Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) chip comprising a front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV), as well as a method for forming the IC chip. In some embodiments, a semiconductor layer overlies a substrate. The semiconductor layer may, for example, be or comprise a group III-V semiconductor and/or some other suitable semiconductor(s). A semiconductor device is on the semiconductor layer, and a FEOL layer overlies the semiconductor device. The FEOL TSV extends through the FEOL layer and the semiconductor layer to the substrate at a periphery of the IC chip. An intermetal dielectric (IMD) layer overlies the FEOL TSV and the FEOL layer, and an alternating stack of wires and vias is in the IMD layer.

Abstract: The present disclosure relates to a transistor device. The transistor device includes a plurality of first source/drain contacts disposed over a substrate. A plurality of gate structures are disposed over the substrate between the plurality of first source/drain contacts. The plurality of gate structures wrap around the plurality of first source/drain contacts in a plurality of closed loops. A second source/drain contact is disposed over the substrate between the plurality of gate structures. The second source/drain contact continuously wraps around the plurality of gate structures as a continuous structure.

Abstract: In some embodiments, the present disclosure relates to a semiconductor device. The semiconductor device includes a channel layer disposed over a base substrate, and an active layer disposed on the channel layer. A source contact and a drain contact are over the active layer and are laterally spaced apart from one another along a first direction. A gate electrode is arranged on the active layer between the source contact and the drain contact. A passivation layer is arranged on the active layer and laterally surrounds the source contact, the drain contact, and the gate electrode. A conductive structure is electrically coupled to the source contact and is disposed laterally between the gate electrode and the source contact. The conductive structure extends along an upper surface and a sidewall of the passivation layer.

Abstract: In some embodiments, the present disclosure relates to a high voltage device that includes a substrate comprising a first semiconductor material. A channel layer that comprises a second semiconductor material is arranged over the substrate. An active layer that comprises a third semiconductor material is arranged over the channel layer. Over the active layer is a source contact spaced apart from a drain contact. A gate structure is arranged laterally between the source and drain contacts and over the active layer to define a high electron mobility transistor (HEMT) device. Between the gate structure and the source contact is a cap structure, which is coupled to the source contact and laterally spaced from the gate structure. The cap structure and a gate electrode of the gate structure comprise a same material.

Abstract: In some embodiments, the present disclosure relates to a transistor device. The transistor device that includes a source contact disposed over a substrate. The source contact has a first side and an opposing second side disposed between a first end and an opposing second end. A drain contact is disposed over the substrate and is separated from the source contact along a first direction. A gate structure is disposed over the substrate between the source contact and the drain contact. The gate structure extends along the first side of the source contact facing the drain contact and also wraps around the first end and the opposing second end of the source contact.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) chip comprising a front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV), as well as a method for forming the IC chip. In some embodiments, a semiconductor layer overlies a substrate. The semiconductor layer may, for example, be or comprise a group III-V semiconductor and/or some other suitable semiconductor(s). A semiconductor device is on the semiconductor layer, and a FEOL layer overlies the semiconductor device. The FEOL TSV extends through the FEOL layer and the semiconductor layer to the substrate at a periphery of the IC chip. An intermetal dielectric (IMD) layer overlies the FEOL TSV and the FEOL layer, and an alternating stack of wires and vias is in the IMD layer.

Abstract: Various embodiments of the present disclosure are directed toward an integrated chip including an undoped layer overlying a substrate. A first barrier layer overlies the undoped layer. A doped layer overlies the first barrier layer. Further, a second barrier layer overlies the first barrier layer, where the second barrier layer is laterally offset from a perimeter of the doped layer by a non-zero distance. The first and second barrier layers comprise a same III-V semiconductor material. A first atomic percentage of a first element within the first barrier layer is less than a second atomic percentage of the first element within the second barrier layer.

Abstract: In some embodiments, the present disclosure relates to a high voltage device that includes a substrate comprising a first semiconductor material. A channel layer that comprises a second semiconductor material is arranged over the substrate. An active layer that comprises a third semiconductor material is arranged over the channel layer. Over the active layer is a source contact spaced apart from a drain contact. A gate structure is arranged laterally between the source and drain contacts and over the active layer to define a high electron mobility transistor (HEMT) device. Between the gate structure and the source contact is a cap structure, which is coupled to the source contact and laterally spaced from the gate structure. The cap structure and a gate electrode of the gate structure comprise a same material.

Abstract: Activation of a release button is detected, where the release button is to separate a tablet computing device from a docking station while a mass storage device of the docking station is performing an operation. In response to the detection, a warning message is generated.

Abstract: Activation of a release button is detected, where the release button is to separate a tablet computing device from a docking station while a mass storage device of the docking station is performing an operation. In response to the detection, power is maintained to the mass storage device from a battery of the docking station to complete the operation.

Abstract: Activation of a release button is detected, where the release button is to separate a tablet computing device from a docking station while a mass storage device of the docking station is performing an operation. In response to the detection, power is maintained to the mass storage device from a battery of the docking station to complete the operation.