Patents by Inventor Yukio Shimizu
Yukio Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8638542Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.Type: GrantFiled: July 9, 2010Date of Patent: January 28, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Yukio Shimizu, Tomoo Yamasaki, Yuta Sakaguchi
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Patent number: 8547810Abstract: A reading unit reads sound signals recorded in a recording medium. A buffer unit temporarily stores the sound signals which is read by the reading unit. A recording unit records the sound signal which is temporarily stored in the buffer unit. A reproducing unit reproduces the sound signals which is recorded in the recording unit. A controller controls reading speed of the reading unit. The sound signals include a first set of signals and a second set of signals. The reading unit reads the first set of signals at a first reading speed and reads the second set of signals at a second reading speed which is faster than the first reading speed after reading the first set of signals.Type: GrantFiled: October 27, 2006Date of Patent: October 1, 2013Assignee: Fujitsu Ten LimitedInventors: Shinsuke Yuri, Yukio Shimizu, Jyun Shimizu, Ichirou Kugou, Chiyohiko Kobayashi
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Patent number: 8450753Abstract: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.Type: GrantFiled: June 2, 2009Date of Patent: May 28, 2013Assignee: Sharp Kabushiki KaishaInventors: Motoji Shiota, Gen Nagaoka, Ichiro Umekawa, Yasuhiro Hida, Yukio Shimizu
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Patent number: 8421979Abstract: A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).Type: GrantFiled: May 21, 2009Date of Patent: April 16, 2013Assignee: Sharp Kabushiki KaishaInventors: Yukio Shimizu, Takashi Matsui, Motoji Shiota, Keigo Aoki, Hiroki Nakahama
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Patent number: 8304664Abstract: An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.Type: GrantFiled: May 11, 2010Date of Patent: November 6, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Tsuyoshi Kobayashi, Michio Horiuchi, Yukio Shimizu, Yasue Tokutake
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Patent number: 8134444Abstract: An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.Type: GrantFiled: October 1, 2010Date of Patent: March 13, 2012Assignee: Shinko Electronic Industries Co., Ltd.Inventors: Michio Horiuchi, Yukio Shimizu, Kazunari Sekigawa, Tsuyoshi Kobayashi
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Patent number: 8112772Abstract: The present invention is an electronic apparatus including: an electronic apparatus main body 1; a panel main body that has a first guided component guided by a first guide groove C1 formed in the electronic apparatus main body, and moves in an inclined state with respect to the electronic apparatus main body; and a hold plate 6 that has a second guided portion guided by a second guide groove C2 formed in the electronic apparatus main body, and slidably holds the panel main body. According to the present invention, a mechanism for tilting the panel main body and a mechanism for sliding the panel main body are provided separately from each other, so that the panel main body having an increased weight can be operated smoothly in the inclined state.Type: GrantFiled: June 2, 2006Date of Patent: February 7, 2012Assignee: Fujitsu Ten LimitedInventors: Yuzuru Sugiura, Yasuhiro Yuda, Yukio Shimizu, Masatoshi Ohtani, Yuya Tanaka
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Publication number: 20110320988Abstract: An apparatus for generating a layout pattern of each element includes a storage, a basic figure generator, an additional figure generator, a display unit and an operation input unit; wherein the storage stores terminal figure relative position information, figure adjustment value information and additional figure relative position information; the basic figure generator generates an effective area figure and a terminal figure of a layout pattern generation target element on the basis of the terminal figure relative position information and the figure adjustment value information; the additional figure generator generates the additional figure of the layout pattern generation target element on the basis of the generated effective area figure and terminal figure and the additional figure relative position information; the display unit displays the generated effective area figure, terminal figure and additional figure; and the figure adjustment value information is changed depending on an input from the operatioType: ApplicationFiled: June 16, 2011Publication date: December 29, 2011Applicant: OKI SEMICONDUCTOR CO., LTD.Inventor: Yukio SHIMIZU
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Publication number: 20110169022Abstract: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.Type: ApplicationFiled: June 2, 2009Publication date: July 14, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Motoji Shiota, Gen Nagaoka, Ichiro Umekawa, Yasuhiro Hida, Yukio Shimizu
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Publication number: 20110169792Abstract: The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel (10) has a configuration in which jumper resistors (60a) to (60f) are provided in an overhanging portion (20a) of a glass substrate (20) to ground test terminals, which eliminates the need to ground the test terminals on an FPC board (50). Thus, wiring lines and connection terminals which are connected to the test terminals, respectively, and the numbers of which are equal to the number of the test terminals do not need to be provided on the FPC board (50), reducing the width of the FPC board (50).Type: ApplicationFiled: June 15, 2009Publication date: July 14, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Yukio Shimizu, Gen Nagaoka, Ichiro Umekawa, Motoji Shiota, Yasuhiro Hida
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Publication number: 20110169791Abstract: In a liquid crystal display device (10), stabilizing capacitors (61), bypass capacitors (62) and boosting capacitors (63), which would conventionally be mounted on an FPC board (50), are disposed along long and short input sides of an LSI chip (40) mounted on a projection (20a) of a glass substrate (20) and the capacitors are connected to their respective input terminals of the LSI chip (40) via capacitor traces (71). This makes it possible to narrow the FPC board (50) connected to the liquid crystal display device (10), thereby achieving size reduction of the liquid crystal display device (10) while achieving reduction in manufacturing cost, including processing and material cost of the FPC board (50).Type: ApplicationFiled: June 19, 2009Publication date: July 14, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Yasuhiro Hida, Gen Nagaoka, Ichiro Umekawa, Motoji Shiota, Yukio Shimizu
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Publication number: 20110122337Abstract: A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).Type: ApplicationFiled: May 21, 2009Publication date: May 26, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Yukio Shimizu, Takashi Matsui, Motoji Shiota, Keigo Aoki, Hiroki Nakahama
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Publication number: 20110080247Abstract: An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.Type: ApplicationFiled: October 1, 2010Publication date: April 7, 2011Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Michio HORIUCHI, Yukio Shimizu, Kazunari Sekigawa, Tsuyoshi Kobayashi
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Publication number: 20110013340Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.Type: ApplicationFiled: July 9, 2010Publication date: January 20, 2011Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTDInventors: Michio HORIUCHI, Yasue Tokutake, Yuichi Matsuda, Yukio Shimizu, Tomoo Yamasaki, Yuta Sakaguchi
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Publication number: 20100294552Abstract: An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.Type: ApplicationFiled: May 11, 2010Publication date: November 25, 2010Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTDInventors: Tsuyoshi KOBAYASHI, Michio Horiuchi, Yukio Shimizu, Yasue Tokutake
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Publication number: 20100085494Abstract: An in-vehicle apparatus such as a navigation system can be installed in an instrument panel in a vehicle, and includes a main unit, a display for displaying video output from the main unit, and a holder frame for holding the display and for adjustably connecting to the main unit. The holder is connected, at a predetermined position, to a finisher having an opening for allowing viewing of the display. As a result, the display is placed at a predetermined position relative to the finisher.Type: ApplicationFiled: July 7, 2009Publication date: April 8, 2010Applicant: FUJITSU TEN LIMITEDInventors: Yukio Shimizu, Masataka Sakata
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Patent number: 7597290Abstract: A tilting apparatus is provided which can make a moving section perform a tilting operation with stability or in which a moving section can exercise its functionality as expected, and an electronic apparatus equipped with the tilting apparatus is provided. In a tilting apparatus, with first and second tilting operations, one side of a first panel holder is angularly displaced with respect to the other side from a reference position. This can prevent the first panel holder from making any extra operation other than the first and second tilting operations with respect to a device body. Unlike any existing technology, in the invention, even when the first and second tilting operations are put into action, a first chassis is not displaced against the device body unless it is desired, e.g., displaced along front, and juts from the device body, thereby favorably leading to the operation with stability.Type: GrantFiled: March 29, 2006Date of Patent: October 6, 2009Assignee: Fujitsu Ten LimitedInventors: Yuzuru Sugiura, Yukio Shimizu, Tetsuo Sano, Shogo Tanaka
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Publication number: 20080235716Abstract: The present invention is an electronic apparatus including: an electronic apparatus main body 1; a panel main body that has a first guided component guided by a first guide groove C1 formed in the electronic apparatus main body, and moves in an inclined state with respect to the electronic apparatus main body; and a hold plate 6 that has a second guided portion guided by a second guide groove C2 formed in the electronic apparatus main body, and slidably holds the panel main body. According to the present invention, a mechanism for tilting the panel main body and a mechanism for sliding the panel main body are provided separately from each other, so that the panel main body having an increased weight can be operated smoothly in the inclined state.Type: ApplicationFiled: June 2, 2006Publication date: September 25, 2008Applicant: FUJITSU TEN LIMITEDInventors: Yuzuru Sugiura, Yasuhiro Yuda, Yukio Shimizu, Masatoshi Ohtani, Yuya Tanaka
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Publication number: 20080106859Abstract: There are provided a display panel mounted in a tiltable manner on the front face portion of a main body portion, an operation panel to be mounted in a tiltable manner on the display panel, a tilt control part for controlling to tilt the display panel in response to a first tilt command and to tilt the operation panel in response to a second tilt command, and a memory part for storing inclination angle information of the operation panel corresponding to the inclination angle of the display panel. The tilt control part tilts the display panel in response to the first tilt command, and also tilts the operation panel based on the inclination angle information of the operation panel stored in the memory part.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Applicant: FUJITSU TEN LIMITEDInventors: Takashi Eguchi, Masatoshi Otani, Yukio Shimizu, Kaede Motoyama, Noriyuki Kamikawa, Osamu Kukimoto, Masahiko Nakano, Humitake Nakamura
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Patent number: 7356954Abstract: A main unit includes a slider and a guide groove. A display panel includes a slider engaging portion coupled to the slider being guided by the slider and a guide-groove engaging portion slidably engaged with the guide groove being guided by the guide-groove so that the display panel can be inclined. A pressing lever presses the guide-groove engaging portion with resilient force of a resilient member. The guide-groove includes a parallel groove formed in parallel with a direction of movement of the slider; and a curved groove having a width narrower than that of the parallel groove and being connected to the parallel groove. The guide-groove engaging portion moves in the parallel groove by the movement of the slider and a pressing force of the pressing lever.Type: GrantFiled: November 30, 2004Date of Patent: April 15, 2008Assignee: Fujitsu Ten LimitedInventors: Yukio Shimizu, Shinsuke Yuri