Abstract: A peritoneal dialysis fluid characterized by the addition of 0.1 to 30 g/L of albumin. The peritoneal dialysis fluid reduces the occurrence of peritonitis during peritoneal dialysis.

Abstract: A light-emitting-diode array is formed on a substrate having an upper layer of a semiconducting material and a lower layer of an insulating or semi-insulating material. The upper layer is divided into blocks by isolation channels that cut completely through the upper layer. The light-emitting diodes, which are formed by selective diffusion of an impurity into the upper layer, are arranged in a single row, with at least two light-emitting diodes in each block of the upper layer. Each block has a block electrode that drives the light-emitting diodes in the block. The row of light-emitting diodes is paralleled by a number of shared lines which cross the isolation channels. Each shared line is coupled to a plurality of light-emitting diodes in different blocks.

Abstract: A high-density semiconductor device and semiconductor device array exhibiting high light emission efficiency which can be mass-produced at low cost with high yield is provided. An LED array comprises a structure wherein an n-type GaAs buffer layer 102 is formed on an n-type GaAs substrate 101, on which are then stacked an n-type AlzGa1−zAs layer 103, an n-type AlyGa1−yAs layer 104, a semi-insulating AlxGa1−xAs layer 105, and a semi-insulating GaAs layer 106. The energy band gaps of the AlzGa1−zAs layer 103 and AlxGa1−xAs layer 105 are at least larger than the energy band gap of the AlyGa1−yAs layer 104. A pn junction is formed by selective diffusion, having a diffusion front in the semiconductor layer having the smaller energy band gap sandwiched between the semiconductor layers having the larger energy band gaps. The outermost layer forming ohmic contact is made a p-type GaAs region formed by zinc diffusion in a semi-insulating GaAs layer.

Abstract: To achieve a reduction in the size of the print head and a reduction in the cost, LED array chips 1 achieved by matrix-connecting M×N LED elements 2 with M pad electrodes to be scanned 4 and N pad electrodes to be driven 3 and LED array drive ICs 10 are mounted at a mounting substrate 41. The pad electrodes to be driven 3 are connected with drive pad electrodes 16 and the pad electrodes to be scanned 4 are connected with scan pad electrodes 17 through wires 42a and 42b respectively. The pad electrodes to be driven 3 and the pad electrodes to be scanned 4 are provided in a single row along one side or edge of the lengthwise side of the chip.

Abstract: Disclosed is a novel renin-active substance by utilizing a anti-peptide antibody capable of specifically recognizing a specific amino acid sequence in the human propenin profragment exemplified, as a typical example, by a complex formed from human prorenin and an anti-peptide antibody capable of specifically recognizing an amino acid sequence consisting of at least 15 amino acid residues located within an amino acid sequence consisting of 33 amino acid residues between the isoleucine residue at the 11th site and the arginine residue at the 43rd site within human propenin profragment having an amino acid sequence consisting of 43 amino acid residues.

Abstract: A light emitting semiconductor device in which LEDs for emitting light different in wavelength from one another are densely integrated. First to fifth semiconductor layers are AlGaAs layers being different in Al composition ratio, and when it is assumed that the energy band gaps of the first to fifth semiconductor layers are respectively Eg1, Eg2, Eg3, Eg4 and Eg5, they satisfy the relation that Eg1<Eg2<Eg3<Eg4 and Eg1<Eg5. The pn fronts formed by p-type domains and the n-type domain of the semiconductor body are individually formed in the first semiconductor layer, the second semiconductor layer and the third semiconductor layer which form a stacked semiconductor layer. The LEDs emit light having wavelengths corresponding to the energy band gaps of the semiconductor layers in which the pn fronts are formed. These LEDs are integrated at intervals of a pitch between the p-type domains or the p-type electrodes.

Abstract: A light-sensing/emitting diode array chip has impurity diffusion regions with a depth of at least 0.5 .mu.m but not more than 2 .mu.m in a semiconductor substrate. Each impurity diffusion region is preferably divided into a first region, used for emitting or sensing light, and a wider second region, used for electrode contact. The second regions are located on alternate sides of the array line, permitting a small array pitch to be combined with a large contact area. In a wafer process for fabrication of the chips, a diffusion mask has both windows defining the impurity diffusion regions, and dicing line marks. The dicing line marks are narrowed where they pass adjacent to the windows at the ends of the chip. In the electrode fabrication step, a photomask with an enlarged pattern is used, to allow for misalignment with the diffusion mask.

Abstract: A light-emitting semiconductor device has a planar structure including two multilayer reflecting layers, two cladding layers, and an active layer of a first conductive type. The cladding layers have bandgap energies exceeding the bandgap energy of the active layer. The multilayer reflecting layers each include at least one constituent layer with a bandgap energy exceeding the bandgap energy of the active layer. An area of a second conductive type extends from the upper surface of the device through the upper multilayer reflecting layer and upper cladding layer into the active layer, forming a pn junction in the active layer. This planar structure is suitable for high-yield manufacturing.

Abstract: A compound semiconductor layer of a first conductivity type is formed on a substrate, and a diffusion region of a second conductivity type is formed on the compound semiconductor layer. The light-emitting diode has a high emitted light power, using a large-diameter wafer.

Abstract: A roll transfer coating method for hot melt adhesive comprising a step in which hot melt adhesive supplied from a hot melt adhesive supply apparatus passes through a slotted nozzle with a smoother roll and coats the raised pattern surface of a coating roll upon which a raised pattern is formed; a step in which the item being coated is sandwiched and compressed while being moved between the coating roll and a compression roll and the hot melt adhesive coated on the projections of the coating roll is transferred from the raised surface of the coating roll to the surface of the item being coated, and a step in which hot air for accelerating hot melt adhesive transfer is blown from a direction opposite the roll rotation direction and toward the hot melt adhesive transfer region sandwiched between the coating roll and compression roll.

Abstract: An alignment mark on a light-emitting diode (LED) array chip is formed together with the light-emitting areas of the diodes in the array, by use of a combined mask having a first part and a second part. An impurity is introduced through windows in the first part to form the light-emitting areas. Next the windows are covered with an etching resist, and the chip substrate is etched to create a topographic relief feature defined by the second part of the mask. This topographic relief feature is used as an alignment mark. When LED array chips having these alignment marks are mounted on a supporting surface, they are aligned by recognizing patterns of light reflected from the topographic relief, thereby detecting the positions of the alignment marks.

Abstract: An end facet light emitting type LED has a slanted light emitting side wall relative to a substrate surface. A method for manufacturing end facet light emitting type light emitting devices prevents the pn-junction regions of the devices from being damaged while a semiconductor wafer is diced to separate light emitting devices from one another. A recess is formed on the semiconductor wafer having a depth which is deeper than the pn-junction. A portion to be cut during dicing of the wafer is vertically and horizontally separated from the pn-junction regions, so that if cracks occur when the wafer is diced, the cracks do not affect the light emitting characteristics of the devices.

Abstract: A light-emitting-diode array is formed on a substrate having an upper layer of a semiconducting material and a lower layer of an insulating or semi-insulating material. The upper layer is divided into blocks by isolation channels that cut completely through the upper layer. The light-emitting diodes, which are formed by selective diffusion of an impurity into the upper layer, are arranged in a single row, with at least two light-emitting diodes in each block of the upper layer. Each block has a block electrode that drives the light-emitting diodes in the block. The row of light-emitting diodes is paralleled by a number of shared lines which cross the isolation channels. Each shared line is coupled to a plurality of light-emitting diodes in different blocks.

Abstract: Provided by the present invention are a human prorenin profragment N-terminated peptide antibody capable of specifically recognizing a peptide containing at least 15 amino acid residues from the first leucine residue to the 15th arginine residue in the N-terminated peptide of the human prorenin profragment and a complex of the same with human prorenin. The antibody can be used as a prorenin assay reagent. The human prorenin profragment N-terminated peptide antibody is useful as a reagent for the assay of human prorenin in blood.

Abstract: An alignment mark on a light-emitting diode (LED) array chip is formed together with the light-emitting areas of the diodes in the array, by use of a combined mask having a first part and a second part. An impurity is introduced through windows in the first part to form the light-emitting areas. Next the windows are covered with an etching resist, and the chip substrate is etched to create a topographic relief feature defined by the second part of the mask. This topographic relief feature is used as an alignment mark. When LED array chips having these alignment marks are mounted on a supporting surface, they are aligned by recognizing patterns of light reflected from the topographic relief, thereby detecting the positions of the alignment marks.

Abstract: A high frequency semiconductor device includes a molded resin package having side surfaces; a source lead for die-bonding, having a thickness, partially disposed within the package, and penetrating through the side surfaces of the package; gate and drain leads having the same thickness as the source lead and disposed adjacent to and spaced from the source lead by a distance shorter than the thickness of the source lead, the gate and drain leads being partially disposed within the package and penetrating through the side surfaces of the package; and a field effect transistor die-bonded to the source lead within the package and electrically connected within the package to the source, gate, and drain leads.

Abstract: An oxygen sensor and sensor mounting arrangement for a control system of an internal combustion engine is disclosed. The oxygen sensor senses the actual combustion conditions in a combustion chamber. An insulating arrangement is provided including an insulated conduit and an insulated sensor body for maintaining high temperature of the sensor element by avoiding heat transfer from the conduit and sensor body to the engine body.

Abstract: A light-emitting-diode array includes a non-doped compound semiconductor layer between a substrate and a first compound semiconductor layer. A plurality of isolation regions extend from the first compound semiconductor layer to the surface of the non-doped compound semiconductor layer, and provide separation into isolated block regions each containing an equal number of diffusion regions. A plurality of shared electrode lines are connected to the diffusion regions in a plurality of the block regions, in such a relationship that diffusion regions selected from each of the block regions are connected to a common shared electrode. At least a surface portion of the substrate is formed of silicon. The density of the diffusion regions can be increased without increasing the number of the electrode pads. Moreover, the substrate is free from breakage or cracks.

Abstract: An end face light-emitting-type LED has a first-conductive-type semiconductor substrate and a second-conductive-type diffusion region formed on a first surface of the first-conductive-type semiconductor substrate so as to have a depth within a predetermined value. The first-conductive-type semiconductor substrate has a second surface which meets the first surface at a predetermined angle with the first surface. A junction between the first-conductive-type semiconductor substrate and the second-conductive-type diffusion region includes an inclined portion with regard to the first surface in the vicinity of an edge portion of the junction which is on a side of the second surface, and light emerges from the junction via the second surface.

Abstract: A method of fabricating an LED array includes forming a first insulating film composed of aluminum oxide on a semiconductor substrate of a first conductive type; patterning the first insulating film by photolithography to form a plurality of first windows; diffusing an impurity of a second conductive type through the plurality of first windows into the first insulating film, thereby forming a plurality of diffusion regions of the second conductive type below the plurality of first windows; forming a second insulating film on the first insulating film and the plurality of first windows; patterning the second insulating film by photolithography to-remove the second insulating film from the plurality of first windows, using an etchant that does not etch the first insulating film; forming a metal film on the second insulating film and the plurality of first windows; and patterning the metal film by photolithography to form a plurality of electrodes which make electrical contact with respective diffusion regions.