Patents by Inventor Yumi KURAMOTO

Yumi KURAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190204150
    Abstract: The Fabry-Perot interference filter includes: a substrate having a first surface, a first laminate having a first mirror portion disposed on the first surface, a second laminate having a second mirror portion facing the first mirror portion with an air gap interposed therebetween, and an intermediate layer defining the air gap between the first and second laminate. The substrate has an outer edge portion positioned outside an outer edge of the intermediate layer when viewed from a direction perpendicular to the first surface. The second laminate further includes a covering portion covering the intermediate layer and a peripheral edge portion positioned on the first surface in the outer edge portion. The second mirror portion, the covering portion, and the peripheral edge portion are integrally formed so as to be continuous with each other. The peripheral edge portion is thinned along an outer edge of the outer edge portion.
    Type: Application
    Filed: May 1, 2017
    Publication date: July 4, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KASAHARA, Katsumi SHIBAYAMA, Masaki HIROSE, Toshimitsu KAWAI, Hiroki OYAMA, Yumi KURAMOTO
  • Publication number: 20190186994
    Abstract: A Fabry-Perot interference filter includes a substrate that has a first surface, a first laminate that has a first mirror portion disposed on the first surface, a second laminate that has a second mirror portion facing the first mirror portion via a gap on a side opposite to the substrate with respect to the first mirror portion, and an intermediate layer that defines the gap between the first laminate and the second laminate. An outer surface of the intermediate layer is curved such that an edge portion of the intermediate layer on the substrate side is positioned on an outer side of an edge portion of the intermediate layer on the side opposite to the substrate in a direction parallel to the first surface. The second laminate covers the outer surface of the intermediate layer.
    Type: Application
    Filed: July 5, 2017
    Publication date: June 20, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KASAHARA, Katsumi SHIBAYAMA, Masaki HIROSE, Toshimitsu KAWAI, Hiroki OYAMA, Yumi KURAMOTO
  • Publication number: 20190179131
    Abstract: A Fabry-Perot interference filter includes a substrate that has a first surface, a first laminate that has a first mirror portion, a second laminate that has a second mirror portion facing the first mirror portion via a gap, an intermediate layer that defines the gap between the first laminate and the second laminate, and a first terminal. The intermediate layer has a first inner surface surrounding the first terminal. The first inner surface is curved such that an edge portion of the intermediate layer on the substrate side is positioned on the first terminal side relative to an edge portion of the intermediate layer on a side opposite to the substrate.
    Type: Application
    Filed: July 5, 2017
    Publication date: June 13, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KASAHARA, Katsumi SHIBAYAMA, Masaki HIROSE, Toshimitsu KAWAI, Hiroki OYAMA, Yumi KURAMOTO
  • Publication number: 20180373021
    Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.
    Type: Application
    Filed: May 1, 2017
    Publication date: December 27, 2018
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KASAHARA, Katsumi SHIBAYAMA, Masaki HIROSE, Toshimitsu KAWAI, Hiroki OYAMA, Yumi KURAMOTO