Abstract: A system for recognizing physiological sound comprises a receiving module, a feature extracting module, a classifier, and a comparing module. A method for recognizing physiological sound comprises receiving a physiological sound by the receiving module; extracting at least one feature from the physiological sound by the feature extraction module; classifying the at least one feature to identify at least one category by a classifier; and comparing the at least one category with a normal physiological sound and/or an abnormal physiological sound by the comparing module for evaluating a risk of disease. The method and system for recognizing physiological sound can precisely identify the specific physiological sound and exclude the noise.

Abstract: Provided are the use of glycosyltransferases gGT25, gGT13, gGT30, gGT25-1, gGT25-3, gGT25-5, gGT29, gGT29-3, gGT29-4, gGT29-5, gGT29-6, gGT29-7, 3GT1, 3GT2, 3GT3, 3GT4 and derived polypeptides therefrom in the catalyzed glycosylation of terpenoid compounds and the synthesis of new saponins, wherein the glycosyltransferases can specifically and efficiently catalyze tetracyclic triterpenoid compound substrates at positions C-20 and/or C-6 and/or C-3 during hydroxyl glycosylation, and/or transfer the glycosyl from a glycosyl donor to the first glycosyl of the tetracyclic triterpenoid compounds at position C-3, so as to extend the sugar chain. The glycosyltransferases can also be used for constructing man-made synthetic rare ginsenosides and a variety of new ginsenosides and derivatives thereof.

Abstract: A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.

Abstract: A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.

Abstract: A method to build a 3D model for a physical object includes the following steps. First, depth information of a plurality of images is converted into a plurality of 3D point clouds. Then, the motion parameters of the camera to gather each image relative to a previous image are determined according to the 3D point clouds. Next, a registration energy estimate value of each image's 3D point cloud, as being integrated into a previous image's 3D point cloud, is determined according to corresponding motion parameters. Then, the motion parameters are varied to minimize the estimate value. An optimal camera path is determined according to the varied motion parameters. Finally, a 3D model of the physical object is built according the optimal camera path.

Abstract: A method to build a 3D model for a physical object includes the following steps. First, depth information of a plurality of images is converted into a plurality of 3D point clouds. Then, the motion parameters of the camera to gather each image relative to a previous image are determined according to the 3D point clouds. Next, a registration energy estimate value of each image's 3D point cloud, as being integrated into a previous image's 3D point cloud, is determined according to corresponding motion parameters. Then, the motion parameters are varied to minimize the estimate value. An optimal camera path is determined according to the varied motion parameters. Finally, a 3D model of the physical object is built according the optimal camera path.

Abstract: A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.

Abstract: A printed circuit board is disclosed. The printed circuit board includes a solder mask area and at least one chip attachment area. The at least one chip attachment area has an isolation solder mask layer such that the chip attachment area forms a plurality of chip sub-attachment areas to reduce an area of a solder paste smeared on the chip attachment area, and the isolation solder mask layer has at least one hole.

Abstract: The present invention provides a transistor and method for making the same. The transistor has an yttrium-doped indium oxide transparent conductive thin-film which is so fabricated with the method to reduce the formation of oxygen vacancies, suppress carrier concentration effectively, and decrease maximum defect density and thus suitable to be applied to the transistor.

Abstract: A gun cover with a securing assembly includes a waist plate at an inner side thereof; and an enclosure for defining a gun groove; the enclosure having an inner lateral plate and an outer lateral plate; the inner lateral plate having a through hole for receiving an elastic tenon which protrudes from an interior of the gun groove; the elastic tenon having a press portion; and the press portion being installed between the inner lateral plate and an inner side of the waist plate and projecting out of an upper side of the outer frame.

Abstract: An antenna formed inside a film comprises a thin film, a radiation conductor, a supporter, a conductive paste and at least one contact terminal. The radiation conductor is arranged on the thin film. The supporter is arranged on the radiation conductor with at least one trench formed thereon. The contact terminal has a recession with a hole. The recession is inserted into the trench. The conductive paste is injected into the trench via the hole to have such a thickness that the top of the conductive paste exactly contacts the bottom of the recession. The present invention is characterized in that a conductive paste is used as a conduction medium and a buffer between the contact terminal and the radiation conductor. Thereby, the present invention can overcome the conventional problem that the radiation conductor and thin film are likely to be damaged in the fabrication process.

Abstract: An integrated broadband antenna device with wide band function is disclosed. The antenna device comprises a ground plate, a feeding wire, a first metal radiator, a second metal radiator, a ground metal radiator and a parasitic metal radiator. The first metal radiator is connected with the positive ends of signals of the feeding wire for transmitting electric signals and producing a high frequency mode. The first metal radiator is coupled to and energizes the second metal radiator and the parasitic metal radiator, and then the two metal radiator producing a low frequency mode and a second high frequency mode along with the ground metal radiator obtains a wider bandwidth. The broadband antenna device integrating various kinds of antennas is able to have a enough bandwidth to meet the requirements of AMPS (824˜894 MHz), GSM (880˜960 MHz), GPS (1575 MHz), DCS (1710˜1880 MHz), PCS (1850˜1990 MHz), UMTS (1920˜2170 MHz) and Wi-Fi (2400˜2500 MHz).

Abstract: A gun cover with a securing assembly comprises a waist plate at an inner side thereof; and an enclosure for defining a gun groove; the enclosure having an inner lateral plate and an outer lateral plate; the inner lateral plate having a through hole for receiving an elastic tenon which protrudes from an interior of the gun groove; the elastic tenon having a press portion; the press portion being installed between the inner lateral plate and an inner side of the waist plate and projects out of an upper side of the outer frame.

Abstract: A multi-band antenna with the broadband function is based upon a planar inverted-F antenna with two conductive arms and a ground. The two conductive arms extend from the ground near the two opposite ends of the ground. Two radiation plates of the two conductive arms extend toward each other. The multi-band antenna has a sufficient large band at high frequencies. Since the conductive arms are disposed close to the two ends of the ground, operations of bending the two conductive arms or soldering a feed wires are simpler and have a higher yield.

Abstract: An integrated broadband antenna device with wide band function is disclosed. The antenna device comprises a ground plate, a feeding wire, a first metal radiator, a second metal radiator, a ground metal radiator and a parasitic metal radiator. The first metal radiator is connected with the positive ends of signals of the feeding wire for transmitting electric signals and producing a high frequency mode. The first metal radiator is coupled to and energizes the second metal radiator and the parasitic metal radiator, and then the two metal radiator producing a low frequency mode and a second high frequency mode along with the ground metal radiator obtains a wider bandwidth. The broadband antenna device integrating various kinds of antennas is able to have a enough bandwidth to meet the requirements of AMPS (824˜894 MHz), GSM (880˜960 MHz), GPS (1575 MHz), DCS (1710˜1880 MHz), PCS (1850˜1990 MHz), UMTS (1920˜2170 MHz) and Wi-Fi (2400˜2500 MHz).

Abstract: A multi-band antenna with the broadband function is based upon a planar inverted-F antenna with two conductive arms and a ground. The two conductive arms extend from the ground near the two opposite ends of the ground. Two radiation plates of the two conductive arms extend toward each other. The multi-band antenna has a sufficient large band at high frequencies. Since the conductive arms are disposed close to the two ends of the ground, operations of bending the two conductive arms or soldering a feed wires are simpler and have a higher yield.

Abstract: Provided is an ultra-wideband dipole antenna. In one embodiment, the antenna comprises a first outer sleeve, an intermediate sleeve surrounded by the first outer sleeve, a second outer sleeve above the first outer sleeve, a conductive interconnection interconnected the outer sleeves, and an inner coaxial conductor surrounded by the intermediate sleeve. A distance between the first outer sleeve and the intermediate sleeve can be changed for adjusting the generated capacitance for obtaining a required impedance matching in the resonance mode of an antenna operating bandwidth and an ultra-wideband characteristic. The antenna is particularly suitable for operating in a frequency range of 2.1 GHz to 11.7 GHz.

Abstract: Provided is an ultra-wideband dipole antenna. In one embodiment, the antenna comprises a first outer sleeve, an intermediate sleeve surrounded by the first outer sleeve, a second outer sleeve above the first outer sleeve, a conductive interconnection interconnected the outer sleeves, and an inner coaxial conductor surrounded by the intermediate sleeve. A distance between the first outer sleeve and the intermediate sleeve can be changed for adjusting the generated capacitance for obtaining a required impedance matching in the resonance mode of an antenna operating bandwidth and an ultra-wideband characteristic. The antenna is particularly suitable for operating in a frequency range of 2.1 GHz to 11.7 GHz.