Abstract: A film forming method of forming a silicon carbide film on a substrate to be processed includes: forming the silicon carbide film on the substrate to be processed by loading a holder that holds the substrate to be processed into a processing container of a film forming apparatus to place the holder on a stage, and supplying a raw material gas into the processing container; and removing a reaction product, which has been adhered to a part other than the substrate to be processed during the forming the silicon carbide film, by loading a plate-shaped member having at least a surface formed by pyrolytic carbon into the processing container to place the plate-shaped member on the stage, and supplying a fluorine-containing gas into the processing container.

Abstract: An alloy material is provided which contains elements including, in mass %, C: 0.010 to 0.10%, Si: more than 0.10% to 0.50% or less, Mn:0.05 to 0.50%, Ni:34.5 to 37.0%, and Nb:0.001 to 1.0%, and which satisfies [T0?T1-2], [C—Nb/7.7-Ta/15?0.045], [Nb-7.7C?0.30], and [Ta-15C?0.30]. Where, each symbol of an element in the above formulas represents a content (mass %) of the corresponding element, T0 represents a Curie temperature (° C.) of the alloy material, and T1 represents a Curie temperature (° C.) of the alloy material after the alloy material is held at 900° C. for one minute and thereafter is cooled under conditions such that an average cooling rate in a temperature range from 600 to 300° C. is 0.2° C./s.

Abstract: A method for diagnosing myalgic encephalomyelitis/chronic fatigue syndrome (ME/CFS) is provided in the present disclosure. The present disclosure provides a method that uses the B cell receptor (BCR) repertoire as an indicator of myalgic encephalomyelitis/chronic fatigue syndrome (ME/CFS). One or more variables selected from the group consisting of the frequency of use of one or more genes in the IgGH heavy chain variable region of the BCR in a subject, the BCR diversity index in a subject, and the level of one or more immune cell subpopulations in a subject can be used as an indicator of ME/CFS in the subject.

Abstract: Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12<{(a1+a2)/2}/B??(1) 0.8?a1/a2?1.

Abstract: In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5° C. to +35° C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.

Abstract: The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.

Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

Abstract: In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one. surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5° C. to +35° C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.

Abstract: Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Abstract: Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12<{(a1+a2)/2}/B??(1) 0.8?a1/a2?1.

Abstract: The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.

Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

Abstract: Provided are: an FRP precursor capable of providing a metal-clad laminate having small surface waviness and reduced number of a light spot, even if thickness of a metal foil is 40 ?m or less; a laminated plate including the FRP precursor; a metal-clad laminate having a metal foil on the laminated plate; a printed circuit board having a circuit pattern formed on the metal-clad laminate; a semiconductor package including the printed circuit board; and methods for producing them. The FRP precursor has the surface waviness of 12 ?m or less on both surfaces thereof.

Abstract: Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Abstract: An object of the present invention is to provide a jig that does not require an operator to hold a lock ring against the elastic repulsion force of the lock ring that attempts to contract in a radial direction when the lock ring is attached to a rim base, the jig that is safe because there is no need for the operator to support the weight of the lock ring and can maintain a state in which, when the space between the ends of the lock ring is increased, the inside diameter side of the lock ring is a perfect circle or is close to a perfect circle. Thus, a lock ring mounting/demounting jig of the present invention is formed of a pair of jigs, the pair of jigs can be attached at both ends (4a, 4b) of a lock ring (4) and on the radial outside of the lock ring (4), and the angle formed by the direction in which the space between the pair of jigs expands and contracts and the longitudinal direction of each jig is changeable.

Abstract: Provided are: a method for producing an immortalized human erythroid progenitor cell line, enabling efficient and stable production of enucleated red blood cells; and a method for producing human enucleated red blood cells from a human erythroid progenitor cell line obtained by the aforementioned production method. An expression cassette capable of inducing expression of HPV-E6/E7 genes in the presence of DOX was introduced into the genomic DNA of blood stem cells. Then, the blood stem cells were cultured in the presence of DOX and a blood growth factor. Thereby, immortalized cell lines of human erythroid progenitor cells were established. Further, it was revealed that culturing the cell lines under a condition where the expression of the HPV-E6/E7 genes was not induced enabled differentiation induction into enucleated red blood cells at a high ratio.

Abstract: An object of the present invention is to provide a jig that does not require an operator to hold a lock ring against the elastic repulsion force of the lock ring that attempts to contract in a radial direction when the lock ring is attached to a rim base, the jig that is safe because there is no need for the operator to support the weight of the lock ring and can maintain a state in which, when the space between the ends of the lock ring is increased, the inside diameter side of the lock ring is a perfect circle or is close to a perfect circle. Thus, a lock ring mounting/demounting jig of the present invention is formed of a pair of jigs, the pair of jigs can be attached at both ends (4a, 4b) of a lock ring (4) and on the radial outside of the lock ring (4), and the angle formed by the direction in which the space between the pair of jigs expands and contracts and the longitudinal direction of each jig is changeable.

Abstract: Provided are: a method for producing an immortalized human erythroid progenitor cell line, enabling efficient and stable production of enucleated red blood cells; and a method for producing human enucleated red blood cells from a human erythroid progenitor cell line obtained by the aforementioned production method. An expression cassette capable of inducing expression of HPV-E6/E7 genes in the presence of DOX was introduced into the genomic DNA of blood stem cells. Then, the blood stem cells were cultured in the presence of DOX and a blood growth factor. Thereby, immortalized cell lines of human erythroid progenitor cells were established. Further, it was revealed that culturing the cell lines under a condition where the expression of the HPV-E6/E7 genes was not induced enabled differentiation induction into enucleated red blood cells at a high ratio.

Abstract: An information display apparatus includes a matrix of thin-film light-emitting diodes (LEDs) disposed on a transparent substrate. The thin-film LEDs are epitaxially grown on a semiconductor substrate, then transferred in strips to the transparent substrate, anchored by intermolecular forces, and separated into individual LEDs by photolithography and etching. The anodes and cathodes of the thin-film LEDs are connected to anode and cathode driving circuits by a matrix of thin-film electrical paths formed on the transparent substrate. The matrix of LEDs and interconnections is dense enough to display images of high quality, and provides enough pixels for the display of useful text and graphics on even small information display devices.

Abstract: A light source apparatus emits light image information. A reflective layer is formed on a planarization film formed on a metal substrate. LED thin films are arranged in a matrix having columns extending in first directions and rows extending in second directions perpendicular to the first directions, the LED thin films being bonded to the reflective layer by means of intermolecular force. First wires are connected to first electrodes of the LED thin films. Second wires are connected to second electrodes of the LED thin films. A first driver circuit selectively electrically drives the LED thin films, arranged in the rows, via the plurality of first wires. A second driver circuit selectively electrically drives the LED thin films, arranged in the rows, via the plurality of second wires.