Abstract: An apparatus and method for detecting defects on a specimen includes an illumination optical unit which obliquely projects a laser onto a region which is longer in one direction on a surface of a specimen than in a transverse direction, a table unit which mounts the specimen and which is movable, a detection optical unit which detects light from the specimen illuminated by the laser with an image sensor while the table is moving, and a signal processor. The signal processor processes a signal outputted from the image sensor of the detection optical unit and converted to a digital signal and extracts defects of the specimen by comparing the converted digital signal with a reference digital signal. A display unit displays information of defects extracted by the signal processor.

Abstract: A method for inspecting a specimen includes obtaining an image of a specimen through a first optical system, displaying the obtained image of the specimen on a display screen; dividing the displayed image of the specimen into plural regions and setting defect detection sensitivity for each of the plural divided regions, transferring the specimen from the first optical system to a second optical system, obtaining an image of the specimen through the second optical system, detecting defects on the specimen by processing the image obtained through the second optical system using the defect detection sensitivity set for a respective region, and displaying information of the detected defects on the display screen.

Abstract: A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

Abstract: A scanning probe microscope for measuring a surface profile of a sample by bringing a probe into close proximity to or contact with the surface of the sample and scanning the sample surface includes: a sample stage movable in at least one axis direction; the probe which is brought into close proximity to or contact with the surface of the sample mounted on the sample stage and scans the sample surface; a probe-driving unit for moving the probe three-dimensionally; a probe deflection detector for detecting a deflection of the probe; and an observation optical system which has an objective lens and observes the probe disposed on substantially the optical axis of the objective lens, and the sample. The probe-driving unit is disposed with three sets of paired drive sources arranged essentially with symmetry with respect to the optical axis of the objective lens.

Abstract: A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

Abstract: A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

Abstract: An apparatus for detecting defects on a specimen including am illumination optical unit which obliquely projects a laser onto a region which is longer in one direction than in a direction transverse to said one direction on a surface of a specimen, a table unit which mounts said specimen and which is movable, a detection optical unit which detects with an image sensor an image of light formed by light reflected from said specimen in both directions of the one direction and the direction transverse and which reflected light in both directions is formed on said image sensor while said table is moving, a signal processor which processes a signal outputted from said image sensor of said detection optical unit to extract defects of said specimen. A display unit which displays information of defects extracted by said signal processor.

Abstract: An apparatus and method for detecting defects on a specimen includes an illumination optical unit which obliquely projects a laser onto a region which is longer in one direction on a surface of a specimen than in a transverse direction, a table unit which mounts the specimen and which is movable, a detection optical unit which detects light from the specimen illuminated by the laser with an image sensor while the table is moving, and a signal processor. The signal processor processes a signal outputted from the image sensor of the detection optical unit and converted to a digital signal and extracts defects of the specimen by comparing the converted digital signal with a reference digital signal. A display unit displays information of defects extracted by the signal processor.

Abstract: The invention relates to a method and an apparatus for measuring the depths of many fine holes formed in the surface of a sample by etching. Positional information on a plurality of hole patterns is acquired by scanning with a stylus the surface of the sample in which the hole patterns are formed by etching, the depths of the plurality of hole patterns are measured by scanning with the stylus bottom faces of the plurality of hole patterns and the surface of the sample in the respective vicinities of the hole patterns on the basis of the positional information, and information on distribution of the depths of the plurality of hole patterns is displayed on a screen on the basis of information on the measured depths of the plurality of hole patterns and the positional information on each of the hole patterns.

Abstract: A method for inspecting a specimen includes obtaining an image of a specimen through a first optical system, displaying the obtained image of the specimen on a display screen; dividing the displayed image of the specimen into plural regions and setting defect detection sensitivity for each of the plural divided regions, transferring the specimen from the first optical system to a second optical system, obtaining an image of the specimen through the second optical system, detecting defects on the specimen by processing the image obtained through the second optical system using the defect detection sensitivity set for a respective region, and displaying information of the detected defects on the display screen.

Abstract: A processing method for semiconductor devices in a semiconductor fabrication line includes processing a substrate in a first processing apparatus, transferring the substrate processed in the first processing apparatus to a detecting apparatus without removal of the substrate from the semiconductor fabrication line while continuing fabrication of the semiconductor devices, detecting foreign particle defects on the substrate transferred to the detecting apparatus, and determining a foreign particle generation condition of the processing apparatus based on a data from the detecting.

Abstract: The present invention provides a highly sensitive inspection technology that prevents false detections. The present invention includes means for detecting an image of an entire chip. Using this image, inspection regions are defined based on criticality. Detection sensitivities can be set for each of these inspection sensitivities. Alternatively, false detections can be eliminated in post-inspection processing by recording characteristic values used to evaluate defects, e.g., concentration differences, in the inspection results. Furthermore, by providing a system that allows sharing of inspection conditions and the like needed by multiple inspection devices, the time required for determining inspection conditions can be shortened and stability and reliability can be monitored.

Abstract: A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

Abstract: A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

Abstract: The present invention provides a defect inspecting apparatus and a defect inspection method for inspecting an object of inspection for a defect such as a foreign particle existing on the object wherein, by using a high-efficiency illumination optical system for radiating an illumination beam to the object of inspection from a direction to reduce the intensity of a scattered light generated by a pattern on the object of inspection, it is possible to decrease the intensity of the scattered light from the pattern which causes a variation of a signal and, in addition, by using a means for setting a detection threshold value based on a variation of a signal computed for each area in a chip on the object of inspection, the detection threshold value can be made small and, thus, the sensitivity as well as the throughput can be raised.

Abstract: The present invention provides a highly sensitive inspection technology that prevents false detections. The present invention includes means for detecting an image of an entire chip. Using this image, inspection regions are defined based on criticality. Detection sensitivities can be set for each of these inspection sensitivities. Alternatively, false detections can be eliminated in post-inspection processing by recording characteristic values used to evaluate defects, e.g., concentration differences, in the inspection results. Furthermore, by providing a system that allows sharing of inspection conditions and the like needed by multiple inspection devices, the time required for determining inspection conditions can be shortened and stability and reliability can be monitored.

Abstract: A processing method for semiconductor devices in a semiconductor fabrication line includes processing a substrate in a first processing apparatus, transferring the substrate processed in the first processing apparatus to a detecting apparatus without removal of the substrate from the semiconductor fabrication line while continuing fabrication of the semiconductor devices, detecting foreign particle defects on the substrate transferred to the detecting apparatus, and determining a foreign particle generation condition of the processing apparatus based on a data from the detecting.

Abstract: A defect detecting apparatus including an illumination system for radiating a light of a plane wave linearly to a substrate having repetitive patterns of different pitches; a focusing optical system for focusing a light image reflected from the substrate thus illuminated by the illumination system; a spatial filter disposed intermediate the focusing optical system so as to shield a diffraction light from repetitive patterns of a small pitch on the substrate; a detector for detecting the light image formed by the focusing optical system; an erasing means for comparing and erasing signals which are generated on the basis of repetitive patterns of a large pitch and obtained through the spatial filter, out of signals detected by the detector; and a defect detecting means for detecting defects on the substrate in accordance with a signal detected by the detector, as well as a method applied to the said apparatus.

Abstract: In a mass production line of a semiconductor manufacturing process, foreign particle inspection method and apparatus for preventing occurrence of large quantities of defects and for keeping a necessary yield. The inspection apparatus is made up in a small-sized apparatus and disposed at inlet/outlet of processing apparatuses of the production line or to a transfer system between the processing apparatuses. The inspection apparatus includes at least one monitor for real-time sampling foreign particles possible deposited on wafer which is being carried by the transfer system, thereby enabling simplification in construction of the production line and reduction of manufacturing cost. The inspection apparatus may comprise a refractive index changeable type lens array, a spatial filter and a pattern data elimination circuit, and makes possible to conduct foreign particle inspection on repetitively-patterned portions of the wafers during transfer.

Abstract: Method and apparatus of detecting, analyzing and evaluating the content of foreign matters such as dusts and impurities contained in various materials, units, processes and environment standing for constituting components of a mass production line during mass production start-up and during mass production, in order to manage a semiconductor production process. A mass production off-line system including an apparatus for detecting, analyzing and evaluating the content of foreign matters during the mass production start-up is separated from the production line and installed independently thereof. Monitors for detection of foreign matters are provided at necessary locations in the production line and monitor data is evaluated through various units to manage the content of foreign matters in the production line, permitting efficient and economical mass production start-up and mass production.