Abstract: A suction method is provided as a method of performing, by using a suction collet, suction of a Fabry-Perot interference filter including: a substrate; a laminated structure that is provided on the substrate and that includes a main surface facing a side opposite to the substrate; and a thinned portion that is located outside the laminated structure when viewed in a direction intersecting the main surface and that is recessed to a side of the substrate with respect to the main surface, the method including: a first step of arranging the suction collet so as to face the main surface; a second step of bringing the suction collet into contact with the Fabry-Perot interference filter after the first step; and a third step of suctioning the Fabry-Perot interference filter by using the suction collet after the second step.

Abstract: Provided is a non-transitory computer-readable recording medium recording an optical measurement control program in a light detection device, the program causing a computer to execute a process of measuring light to be measured by acquiring an electric signal output from the light detector, the optical measurement control program causing the computer to function as: a voltage control unit controlling the potential difference generated between the pair of mirrors to gradually increase until the potential difference reaches a set potential difference corresponding to a wavelength of the light to be measured before the acquisition of the electric signal is started; and a signal acquisition unit acquiring the electric signal in a state where the voltage control unit allows the set potential difference to be generated between the pair of mirrors.

Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first mirror layer having a plurality of first mirror portions, a sacrificial layer having a plurality of portions expected to be removed, and a second mirror layer having a plurality of second mirror portions on a first main surface of a wafer which includes parts corresponding to a plurality of two-dimensionally arranged substrates and is expected to be cut into the plurality of substrates along each of a plurality of lines; a removing step of simultaneously removing the plurality of two-dimensionally arranged portions expected to be removed from the sacrificial layer through etching after the Ruining step; and a cutting step of cutting the wafer into the plurality of substrates along each of the plurality of lines after the removing step.

Abstract: A light detection device includes a package including a window, a Fabry-Perot interference filter for transmitting light incident from the window in the package, and a light detector for detecting the light transmitted by the Fabry-Perot interference filter in the package. The Fabry-Perot interference filter includes: a substrate having a first surface on the window side and a second surface on the light detector side; a first layer structure arranged on the first surface, the first layer structure having a first mirror and a second mirror; and a lens unit integrally formed on the second surface side, the lens unit for condensing the light transmitted by the first mirror and the second mirror onto the light detector.

Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.

Abstract: A light detection device includes a package including a window, a Fabry-Perot interference filter for transmitting light incident from the window in the package, and a light detector for detecting the light transmitted by the Fabry-Perot interference filter in the package. The Fabry-Perot interference filter includes: a substrate having a first surface on the window side and a second surface on the light detector side; a first layer structure arranged on the first surface, the first layer structure having a first mirror and a second mirror, and a lens unit integrally formed on the second surface side, the lens unit for condensing the light transmitted by the first mirror and the second mirror onto the light detector.

Abstract: A light detection device includes: a package including an opening configured to allow light to enter therefrom; a light transmitting unit arranged on an inner surface of the package so as to close the opening; a Fabry-Perot interference filter arranged in the package and configured to transmit light transmitted by the light transmitting unit; and a light detector arranged in the package and configured to detect the light transmitted by the Fabry-Perot interference filter. The light transmitting unit is integrally configured by including: a band pass filter arranged in the package and configured to transmit the light to be incident on the Fabry-Perot interference filter; and at least one lens unit configured to condense the light to be incident on the Fabry-Perot interference filter.

Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.

Abstract: The Fabry-Perot interference filter includes: a substrate having a first surface, a first laminate having a first mirror portion disposed on the first surface, a second laminate having a second mirror portion facing the first mirror portion with an air gap interposed therebetween, and an intermediate layer defining the air gap between the first and second laminate. The substrate has an outer edge portion positioned outside an outer edge of the intermediate layer when viewed from a direction perpendicular to the first surface. The second laminate further includes a covering portion covering the intermediate layer and a peripheral edge portion positioned on the first surface in the outer edge portion. The second mirror portion, the covering portion, and the peripheral edge portion are integrally formed so as to be continuous with each other. The peripheral edge portion is thinned along an outer edge of the outer edge portion.

Abstract: A Fabry-Perot interference filter includes a substrate that has a first surface, a first laminate that has a first mirror portion, a second laminate that has a second mirror portion facing the first mirror portion via a gap, an intermediate layer that defines the gap between the first laminate and the second laminate, and a first terminal. The intermediate layer has a first inner surface surrounding the first terminal. The first inner surface is curved such that an edge portion of the intermediate layer on the substrate side is positioned on the first terminal side relative to an edge portion of the intermediate layer on a side opposite to the substrate.

Abstract: An electrical inspection method includes: a step of preparing a wafer in which a plurality of Fabry-Perot interference filter portions is formed, each of the plurality of Fabry-Perot interference filter portions in which a distance between a first mirror portion and a second mirror portion facing each other varies by an electrostatic force; and a step of inspecting electrical characteristics of each of the plurality of Fabry-Perot interference filter portions.

Abstract: A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. A plurality of Fabry-Perot interference filter portions are formed in an effective area, in each of the plurality of Fabry-Perot interference filter portions a gap is formed between the first mirror portion and the second mirror portion. A plurality of dummy filter portions are formed in a dummy area disposed along an outer edge of the substrate layer and surrounding the effective area, in each of the plurality of dummy filter portions an intermediate layer is provided between the first mirror portion and the second mirror portion. At least the second mirror portion is surrounded by the first groove in each of the plurality of Fabry-Perot interference filter portions and the plurality of dummy filter portions.

Abstract: A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. In the wafer, a gap is formed between the first mirror portion and the second mirror portion so as to form a plurality of Fabry-Perot interference filter portions. A wafer inspection method according to an embodiment includes a step of performing faulty/non-faulty determination of each of the plurality of Fabry-Perot interference filter portions, and a step of applying ink to at least part of a portion overlapping the gap when viewed in a facing direction on the second mirror layer of the Fabry-Perot interference filter portion determined as faulty.

Abstract: A method for removing a foreign substance according to an embodiment includes: a step of preparing a Fabry-Perot interference filter in which a gap is formed between a portion of a first laminate at least including a first mirror portion and a portion of a second laminate at least including a second mirror portion facing each other so that a distance between the first mirror portion and the second mirror portion facing each other varies by an electrostatic force; a step of detecting a foreign substance adhering to a surface of the second laminate; and a step of blowing air in which an airflow peak position is adjusted on the basis of a position of the detected foreign substance onto the surface of the second laminate and thereby removing the foreign substance from the surface of the second laminate.

Abstract: A transportation method for transporting an object including a plurality of Fabry-Perot interference filters, the transportation method including a first step of accommodating the object in an accommodating container, wherein the Fabry-Perot interference filter includes a substrate, a first mirror portion and a second minor portion provided on the substrate to face each other via a gap and in which a distance from each other is variable, and in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged.

Abstract: An optical inspection device includes: a wafer support unit configured to support a wafer in which a plurality of Fabry-Perot interference filter portions are formed, each of the plurality of filter portions in which a distance between the first mirror portion and the second mirror portion facing each other varies by an electrostatic force, the wafer support unit configured to support the wafer such that a direction in which the first mirror portion and the second mirror portion face each other follows along a reference line; a light emission unit configured to emit light to be incident on each of the plurality of filter portions along the reference line; and a light detection unit configured to detect light transmitted through each of the plurality of filter portions along the reference line. The wafer support unit has a light passage region that allows light to pass along the reference line.

Abstract: A Fabry-Perot interference filter includes a substrate that has a first surface, a first laminate that has a first mirror portion disposed on the first surface, a second laminate that has a second mirror portion facing the first mirror portion via a gap on a side opposite to the substrate with respect to the first mirror portion, and an intermediate layer that defines the gap between the first laminate and the second laminate. An outer surface of the intermediate layer is curved such that an edge portion of the intermediate layer on the substrate side is positioned on an outer side of an edge portion of the intermediate layer on the side opposite to the substrate in a direction parallel to the first surface. The second laminate covers the outer surface of the intermediate layer.

Abstract: Provided is a non-transitory computer-readable recording medium recording an optical measurement control program in a light detection device, the program causing a computer to execute a process of measuring light to be measured by acquiring an electric signal output from the light detector, the optical measurement control program causing the computer to function as: a voltage control unit controlling the potential difference generated between the pair of mirrors to gradually increase until the potential difference reaches a set potential difference corresponding to a wavelength of the light to be measured before the acquisition of the electric signal is started; and a signal acquisition unit acquiring the electric signal in a state where the voltage control unit allows the set potential difference to be generated between the pair of mirrors.

Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first mirror layer having a plurality of first mirror portions, a sacrificial layer having a plurality of portions expected to be removed, and a second mirror layer having a plurality of second mirror portions on a first main surface of a wafer which includes parts corresponding to a plurality of two-dimensionally arranged substrates and is expected to be cut into the plurality of substrates along each of a plurality of lines; a removing step of simultaneously removing the plurality of two-dimensionally arranged portions expected to be removed from the sacrificial layer through etching after the Ruining step; and a cutting step of cutting the wafer into the plurality of substrates along each of the plurality of lines after the removing step.

Abstract: A light detection device includes: a package including an opening configured to allow light to enter therefrom; a light transmitting unit arranged on an inner surface of the package so as to close the opening; a Fabry-Perot interference filter arranged in the package and configured to transmit light transmitted by the light transmitting unit; and a light detector arranged in the package and configured to detect the light transmitted by the Fabry-Perot interference filter. The light transmitting unit is integrally configured by including: a band pass filter arranged in the package and configured to transmit the light to be incident on the Fabry-Perot interference filter; and at least one lens unit configured to condense the light to be incident on the Fabry-Perot interference filter.