oxygen pressure higher than 1 atm.

Abstract: A method of forming a suicide layer 12 is disclosed herein. In one embodiment, a refractory metal (e.g., titanium) layer 20 is formed over a silicon (e.g., polysilicon) layer 10. The silicon layer 10 and the titanium layer 20 are then heated to a first temperature so that the silicon 10 and titanium 20 react to form a titanium silicide region 12. While applying an external force to warp the device, the titanium silicide region 12 is heated to a second temperature. This second temperature is higher than the first temperature. In one embodiment, this two-step heating process helps facilitate the transition from C49 phase TiSi.sub.2 to C54 phase TiSi.sub.2.

Abstract: A dielectric capacitor is provided which has a reduced leakage current. The surface of a first electrode (38) of the capacitor is electropolished and a dielectric film (40) and a second electrode (37) are successively laminated on it. The convex parts pointed end (38a) existing on the surface of the first electrode is very finely polished uniformly by dissolving according to electropolishing, a spherical curved surface in which the radius of curvature has been enlarged is formed, and the surface of the first electrode is flattened. Therefore, concentration of electrolysis can be prevented during the operation at the interface of the first electrode and the dielectric film, and the leakage current can be reduced considerably.

Abstract: A method for forming a ferroelectric material film, more particularly a lead zirconate titanate (PZT) film by the sol-gel method wherein a lowered oxidative sintering temperature may be adopted in preparing the ferroelectric material film with a perovskite crystalline structure, thereby reducing the risk of oxidation of metal electrodes and other circuits when the ferroelectric material film is employed as a dielectric in semiconductor devices, such as in a capacitor, for example. The method contemplates the preparation of a raw material solution containing an organometallic compound of a metallic element forming the ferroelectric material film, alkanolamine and/or stabilizer comprising a .beta.-diketone, with the concentration of the stabilizer being sufficient to provide a mole ratio to the total metal atoms of (stabilizer/total metal atoms)>3.

Abstract: A capacitor and electrode structure comprising a PZT ferroelectric layer 17 with a primary component (Pb) and secondary component (Ti), a lower electrode layer 16 formed on the underside of the ferroelectric layer and made up of a special element (Pt) and Ti, and compounds thereof, and a diffusion barrier layer 18 which is formed on the underside of the lower electrode layer and which functions as a diffusion barrier with respect to Pb. The capacitor and the electrode structure, which may be a component of a semiconductor memory device, suppress fluctuations in the composition of the ferroelectric layer in PZT, etc., so as to maintain the intended performance of the PZT ferroelectric layer, thereby simplifying and stabilizing film fabrication, and preventing the degradation of electrical characteristics and adverse effects on lower layers.

Abstract: A method for forming a PZT strong dielectric film by the sol-gel technique, in which the thickness of the film is substantially no greater than 1000 .ANG.. In another aspect, the drying temperature of the raw material sol-gel solution for forming the PZT dielectric film is maintained within the range of 130.degree.-200.degree. C., and is particularly set lower than the boiling point of the stabilizer contained in the sol-gel raw material and higher than the boiling point of the solvent contained in the sol-gel raw material. As a result of performing the oxidative sintering treatment at a temperature at which perovskite crystals form, it becomes possible to readily form thin films exhibiting a (100) crystal orientation in particular. Additionally, completely crack-free thick films can be formed.

Abstract: A capacitor, electrode, or wiring structure having an alpha ray emitting source (in particular, a Pt electrode), and an alpha ray shielding layer 18, having at least one type selected from the group of simple metals of nickel, cobalt, copper, and tungsten, their compounds or alloys made of at least two types of these simple metals, and compounds and alloys made of these simple metals and silicon is provided. It is possible to shield off the alpha ray effectively, to suppress generation of soft errors, to enable the use of Pt and other new materials in making the electrodes and wiring, and to reduce the cost of the mold resin.

Abstract: A capacitor and electrode structure comprising a PZT ferroelectric layer 17 with a primary component (Pb) and secondary component (Ti), a lower electrode layer 16 formed on the underside of the ferroelectric layer and made up of a special element (Pt) and Ti, and compounds thereof, and a diffusion barrier layer 18 which is formed on the underside of the lower electrode layer and which functions as a diffusion barrier with respect to Pb. The capacitor and the electrode structure, which may be a component of a semiconductor memory device, suppress fluctuations in the composition of the ferroelectric layer in PZT, etc., so as to maintain the intended performance of the PZT ferroelectric layer, thereby simplifying and stabilizing film fabrication, and preventing the degradation of electrical characteristics and adverse effects on lower layers.

Abstract: A fault inspection system for the rotary machine is disclosed in which the rotational speed or a physical quantity related thereto of the rotary machine drive with changing rotational speeds is detected as a first detection signal, and the sound pressure or mechanical vibration from the rotary machine as a second signal. A reference line representing the relationship between the values of the first and second detection signals is determined on the basis of the same values. A fault of the rotary machine is detected on the basis of a third detection signal associated with an area corresponding to the region where the first or second detection signal exceeds the reference line.