Abstract: The present invention provides an imprint apparatus which performs an imprint process for forming a pattern on an imprint material on a substrate using a mold, the apparatus including an obtaining unit configured to obtain each shape of a plurality of shot regions on the substrate before the mold and the shot region as an imprint target on the substrate face each other, a first correction unit configured to correct, for each shot region on the substrate, a shape difference between a pattern of the mold and the shot region, a measurement unit configured to measure a displacement between the pattern of the mold and the shot region on the substrate, a second correction unit configured to correct the displacement, and a control unit configured to control the imprint process.

Abstract: An imprint method for forming a pattern on a substrate by using a mold includes carrying the substrate into an imprint apparatus, removing, after the substrate is carried into the imprint apparatus, a whole or a portion of foreign particles adhering to a pattern formed on the mold by bringing into contact the mold and an imprint material supplied to a member different from the substrate within the imprint apparatus, and curing the imprint material so as to form the pattern, and forming the pattern on the substrate that has carried into the imprint apparatus, by using the mold from which the foreign particles are removed.

Abstract: An imprint method for transferring a pattern to an imprint material supplied to a plurality of shot areas on a substrate using a mold includes removing a foreign matter attached to a pattern of the mold in such a manner that the plurality of shot areas includes a part shot-area where a part of pattern of the mold can be formed and the mold is brought into contact with an imprint material supplied to the part shot-area to transfer the pattern of the mold to the substrate and transferring a pattern to the shot area excluding the part shot-area, among the plurality of shot areas, using the mold used in the removing the foreign matter.

Abstract: Provided is an imprint apparatus that imprints a pattern formed on a mold onto a substrate. The imprint apparatus includes a substrate holder that holds the substrate and can move in a direction along the surface of the substrate; a gas supply unit for supplying a gas into a space between a pattern part of the mold and the substrate; and a wall part that is disposed so as to enclose the space that is supplied with gas, wherein at a position opposed to the substrate and the mold, the wall part faces the substrate holder or the substrate with a gap therebetween.

Abstract: An imprint apparatus forms a resin pattern on a substrate by curing resin in a state where the resin on the substrate is in contact with a patterned portion of a mold. It includes: a gas supply unit which supplies gas to a space between the mold and the substrate; a measuring unit which is configured so that measuring light transits the space or a space that communicates with the space, and which measures a prescribed distance between two objects using the measuring light; and a controller which obtains information concerning the prescribed distance, and which outputs a signal representing a state of concentration of the gas in the space based on the information and a measurement result of the measuring unit in a state where the gas is supplied from the gas supply unit.

Abstract: The present invention provides an imprint apparatus which performs an imprint process for forming a pattern on an imprint material on a substrate using a mold, the apparatus including an obtaining unit configured to obtain each shape of a plurality of shot regions on the substrate before the mold and the shot region as an imprint target on the substrate face each other, a first correction unit configured to correct, for each shot region on the substrate, a shape difference between a pattern of the mold and the shot region, a measurement unit configured to measure a displacement between the pattern of the mold and the shot region on the substrate, a second correction unit configured to correct the displacement, and a control unit configured to control the imprint process.

Abstract: An imprint method for forming a pattern on a substrate by using a mold includes carrying the substrate into an imprint apparatus, removing, after the substrate is carried into the imprint apparatus, a whole or a portion of foreign particles adhering to a pattern formed on the mold by bringing into contact the mold and an imprint material supplied to a member different from the substrate within the imprint apparatus, and curing the imprint material so as to form the pattern, and forming the pattern on the substrate that has carried into the imprint apparatus, by using the mold from which the foreign particles are removed.

Abstract: An imprint method for transferring a pattern to an imprint material supplied to a plurality of shot areas on a substrate using a mold includes removing a foreign matter attached to a pattern of the mold in such a manner that the plurality of shot areas includes a part shot-area where a part of pattern of the mold can be formed and the mold is brought into contact with an imprint material supplied to the part shot-area to transfer the pattern of the mold to the substrate and transferring a pattern to the shot area excluding the part shot-area, among the plurality of shot areas, using the mold used in the removing the foreign matter.

Abstract: Provided is an imprint apparatus that imprints a pattern formed on a mold onto a substrate. The imprint apparatus includes a substrate holder that holds the substrate and can move in a direction along the surface of the substrate; a gas supply unit for supplying a gas into a space between a pattern part of the mold and the substrate; and a wall part that is disposed so as to enclose the space that is supplied with gas, wherein at a position opposed to the substrate and the mold, the wall part faces the substrate holder or the substrate with a gap therebetween.

Abstract: A transfer apparatus transfers a pattern of an original to a resin on a shot region of a substrate. The original includes a first surface and second surface which are surfaces opposite to each other. The first surface includes a pattern region where the pattern is formed, and the second surface includes a holding surface. The apparatus includes a plurality of holding units configured to hold the holding surface of the original, a plurality of driving units configured to drive the plurality of holding units, respectively, and a control unit configured to control driving of the plurality of holding units by the plurality of driving units to align the pattern region with the shot region of the substrate.

Abstract: An imprint apparatus forms a resin pattern on a substrate by curing resin in a state where the resin on the substrate is in contact with a patterned portion of a mold. It includes: a gas supply unit which supplies gas to a space between the mold and the substrate; a measuring unit which is configured so that measuring light transits the space or a space that communicates with the space, and which measures a prescribed distance between two objects using the measuring light; and a controller which obtains information concerning the prescribed distance, and which outputs a signal representing a state of concentration of the gas in the space based on the information and a measurement result of the measuring unit in a state where the gas is supplied from the gas supply unit.

Abstract: A scanning exposure apparatus projects a pattern of an original onto a substrate via a projection optical system and shifts the original and the substrate in synchronization with each other with respect to an optical axis of the projection optical system so as to transfer the pattern of the original to the substrate by exposure. The scanning exposure apparatus includes a unit configured to correct a relative position between the original and the substrate by a correction amount according to a shifting rate at which the original and the substrate are shifted in synchronization with each other.

Abstract: An apparatus includes a control unit configured to control an exposure unit and a driving unit such that exposure of a first region of a substrate starts and ends while a substrate stage is accelerated in a first direction parallel to a scanning direction, an absolute value of maximum acceleration of the substrate stage during a deceleration period is greater than an absolute value during a first approach run period, and a distance by which the substrate stage moves during the first approach run period is approximately equal to a distance by which the substrate stage moves during the deceleration period.

Abstract: A vibration suppression apparatus includes three first actuators, at least one second actuator, detectors, and a controller. The first actuators and second actuator support a structure by applying forces to the structure in the vertical direction or horizontal direction, and do not align themselves on the identical straight line. The detectors detect at least one of vibration and a position of the structure with respect to a reference position. The controller controls the forces, applied to the structure by the first actuators, based on the outputs from the detectors. The second actuator is controlled so that a force applied to the structure in the vertical direction or horizontal direction is maintained constant.

Abstract: A method includes a step of processing a substrate with a substrate processing apparatus that includes a chuck configured to hold a substrate, and a support member configured to support the chuck. A cleaning mechanism is configured to move at least one of the chuck and the support member such that the chuck and the support member move relative to each other while staying in substantial contact with each other. An additional step moves a foreign substance between protrusions on the chuck and the support member.

Abstract: A scanning exposure apparatus projects a pattern of an original onto a substrate via a projection optical system and shifts the original and the substrate in synchronization with each other with respect to an optical axis of the projection optical system so as to transfer the pattern of the original to the substrate by exposure. The scanning exposure apparatus includes a unit configured to correct a relative position between the original and the substrate by a correction amount according to a shifting rate at which the original and the substrate are shifted in synchronization with each other.

Abstract: Disclosed is a wafer chuck, which has protrusions for supporting a substrate, for attracting and holding the substrate by negative pressure while the substrate is being supported by the protrusions. The wafer chuck includes pin-shaped protrusions dispersed on a suction side of the chuck, and circular peripheral wall portions disposed in the vicinity of the rim of the supported substrate and in the vicinity of the outer peripheral portion of a lifting hole, respectively. The suction side of the wafer chuck is provided with a first area in which the pin-shaped protrusions are arrayed in a grid-line manner, and a second area in which the pin-shaped protrusions are arrayed in circumferential form. The second area is provided in the vicinity of the peripheral wall portion and peripheral wall portion, and the first area is provided elsewhere.

Abstract: A holding device including an object to be held by the holding device and having six first flat surfaces, a holding member having six second flat surfaces each being opposed to and parallel to a corresponding one of the first flat surfaces, wherein the holding member has three holding portions of one of a protruded shape and a recessed shape, and wherein two of the second flat surfaces define at least a portion of the protruded shape or recessed shape of the holding portions, and rolling elements each being provided between associated ones of the first and second flat surfaces. The object is supported by the holding member through the rolling elements.

Abstract: A moving mechanism includes a first structural member having a first guide surface, a moving member being movable along the first guide surface, a second structural member having a second guide surface, and an actuator having a movable element provided on the moving member and a stator which is movable along the second guide surface. The first structural member is supported by the second structural member at three positions.

Abstract: A retainer for holding an optical element having three first grooves includes a first support member that supports the optical element through the first grooves, and a second support member that has three second grooves corresponding to the first grooves, and supports the first support member through the second grooves.