Abstract: A pixel array substrate includes a substrate, first signal lines, second signal lines, active elements, pixel electrodes, selection lines, a driving unit, and metal lines. Each selection line is intersected with the first signal lines to form a first intersection and second intersections. Each selection line is electrically connected to the first signal line at the first intersection and electrically insulated to the first signal lines at the second intersections. Each selection line has a first portion and a second portion. The first portion is overlapped with the first signal line at the first intersection and separated from the second portion by a gap. The driving unit is electrically connected to the second signal lines and the first portions of the selection lines. Each metal line is overlapped with one of the gaps.

Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: A pixel array substrate includes a substrate, first signal lines, second signal lines, active elements, pixel electrodes, selection lines, a driving unit, and metal lines. Each selection line is intersected with the first signal lines to form a first intersection and second intersections. Each selection line is electrically connected to the first signal line at the first intersection and electrically insulated to the first signal lines at the second intersections. Each selection line has a first portion and a second portion. The first portion is overlapped with the first signal line at the first intersection and separated from the second portion by a gap. The driving unit is electrically connected to the second signal lines and the first portions of the selection lines. Each metal line is overlapped with one of the gaps.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: A circuit includes a fuse cell, a sense circuit and an output control circuit. The fuse cell includes an electrical fuse. The sense circuit is electrically coupled to the fuse cell and configured for generating a sense signal indicative of a programmed condition of the electrical fuse, at an output of the sense circuit. The output control circuit is electrically coupled to the output of the sense circuit, and the output control circuit is configured for latching the sense signal indicative of the electrical fuse having been programmed, during a read operation of the fuse cell.

Abstract: A fuse structure comprises a first conductive layer on a first level. The first conductive layer comprises a fuse line extending in a first direction. The fuse line has a first end portion, a second end portion opposite the first end portion, and a fuse link portion connecting the first end portion and the second end portion. The first conductive layer also comprises lines parallel to the fuse line, the lines being aligned in the first direction and being separated from one another by a first distance measured in the first direction. The fuse structure also comprises a second conductive layer on a second level different from the first level and coupled with the first conductive layer. The second conductive layer has parallel lines extending in a second direction, the parallel lines being separated by a second distance measured in a third direction orthogonal to the second direction.

Abstract: A fuse structure comprises a first conductive layer on a first level. The first conductive layer comprises a fuse line extending in a first direction. The fuse line has a first end portion, a second end portion opposite the first end portion, and a fuse link portion connecting the first end portion and the second end portion. The first conductive layer also comprises lines parallel to the fuse line, the lines being aligned in the first direction and being separated from one another by a first distance measured in the first direction. The fuse structure also comprises a second conductive layer on a second level different from the first level and coupled with the first conductive layer. The second conductive layer has parallel lines extending in a second direction, the parallel lines being separated by a second distance measured in a third direction orthogonal to the second direction.

Abstract: A circuit board including a first patterned conductive layer and a second patterned conductive layer isolated from the first patterned conductive layer is provided. The first patterned conductive layer has first signal traces and first ground traces. The second patterned conductive layer has second signal traces and second ground traces. An orthogonal projection of the second ground trace on the first patterned conductive layer partially overlaps at least one of the first signal traces. An orthogonal projection of the first ground trace on the second patterned conductive layer partially overlaps at least one of the second signal traces. An electronic assembly including the afore-described circuit board and a chip package connected thereto is also provided.

Abstract: A method includes, by a first circuit, converting a plurality of bits in a first format to a second format. The plurality of bits in the second format is used, by a second circuit, to program a plurality of memory cells corresponding to the plurality of bits. The first format is a parallel format. The second format is a serial format. The first circuit and the second circuit are electrically coupled together in a chip. In some embodiments, the plurality of bits includes address information, cell data information, and program information of a memory cell that has an error. In some embodiments, the plurality of bits includes word data information of a word and error code and correction information corresponding to the word data information of the word.

Abstract: A circuit board including a first patterned conductive layer and a second patterned conductive layer isolated from the first patterned conductive layer is provided. The first patterned conductive layer has first signal traces and first ground traces. The second patterned conductive layer has second signal traces and second ground traces. An orthogonal projection of the second ground trace on the first patterned conductive layer partially overlaps at least one of the first signal traces. An orthogonal projection of the first ground trace on the second patterned conductive layer partially overlaps at least one of the second signal traces. An electronic assembly including the afore-described circuit board and a chip package connected thereto is also provided.

Abstract: A circuit includes a fuse cell, a sense circuit and an output control circuit. The fuse cell includes an electrical fuse. The sense circuit is electrically coupled to the fuse cell and configured for generating a sense signal indicative of a programmed condition of the electrical fuse, at an output of the sense circuit. The output control circuit is electrically coupled to the output of the sense circuit, and the output control circuit is configured for latching the sense signal indicative of the electrical fuse having been programmed, during a read operation of the fuse cell.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: The embodiments of methods and structures disclosed herein provide mechanisms of forming and programming a metal-via fuse. The metal-via fuse and a programming transistor form a one-time programmable (OTP) memory cell. The metal-via fuse has a high resistance and can be programmed with a low programming voltage, which expands the programming window.

Abstract: The embodiments of methods and structures disclosed herein provide mechanisms of forming and programming a metal-via fuse. The metal-via fuse and a programming transistor form a one-time programmable (OTP) memory cell. The metal-via fuse has a high resistance and can be programmed with a low programming voltage, which expands the programming window.