Abstract: A method and an apparatus for separating speeches based on local and global modeling network (LAGNet) are provided. A speech separation apparatus includes an encoder configured to progressively compress a sequence of mixed speeches by using a one-dimensional convolution-based local block to generate local information, a bottleneck configured to generate global information by using a multiple self attention-based global block, and a decoder configured to progressively reconstruct the sequence by using the local block. A speech separation apparatus also utilizes a skip connection that includes gates configured to filter the local information by using the global information.

Abstract: An indoor air cleaning apparatus for a vehicle including an HVAC module configured to regulate the temperature of indoor and outdoor air and provide conditioned air into the interior of the vehicle through a blower, and a moss filter module, connected to the HVAC module, having air-purifying plants planted therein, and configured to allow oxygen generated therein to flow to the HVAC module as indoor air is introduced thereinto through a plurality of intake ports.

Abstract: A touch detection method, suitable for a touch display panel including touch sensing columns, includes following steps. The touch sensing columns are grouped in a first order during a first frame. The touch sensing columns grouped in the first order are scanned for detecting a first touched column during the first frame. The touch sensing columns are grouped in a second order during a second frame. The second order is assigned according to the first touched column. The first touched column and adjacent columns next to the first touched column are grouped together in one group in the second order. The touch sensing columns grouped in the second order are scanned for detecting a second touched column during the second frame.

Abstract: Some implementations described herein provide a bonding tool having a top bonding fixture that includes an inflatable forcing structure (e.g., a gas bag). When pressurized, the inflatable forcing structure has a curved surface that protrudes from an under side of the top bonding fixture to deform a top semiconductor substrate during a bonding operation. A rate of inflation and/or a pressure within the inflatable forcing structure may be controlled to distribute a force more evenly in a bond region of the semiconductor substrate relative to another bonding tool having another top bonding fixture including a striker pin.

Abstract: Semiconductor devices and methods for forming semiconductor devices are provided. A method includes forming a shallow trench isolation (STI) feature; forming a mask layer over the STI feature; depositing sacrificial material over the mask layer; and etching the sacrificial material to form sacrificial structures over the mask layer, wherein the mask layer prevents etching of the STI feature while etching the sacrificial material.

Abstract: A method for forming a three-dimensional memory device includes forming a memory stack structure which has alternately stacked conductive layers and dielectric layers on a substrate, performing a trim-etching process to form a staircase structure on the memory stack structure, wherein a sidewall of the conductive layer of each step of the staircase structure is recessed from a sidewall of the dielectric layer over the conductive layer to form a recess that exposes a bottom surface of a step nosing portion of the dielectric layer, and forming a plurality of word line contact plugs which respectively extend through one of the dielectric layers of the staircase structure, wherein at least one of the word line contact plugs has a first bottom surface directly contacting a top surface of one of the conductive layers and a second bottom surface directly contacting a top surface of one of the step nosing portions.

Abstract: The disclosed apparatus is configured to include (i) a shield can configured to reduce electromagnetic interference between components inside the shield can and components outside the shield can; (ii) a physical processor inside the shield can that includes a first region and a second region; and (iii) one or more spacer pads situated between and in contact with the shield can and the first region, but not in contact with the second region. Various other embodiments and modifications are also disclosed.

Abstract: An electronic device and a method for forming the same are provided. The method comprises: providing a substrate having a front surface, wherein the substrate comprising at least a non-polar material; providing at least one electronic component with solder bumps mounted on its back surface, wherein the solder bumps are coated with a flux material of at least a polar material, and the at least one electronic component comprises at least a non-polar material; disposing the at least one electronic component onto the front surface of the substrate via the solder bumps; and applying microwave radiation to the at least one electronic component to heat the solder bumps through the flux material.

Abstract: An electronic package and a method for forming the same are provided. The method comprises: providing a substrate having a front surface and a back surface, wherein at least one electronic component is attached onto the front surface of the substrate, and the substrate comprises at least a non-polar material; forming a mold cap on the front surface of the substrate to encapsulate the at least one electronic component; loading the substrate onto a susceptor, wherein the susceptor comprises at least a polar material; and applying microwave radiation to the mold cap and the susceptor to cure the mold cap at least partially through the susceptor.

Abstract: Semiconductor-on-insulator (SOI) structures with variable resistivity epitaxial semiconductor layers and methods of making the same are disclosed. The SOI structures may include customized resistivity profiles without changing the epitaxial structure of vendor-supplied base materials or requiring the development of new etching chemistries. An SOI structure may be formed by forming a second epitaxial semiconductor layer over a first epitaxial semiconductor layer on a first substrate, where the resistivity of the second epitaxial semiconductor layer is different than the resistivity of the first epitaxial semiconductor layer, forming a dielectric capping layer over the second epitaxial semiconductor layer, bonding the dielectric capping layer to a second dielectric capping layer on a second substrate, and removing the first substrate to provide the SOI structure. An optional third epitaxial semiconductor layer may be formed over the first epitaxial semiconductor layer.

Abstract: A positioning system and a positioning method of tire pressure sensor and a vehicle are provided. The vehicle includes a plurality of wheels, each wheel is provided with a tire pressure sensor. The positioning system includes a plurality of positioning devices arranged in the vehicle, each positioning device is configured to receive a plurality of Bluetooth signals from the tire pressure sensors, and obtain a set of positioning data according to the Bluetooth signals; and a receiving device configured to determine a matching relationship between the tire pressure sensors and the wheels according to preset positions of the positioning devices and the sets of positioning data, to locate the tire pressure sensors on the vehicle.

Abstract: A floating joint and retainer connection device includes a fixed retainer internally defines a receiving space; an adaptor joint having an end extending through the receiving space to an outer side of the fixed retainer and an axially limiting section formed near another end; a fixing element fitted on the adaptor joint and located outside the fixed retainer for limiting the adaptor joint from moving axially while allowing the adaptor joint to displace radially relative to the fixed retainer; a rolling assembly disposed adjoining the fixed retainer; and a spring located in the receiving space and fitted on the adaptor joint with two ends pressed against the axially limiting section and the fixed retainer or the rolling assembly. When the rolling assembly rolls to displace radially relative to the fixed retainer, a radial frictional force produced by a normal force applied by the spring to the fixed retainer is reduced.

Abstract: The present invention relates to a powder for growing a gallium oxide single crystal and a method of manufacturing the same, and the powder for growing a gallium oxide single crystal according to an embodiment of the present invention is made of gallium oxide and has a bulk density of 0.7 g/cm3 or more and 1.0 g/cm3 or less.

Abstract: System and methods for managing and tracking hardware assets for a telecommunications network. A set of hardware asset records is maintained in a database table, each hardware asset record corresponding to a hardware asset of a telecommunications service provider. To update hardware asset records, a set of hardware asset objects is received from one or more operations support systems (OSSs) of the telecommunications service provider. Parameters are extracted from the hardware asset objects and compared to parameters in the hardware asset records. When a changed parameter is identified, the hardware asset record is updated to reflect the changed parameter.

Abstract: An optical lens assembly includes, in order from an object side to an image side: a first lens with negative refractive power; a second lens with negative refractive power; a third lens with positive refractive power; a stop; a fourth lens with positive refractive power; a fifth lens with negative refractive power; and a sixth lens with positive refractive power. Half of a maximum field of view of the optical lens assembly is HFOV, an entrance pupil diameter of the optical lens assembly is EPD, a distance from an object-side surface of the first lens to an image plane along an optical axis is TL, a central thickness of the fifth lens along the optical axis is CTS, a radius of curvature of an image-side surface of the fifth lens is R10. Following conditions are satisfied: 3.81 deg.<HFOV*EPD/TL<6.24 deg. and ?1.9 mm2<CT5*R10<?0.2 mm2.

Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.

Abstract: Provided is a method for treating a SARS-CoV2 3CLpro-related disease in a subject in need thereof by blocking dimerization of 3C-like main protease (3CLpro) of the SARS-CoV2, including administering to the subject a first agent which binds to a first binding site of a SARS-CoV2 3CLpro complex and a second agent which binds to a second binding site of the SARS-CoV2 3CLpro complex, wherein the first binding site and the second binding site are functionally different sites in the three-dimensional structure of the SARS-CoV2 3CLpro complex. Also provided is a pharmaceutical combination including the first agent and the second agent for suppressing SARS-CoV2, thereby alleviating COVID-19.

Abstract: The detection and identification of unmanned aerial vehicles (UAVs) from a radio wave measurement result based on artificial intelligence (AI) are provided. A method of operating an apparatus to detect unmanned aerial vehicles (UAVs) includes generating a spectrogram, determining a first region to find a direction of the UAVs in the spectrogram, determining a direction of a first UAV of the UAVs based on signal values in the first region, determining a second region to identify a type of the first UAV in the spectrogram, and identifying the type of the first UAV based on signal values in the second region.

Abstract: An audio output device is provided. The audio output device includes a speaker, a case surrounding the speaker and including a first opening connected to the resonance space within the case, a plurality of air adsorbents disposed within the speaker, an adhesive member disposed on the first opening and including a second opening overlapping the first opening, and a mesh layer disposed on the adhesive member and covering the second opening. A diameter of the first opening is larger than a diameter of each of the plurality of air adsorbents, and a diameter of the second opening is smaller than the diameter of the first opening.