Abstract: A method and apparatus are disclosed for detection of surface defects and internal defect information of a sample, such as a semiconductor device, using the photoacoustic effect. Operationally, an intensity-modulated laser beam is provided having a predetermined desired frequency. The intensity-modulated laser beam is focused on the sample thereby inducing said photoacoustic effect inside the sample which is detected in two-dimensional directions of the sample so as to compose a two-dimensional photoacoustic image of the excited sample. Surface and internal information of the sample is then extracted from the two-dimensional photoacoustic image and an inverse filtering factor is in turn computed on the basis of a thermal impulse response of the particular sample for compensating degradation of the resolution of the actual photoacoustic image obtained. Lastly, the computed inverse filtering factor is then applied to the detected photoacoustic image to arrive at an image having greatly improved resolution.

Abstract: A photoacoustic signal detecting device irradiates a modulated light on a sample using focusing means, detects a photoacoustic signal created in the sample using light interference detection means and finally displays the information relative to the surface and inside of the sample. The focusing means and light interference detection means are constructed in a confocal optical system, respectively, and a pin-hole is used to remove unnecessary high order diffraction light components around the light spot of the modulated light so that the photoacoustic signal can be detected with a high accuracy. Further, an auto-focusing function is added to the photoacoustic signal detection so that the photoacoustic signal can be detected with a high accuracy also for a sample with rugged surface.

Abstract: A photoacoustic signal detecting method and apparatus for intensity-modulating light having a wavelength penetrating a sample such as a semiconductor device at a desired frequency, the light being emitted from a first light source, focusing the intensity-modulated light on the sample as a light spot, by changing the position of the sample and the optical constant of the means for focusing, scanning the light spot inside the sample in a depth direction thereof to detect the photoacoustic effect generated in the sample, and extracting information relative to the surface and inside of the sample and defect information therein. The photoacoustic effect is detected using an interferometer. Light incident on the sample surface for a second light source in order to obtain interference light and the interference light reflected from the sample surface are adjusted in response to a signal indicative of the depth of the light spot to detect optimum interference light.

Abstract: An X-ray lithography apparatus for transferring a pattern formed in a mask onto a wafer by using a soft X-ray.

Abstract: Disclosed is an X-ray exposure apparatus having a low attenuation chamber supplied with a gas absorbing little X-rays, the low attenuation chamber being interposed between an X-ray source and a mask so that X-rays transmitted through the low attenuation chamber are irradiated on the mask so as to transfer a mask pattern onto a resist on a wafer, the apparatus comprising detecting means for detecting the gas or components mixed in the gas in the low attenuation chamber, control means for controlling a quantity of supply of the gas into the low attenuation chamber in accordance with an output signal of the detecting means, and/or adjusting means for adjusting a quantity of exposure of said X-rays irradiated on the mask in accordance with an output signal of the detecting means.

Abstract: An X-ray exposure system includes a frame set on the floor; an X-ray source fixedly provided in the central portion of the upper part of the frame; a mask-wafer alignment means comprising a wafer at a fixed distance from a mask, an X-Y table mounted with the wafer holder, a mask holder for holding the mask, and an alignment detecting means for detecting the alignment of the alignment pattern of the mask and that of the wafer; vibration isolators for supporting the mask-wafer alignment means so that vibrations do not propagate to the mask-wafer alignment means; detecting means for detecting the position of the mask-wafer alignment means with respect to three-dimensional directions relative to the X-ray source; an arithmetic means for calculating an exposure error of a dislocation of a mask pattern exposure on the wafer, on the basis of position data obtained by the detecting means; and correcting means for correcting the exposure error calculated by the arithmetic means.

Abstract: An exposure apparatus comprises a stage; a base plate provided on the stage; a flexible chuck plate which is capable of sucking under vacuum a substantially entire surface of a substrate to a surface thereof; a plurality of vertical displacement generating mechanism including a plurality of feedscrews provided at the base plate with predetermined intervals therebetween, a plurality of rotational actuators for rotatively driving each of the feedscrews, and a plurality of spring members interposed between the chuck plate and the base plate so as to allow a tip of each of the feedscrews to be engaged with a rear surface of the chuck plate; restricting mechanism for restricting the chuck plate in such a manner as not to be displaced horizontally relative to the base plate; a mask holder for holding a mask; a mechanism for measuring a level of the mask held by the mask holder; and a mechanism for measuring a level of the substrate sucked onto the chuck plate, whereby each of the rotational actuators of the vertica

Abstract: A method and apparatus for alignment for use in X-ray exposure or the like wherein a mask is provided having a formation of an alignment pattern made up of at least one linear segment formed in a peripheral section of the mask and a wafer is provided having a formation of an alignment pattern formed in a same direction as the alignment pattern of the mask and made up of linear segments. An illuminating arrangement illuminates a light to the mask alignment pattern along a direction inclined to the alignment direction and the mask alignment pattern and the wafer alignment pattern are imaged and transformed into a video signal. An A/D converts the video signal into a digital signal and stores the digital signal in a memory.

Abstract: The present invention relates, in a projection aligner wherein a mask and a wafer are held proximate to one another and wherein a circuit pattern depicted on the mask is transferred onto the wafer, to a method of detecting the respective positions of the mask and the wafer for the relative positioning between the mask and the wafer.

Abstract: A light-exposure apparatus which can keep uniform the gap between a mask and a wafer and reduce the density of arrangement of vertical movers adapted to deform the wafer to thereby reduce cost and weight of the apparatus. The apparatus has a thin plate deforming mechanism comprising a chuck platen for holding on its top surface the wafer, the bottom surface of the chuck platen being formed with imperforate slits patterned in the form of a grid composed of a plurality of triangular meshes so that the chuck platen may be deformed along bending lines near the triangular meshes, and a plurality of vertical movers for vertically deforming the individual triangular meshes so as to flatten or deform into a desired shape the wafer.

Abstract: A device for measuring a flatness of a plate such as a silicon wafer, a GGG wafer, a printed circuit board, a ceramic substrate, or the like. The measuring device is provided with a disc which is disposed in parallel with the plate on one of the surfaces of the plate and is driven by a rotating drive source and a plurality of detectors for detecting a distance from the detector to the surface of the plate, the detectors being disposed on the surface closer to the disc. With this arrangement, distance data from the plurality of the detectors to the surface of the plate is obtained during the course of the rotation of the disc, and a flatness of the plate is measured.

Abstract: An X ray exposure process and system for transferring a mask pattern onto a wafer with use of X rays, wherein heights on the mask at many points are measured on a light interference band basis by a mask-height measuring device of non-contact measurement type at an X ray exposure position, the mask being mounted on a chamber which is filled with a He gas and or the like to prevent attenuation of an X ray source, heights on the wafer at many points are measured at a wafer-height measuring position different from said exposure position, and according to the measured results, the wafer is finely moved upwardly or downwardly (that is, deformed) individually independently by means of a chuck which sucks and holds the wafer at many points thereon so that, a gap between the mask and wafer is adjusted to a desired level.

Abstract: An exterior view examination apparatus comprising a movable sample stage provided in a sample chamber of a scanning type electron microscope; a sample mounted on the stage; and an optical microscope which can observe the sample from an exterior of the chamber, mounted on the chamber in parallel with the scanning type electron microscope, the position of a surface part of the sample (mounted on the sample stage) to be observed, measured or analyzed being preliminary defined by the optical microscope, and the sample stage being moved by a certain amount thereby to bring the sample at the center of the visual field of the electron microscope.

Abstract: A light exposure device and method for exposing and printing a predetermined pattern on an exposure surface of a substrate comprises measuring means for measuring curvature of the exposure surface of the substrate, a chuck including suck and hold means for sucking and holding a back surface of the substrate opposite to the exposure surface and deforming means for imparting a force to the back surface of the substrate to deform the substrate, and control means for controlling the deforming means of the chuck in accordance with the curvature of the exposure surface of the substrate measured by the measuring means such that the exposure surface of the substrate conforms to an image surface of the pattern over an entire exposure area within a predetermined allowable error.

Abstract: A method and apparatus for detecting positions of chips on a semiconductor wafer.