Patents by Inventor Yun ("Frank") Zhang

Yun ("Frank") Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12385636
    Abstract: The present disclosure relates to a liquid fuel self-sustaining combustion burner for flame synthesis, including a swirl-flow cylinder and a stable combustion cylinder. A swirl-flow plate is disposed at an open end of the swirl-flow cylinder and defines swirl-flow outlets. A tangential inlet tube is mounted on the swirl-flow cylinder and in fluid communication with the swirl-flow chamber. An open end of the swirl-flow cylinder extends into the stable combustion chamber. The fuel can be atomized by an atomizer and sprayed into the stable combustion chamber for combustion. Air introduced from the tangential inlet tube can flow into the swirl-flow chamber and advance spirally around the central stabilizing column to reach the swirl-flow plate. The airflow is partially injected into the stable combustion chamber through the swirl-flow outlets, and then continues to spirally advance. An atomizing nozzle of the atomizer is located inside the swirling airflow.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: August 12, 2025
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Shui-Qing Li, Xing Jin, Min-Hang Song, Yi-Yang Zhang, Ze-Yun Wu, Shu-Ting Lei
  • Patent number: 12388061
    Abstract: In one example, a semiconductor structure comprises a frontside substrate comprising a conductive structure, a backside substrate comprising a base substrate and a cavity substrate contacting the base substrate, wherein the backside substrate is over a top side of the frontside substrate and has a cavity and an internal interconnect contacting the frontside substrate, and a first electronic component over the top side of the frontside substrate and in the cavity. The first electronic component is coupled with the conductive structure, and an encapsulant is in the cavity and on the top side of the frontside substrate, contacting a lateral side of the first electronic component, a lateral side of the cavity, and a lateral side of the internal interconnect. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: August 12, 2025
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gi Tae Lim, Jae Yun Kim, Myung Jae Choi, Min Hwa Chang, Mi Kyoung Choi
  • Publication number: 20250249491
    Abstract: The present disclosure provides a chemical supply apparatus of a liquid processing apparatus. The chemical supply apparatus of a liquid processing apparatus may include: a first tank and a second tank storing liquid to be supplied to the substrate processing apparatus; a liquid supply source supplying a chemical to the first tank and the second tank; a main circulation line connected to the first tank and the second tank and supplying liquid to the substrate processing apparatus; and a control unit controlling the tanks and the main circulation line to perform a flushing mode that drains the liquid accommodated in the first tank and the second tank, supplies a flushing liquid to the first tank, collects the flushing liquid to the second tank from the main circulation line, and then drains the flushing liquid.
    Type: Application
    Filed: January 31, 2025
    Publication date: August 7, 2025
    Inventors: Yun Seok JEON, Hyeon Suk PARK, Seon Min KIM
  • Publication number: 20250251621
    Abstract: Wearable devices may include an electronic component and a battery unit for providing power to the electronic component. The battery unit may include a printed circuit board substrate and at least one surface-mounted device (SMD) battery coupled to the printed circuit board substrate. Various other devices, systems, and methods are also disclosed.
    Type: Application
    Filed: January 28, 2025
    Publication date: August 7, 2025
    Inventors: Hyung Gu Yun, Jason Howard, Karthik Kadirvel
  • Publication number: 20250252495
    Abstract: There is provided a method for matching a public technology with a technology consumer, the method being performed by a computing system. The method may comprise acquiring data about the public technology, applying the acquired data to a first machine-learning model to acquire technology feature data about the public technology, wherein the first machine-learning model is configured to output the technology feature data based on the data about the public technology and matching the public technology with at least one technology consumer, based on the technology feature data and a plurality of consumer feature data stored in a database.
    Type: Application
    Filed: February 4, 2025
    Publication date: August 7, 2025
    Applicant: KOREA INSTITUTE OF SCIENCE & TECHNOLOGY INFORMATION
    Inventors: Min Ju KIM, Kuk Jin BAE, Ji Min KIM, Yun Jeong CHOI, Jeong Eun BYUN, Eun Sun KIM, Sung Jin KIM, Ju Yeon SHIN, Min Je CHO, Su Min SEO
  • Publication number: 20250253287
    Abstract: A method includes: forming, on a first substrate, a first bonding layer including a first metal oxide material in an amorphous state; forming, on a second substrate, a second bonding layer including a second metal oxide material in an amorphous state; annealing the first and second bonding layers using a laser source, so as to convert the first and second metal oxide materials to a crystalline state; forming, on the first bonding layer, a third bonding layer including a third metal oxide material in an amorphous state; forming, on the second bonding layer, a fourth bonding layer including a fourth metal oxide material in an amorphous state; bonding the first and second substrates to each other through the first to fourth bonding layers; and annealing the third and fourth bonding layers using a heat source, so as to convert the third and fourth metal oxide materials to a crystalline state.
    Type: Application
    Filed: February 6, 2024
    Publication date: August 7, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Zheng-Yong LIANG, Yu-Yun PENG, Keng-Chu LIN, Wei-Ting YEH
  • Publication number: 20250254857
    Abstract: A semiconductor device includes a plurality of active regions disposed at a substrate, a device isolation layer disposed at the substrate and surrounding each of the plurality of active regions, a supporter pattern surrounded by the device isolation layer and disposed in a space between two active regions of the plurality of active regions, a cell gate structure intersecting the plurality of active regions, the cell gate structure including a gate dielectric layer, a gate electrode on the gate dielectric layer, and a gate capping layer on the gate electrode, and a bit line structure intersecting one of the plurality of active regions and the cell gate structure. A lower surface of the supporter pattern is in contact with the device isolation layer, and an upper surface of the supporter pattern is in contact with the gate electrode.
    Type: Application
    Filed: October 1, 2024
    Publication date: August 7, 2025
    Inventors: Heejae Chae, Yongkwan Kim, Huijung Kim, Hyunjin Lee, Yun Choi
  • Publication number: 20250250575
    Abstract: Described herein are methods of modulating gene transcription using antisense oligonucleotides (ASOs) targeting regulatory RNAs, such as promoter-associated RNAs and enhancer RNAs. These methods are useful for modulating the levels of gene products, for example, increasing expression of Carbamoyl-Phosphatase Synthetase 1 (CPS1), thereby treating diseases associated with aberrant gene expression.
    Type: Application
    Filed: April 28, 2025
    Publication date: August 7, 2025
    Inventors: Alfica Sehgal, Bryan J. Matthews, David A. Bumcrot, Justin A. Caravella, Mario Esteban Contreras Gamboa, Rachana S. Kelkar, Yun Joon Jung, Yuting Liu, Rutuja Sudhakar Pai, Henry Munir Moukheiber, Henry Munir Moukheiber, Yuchun Guo
  • Publication number: 20250253353
    Abstract: Disclosed is an all-solid-state comprising: an anode current collector; a first coating layer disposed on the anode current collector and comprising a first anode active material, a first conductive material, and a first binder; a second coating layer disposed on the first coating layer and comprising a second anode active material, a second conductive material, a solid electrolyte, and a second binder; a solid electrolyte layer disposed on the second coating layer; a cathode layer disposed on the solid electrolyte layer; and a cathode current collector disposed on the cathode layer.
    Type: Application
    Filed: August 29, 2024
    Publication date: August 7, 2025
    Inventors: Yun Sung Kim, Ga Hyeon Im, Kyu Joon Lee, So Young Lee, Hong Seok Min, Yoon Kwang Lee
  • Publication number: 20250254917
    Abstract: In a method of manufacturing a semiconductor device, a fin structure including a lower fin structure and an upper fin structure disposed over the lower fin structure is formed, wherein the upper fin structure includes dielectric layers and multi-film layers alternately stacked, each of the multi-film layers includes a channel layer, a first protection layer and a second protection layer, and the channel layer is between the first protection layer and the second protection layer. A sacrificial gate structure is formed over the upper fin structure. A source/drain epitaxial layer is formed over a source/drain region of the fin structure after forming the sacrificial gate structure over the upper fin structure. The sacrificial gate structure is removed after forming the source/drain epitaxial layer. The dielectric layers are removed after removing the sacrificial gate structure. A gate structure is formed around the multi-film layers.
    Type: Application
    Filed: February 6, 2024
    Publication date: August 7, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Sheng Yun, Shao-Ming Yu, Yun-Yan Chung, Tung-Ying Lee, Chao-Ching Cheng
  • Publication number: 20250253322
    Abstract: A composition for a lithium metal protective layer includes an organic solvent comprising nitromethane and dimethoxyethane, and lithium nitrate (LiNO3). A content of nitromethane is in a range from 30 wt % to 70 wt % based on a total weight of the organic solvent. In a method of fabricating a lithium electrode, a protective layer is formed on a surface of a lithium metal layer by immersing the lithium metal layer in the composition for a lithium metal protective layer.
    Type: Application
    Filed: January 16, 2025
    Publication date: August 7, 2025
    Inventors: Seong Jin PARK, Yun Sun CHO, Dong Won KIM, Hyo Jin KIM, Ye Eun PARK, Hui Tae SIM, Myung Keun OH
  • Publication number: 20250253477
    Abstract: Disclosed are a battery pack and a vehicle including the same. A battery pack according to an embodiment of the present disclosure includes a battery assembly including a plurality of cell units; and a pack case accommodating the battery assembly in the internal space, wherein each cell unit includes at least one battery cell and a cell cover at least partially surrounding the outside of the at least one battery cell, wherein a venting space is provided between the cell cover and the battery cell.
    Type: Application
    Filed: July 11, 2023
    Publication date: August 7, 2025
    Applicant: LG Energy Solution, Ltd.
    Inventors: Jin Yong Park, Woo-Yong Kwon, Myung-Woo Lee, Seung-Joon Kim, In-Soo Kim, Se-Yun Chung, Ho-June Chi, Hyun-Mo Yoon
  • Publication number: 20250253817
    Abstract: Provided is a single differential-based balanced amplifier including one differential amplifier configured to receive a first differential input signal and a second differential input signal having a phase difference of 180 degrees from the first differential input signal, and output a first differential output signal at a first output terminal and a second differential output signal at a second output terminal, a phase delay circuit configured to receive the first differential output signal, and output a third differential output signal obtained by adjusting a phase of the first differential output signal relative to the second differential output signal by 90 degrees, and a hybrid coupler configured to receive the second differential output signal at a first port, receive a third differential output signal at a third port, and output, at a second port, an in-phase signal in which RF power of the second differential output signal and the third differential output signal are combined in phase.
    Type: Application
    Filed: January 2, 2025
    Publication date: August 7, 2025
    Inventors: Hanwoong Choi, Geonho Park, Hyunchul Park, Jongwon Yun, Joonhoi Hur
  • Publication number: 20250255098
    Abstract: A display apparatus includes a display element including an emission area, a thin-film encapsulation layer disposed on the display element, a first insulating layer disposed on the thin-film encapsulation layer, the first insulating layer including an opening that corresponds to the emission area, and a refraction area defined by the opening and including an organic material, and a second insulating layer disposed on the first insulating layer, filling the refraction area, and having a refractive index greater than a refractive index of the first insulating layer, wherein the display element includes a first display element and a second display element, and the refraction area has a circular shape or an elliptical shape in a plan view and includes a first refraction area corresponding to the first display element and a second refraction area corresponding to the second display element.
    Type: Application
    Filed: March 27, 2025
    Publication date: August 7, 2025
    Applicant: Samsung Display Co., Ltd.
    Inventors: Miran JI, Hyeonbum LEE, Chiwook AN, Haeyoung YUN
  • Publication number: 20250254427
    Abstract: The present application provides an anti-shake mechanism and a camera module, and the anti-shake mechanism includes an anti-shake circuit board and a flexible sheet arranged on the outside of the anti-shake circuit board. The anti-shake circuit board and the flexible sheet are partially overlapped, and the flexible sheet has an asymmetric structure. The flexible sheet includes a first main body and a first folded edge, and the anti-shake circuit board includes a second main body, a second folded edge, and an electrical connection portion. The second folded edge is provided in correspondence with a part of the first folded edge, a stiffness compensation structure is provided, and a connecting region between the first folded edge and the second folded edge is at least partially adherent. The anti-shake mechanism optimizes the structures, improves the overall structural stability, reduces the production cost, and improves the optical anti-shake performance.
    Type: Application
    Filed: June 13, 2024
    Publication date: August 7, 2025
    Inventors: Zhang Ren, Yun Tang, Wei Song, Suntong Zhou
  • Publication number: 20250250279
    Abstract: The present invention relates to a method for synthesis of 3-phenyl-2,3,4,8,9,10-hexahydropyrano[2,3-f]chromene derivatives.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 7, 2025
    Applicant: GLACEUM INC.
    Inventors: Sang Ku YOO, Jeong Ho LIM, Ku Suk KANG, Jin Young KIM, Jung Woo LEE, Jae Jeong YUN
  • Publication number: 20250249811
    Abstract: A headrest for a seat of a vehicle includes a body portion disposed above a backrest portion; a support portion disposed in front of the body portion; and an air cell disposed on the support portion, where a volume of the air cell expands toward a front of the headrest, and the support portion is configured to be slidably movable along the body portion.
    Type: Application
    Filed: June 24, 2024
    Publication date: August 7, 2025
    Inventors: Tae Hee Won, Yun Ho Kim, Jun Ho Lee, Da Hye Moon, Hae Il Jeong, Hyun Kim
  • Publication number: 20250252028
    Abstract: An on-device artificial intelligence (AI) processing distributed processing device and method capable of distributing AI processing load of a terminal through internal or external other devices are provided. The on-device AI processing distributed processing device can, measure an amount of AI processing for performing the user command, select an AI processing distributed processing target when the measured amount of AI processing exceeds a self-processing capacity, request distributed process for AI processing to the selected AI processing distributed processing target, and when a first AI processing result value is received from the AI processing distributed processing target, provide a final result value based on the first AI processing result value and a self-processed second AI processing result value.
    Type: Application
    Filed: January 31, 2025
    Publication date: August 7, 2025
    Applicant: LX SEMICON CO., LTD.
    Inventor: Yun Tae LEE
  • Publication number: 20250252074
    Abstract: A memory module includes a substrate, an allocator, memory cluster packages and serial communication lanes. The allocator is mounted on the substrate, and communicates with an external device through a CXL interface. The memory cluster packages are mounted on the substrate, and are controlled by the allocator. Each of the memory cluster packages includes memories and a memory controller. The serial communication lanes are disposed on the substrate for communications between the allocator and the memory cluster packages. A first memory cluster package communicates with the allocator through a first serial communication lane and the serial interface. A second memory cluster package communicates with the first memory cluster package through a second serial communication lane and the serial interface.
    Type: Application
    Filed: January 10, 2025
    Publication date: August 7, 2025
    Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Yongsuk Kwon, Jungho Ahn, Sungmin Yun, Kyungsoo Kim, Jinin So, Jonggeon Lee
  • Publication number: 20250253288
    Abstract: A semiconductor device includes a first Chip-On-Wafer (CoW) device having a first interposer and a first die attached to a first side of the first interposer; a second CoW device having a second interposer and a second die attached to a first side of the second interposer, the second interposer being laterally spaced apart from the first interposer; and a redistribution structure extending along a second side of the first interposer opposing the first side of the first interposer and extending along a second side of the second interposer opposing the first side of the second interposer, the redistribution structure extending continuously from the first CoW device to the second CoW device.
    Type: Application
    Filed: April 22, 2025
    Publication date: August 7, 2025
    Inventors: Jiun Yi Wu, Chen-Hua Yu, Shang-Yun Hou